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HomeProductsConnectors, InterconnectsD-Sub Connector Assemblies638-078-630-049
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638-078-630-049 - EDAC Inc.

Manufacturer Part Number
638-078-630-049
Manufacturer
EDAC Inc.
Allelco Part Number
98D-638-078-630-049
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,304 pcs available, New & Original
Parts Description
CONN D-SUB HD RCPT 78P VERT SLDR
Package
Tray
Data sheet
638-078-630-049.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 39304
  • Unit Price: $12.606
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $12.606 $12.61
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

638-078-630-049 Tech Specifications
EDAC Inc. - 638-078-630-049 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 638-078-630-049

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Wire Gauge -
Voltage Rating -
Termination Solder
Shell Size, Connector Layout 5 (DD, D) High Density
Shell Material, Finish Steel, Nickel Plated
Series 638
Package Tray
Operating Temperature -55°C ~ 85°C
Number of Rows 4
Number of Positions 78
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Ingress Protection -
Product Attribute Attribute Value
Flange Feature Housing/Shell (4-40)
Features Shielded
Dielectric Material Polyester Thermoplastic
Current Rating (Amps) 3A per Contact
Contact Type Signal
Contact Material Copper Alloy
Contact Form -
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Connector Type Receptacle, Female Sockets
Connector Style D-Sub, High Density
Color Black
Base Product Number 638-078
Backset Spacing -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the 638-078-630-049 and standard D-Sub connectors in terms of contact density and layout?
The 638-078-630-049 is a high-density D-Sub receptacle with 78 positions arranged in 4 rows, compared to traditional D-Sub connectors that typically use 2 or 3 rows with 25 or 37 positions. This 4-row configuration allows the 638-078-630-049 to maintain the DD/D shell size (5 designation) while achieving higher signal routing capacity per connector footprint. The density increase reduces overall board space requirements in applications requiring numerous parallel signal channels, making the 638-078-630-049 suitable for test equipment, industrial control systems, and data acquisition platforms where connector miniaturization is a design constraint.
Can the 638-078-630-049 handle high-current applications, and what derating should be considered in thermal design?
The 638-078-630-049 is rated for 3 amperes per individual contact, which is suitable for logic-level and moderate-power signal distribution but not for primary power delivery. In practical applications, the 638-078-630-049 should be derated when multiple contacts carry simultaneous current, as heat dissipation within the shielded housing can create localized temperature gradients. For designs approaching full 78-contact utilization with currents near 3A per contact, thermal modeling should account for the -55°C to 85°C operating range and the gold contact finish's relatively low thermal mass. Layouts should distribute high-current pins toward the housing perimeter and avoid clustering multiple max-current contacts adjacent to thermally sensitive components.
How does the gold contact finish thickness of the 638-078-630-049 affect wear resistance and mating cycle life?
The 638-078-630-049 specifies 30.0 microinches (0.76 micrometers) of gold plating over the copper alloy contact substrate. This thickness is within industry standard for general-purpose signal connectors and provides adequate corrosion resistance and low contact resistance for the life of the connector. However, the relatively thin gold layer means that aggressive insertion/extraction cycles or high-friction mating scenarios can accelerate wear. For applications requiring thousands of mating cycles, the 638-078-630-049 should be paired with keyed or polarized mates to prevent misalignment wear patterns. In environments with corrosive atmospheres, the gold finish on the 638-078-630-049 will preserve contact integrity longer than bare copper or tin plating, though the underlying copper alloy remains the primary structural material.
Is the 638-078-630-049 suitable for high-speed differential signaling, and what signal integrity considerations apply?
The 638-078-630-049 is a shielded high-density D-Sub receptacle designed for signal integrity in legacy and industrial applications, but its 4-row layout and solder termination introduce crosstalk and impedance considerations for high-speed differential pairs. The 638-078-630-049 lacks controlled impedance specifications, making it inappropriate for multi-gigabit serial protocols (PCIe, USB 3.x, Thunderbolt) without significant circuit-level compensation. For moderate-speed applications below 100 MHz, the shielding in the 638-078-630-049 provides adequate EMI rejection. Applications using the 638-078-630-049 for differential signals should implement series termination resistors and place shield returns at multiple points to minimize ground bounce and maintain signal fidelity across the 78-contact population.
What is the mechanical durability advantage of the nickel-plated steel shell on the 638-078-630-049 compared to plastic housings?
The 638-078-630-049 uses a steel shell with nickel plating that resists deformation under mechanical stress and repeated mating forces. Unlike plastic housings, the nickel-plated steel shell of the 638-078-630-049 maintains dimensional stability across the full -55°C to 85°C operating range, preventing alignment drift during thermal cycling. The nickel finish provides corrosion resistance in industrial environments with moisture, salt spray, or chemical exposure. However, the steel construction of the 638-078-630-049 adds mass compared to plastic alternatives, which affects system weight in portable applications. The 4-40 housing/shell flange on the 638-078-630-049 allows robust mechanical fastening, critical for vibration-prone applications such as automotive test stands or aerospace ground support equipment.
How does the polyester thermoplastic dielectric material in the 638-078-630-049 perform in high-temperature excursions and humidity exposure?
The 638-078-630-049 uses polyester thermoplastic for insulation and contact retention, rated to 85°C continuous operation. Polyester exhibits good dimensional stability and moisture resistance up to UL94 V-0 flammability classification, as specified for the 638-078-630-049. However, polyester's dielectric properties degrade gradually above 80°C, causing slight expansion of the insulation body and potential contact resistance changes. The MSL-1 (Unlimited) moisture sensitivity level of the 638-078-630-049 indicates excellent resistance to humid storage conditions without baking requirements. In field applications, the 638-078-630-049 maintains electrical performance in humid tropical environments, but long-term exposure to sustained 85°C temperatures combined with >90% relative humidity may cause creep in the polyester matrix, requiring thermal stress relief periods in demanding applications.
What solder termination process parameters should be validated for the 638-078-630-049 to ensure reliable assembly?
The 638-078-630-049 receptacle uses solder termination pins designed for wave or selective soldering processes. Assembly validation should confirm that peak solder temperature does not exceed 260°C for more than 10 seconds to prevent thermal damage to the polyester dielectric in the 638-078-630-049. The 78-position density of the 638-078-630-049 requires careful solder flow patterns to prevent bridging between adjacent pins, particularly in the center rows. Thermal profiling of the 638-078-630-049 should verify that all contact leads reach minimum 240°C for adequate solder reflow while monitoring the steel shell and polyester housing for warping. Post-solder cleaning must use compatible solvents to avoid residual flux within the 638-078-630-049 cavity, which can cause long-term insulation resistance degradation.
How should the 638-078-630-049 be positioned in a mating strategy to minimize EMI in shielded cable assemblies?
The shielded 638-078-630-049 receptacle should have its shield connected to the mating plug's shield via a continuous cable shield with multiple grounding points at the connector backshell. The 638-078-630-049's 4-row arrangement allows strategic placement of ground and return lines adjacent to high-speed or sensitive signal rows to reduce loop area and EMI coupling. In systems where multiple 638-078-630-049 connectors are used in proximity, adequate spacing (minimum 50 mm) prevents cross-coupling between adjacent assemblies. The 638-078-630-049 should be located away from high-current traces and switching power supplies, with shield grounding implemented at both ends of the cable to form a complete Faraday enclosure around signal paths.
What are the RoHS3 compliance boundaries for the 638-078-630-049, and how do exemptions affect component selection for aerospace applications?
The 638-078-630-049 is marked ROHS3 Compliant, indicating compliance with EU Directive 2011/65/EU and its amendments, with exemptions for certain lead-based solders and high-melting-point lead applications. The gold contact finish and copper alloy substrate of the 638-078-630-049 contain no restricted substances listed in the RoHS3 annexes. For aerospace and defense procurement using the 638-078-630-049, verify that the supplier's ROHS3 declaration aligns with AS9120 or equivalent aerospace quality standards, as commercial RoHS3 certification does not automatically satisfy aerospace material traceability requirements. The REACH Unaffected status of the 638-078-630-049 simplifies European supply chain documentation but does not exempt end-users from REACH Article 33 substance notification obligations if the 638-078-630-049 is used in articles subject to SVHC concentration thresholds.
How should the 638-078-630-049 be stored and handled to maintain contact resistance and prevent premature oxidation?
The 638-078-630-049 should be stored in its original tray packaging (as supplied) in a climate-controlled environment at 16–35°C and 20–65% relative humidity to prevent corrosion of the gold-plated contacts and nickel-plated shell. The MSL-1 rating of the 638-078-630-049 eliminates baking requirements, but contact resistance can increase over extended storage if the 638-078-630-049 is exposed to atmospheric sulfides or other reactive pollutants. Before assembly, visually inspect the 638-078-630-049 contacts for tarnishing or discoloration; light oxidation can be removed with dry brushing, but heavy oxidation indicates improper storage and requires component replacement. Handle the 638-078-630-049 by the shell only, avoiding contact with pin surfaces to prevent fingerprint residue buildup, which can increase contact resistance over thermal cycling.
What connector retention features does the 638-078-630-049 provide, and how do they compare to latching D-Sub alternatives?
The 638-078-630-049 does not specify integrated mechanical latches in its receptacle design; retention relies on the mating plug's engagement force and the mechanical friction between shells. This design approach in the 638-078-630-049 reduces assembly complexity and cost but requires careful mating alignment to prevent pin damage. For applications requiring positive mechanical locking, a panel-mount bracket with captive fasteners can secure the 638-078-630-049 to equipment housings, preventing accidental disconnection during vibration or transport. The 4-40 housing/shell flange on the 638-078-630-049 accommodates such external retention hardware. Latching alternatives (not specified in the 638-078-630-049) introduce additional parts and assembly steps but provide redundant security for mission-critical connections.
Can the 638-078-630-049 be used in automotive applications, and what environmental qualification is required?
The 638-078-630-049 is not inherently designed for automotive applications and lacks automotive-specific certifications (AEC-Q200 for connectors). However, the -55°C to 85°C operating range and nickel-plated steel shell of the 638-078-630-049 provide baseline environmental tolerance for stationary automotive test equipment or non-safety-critical diagnostic interfaces. For actual in-vehicle use of the 638-078-630-049, application-specific reliability testing must validate that the 638-078-630-049 meets automotive moisture ingress, thermal cycling, and vibration requirements per ISO 16750-3 or equivalent standards. The 638-078-630-049 is more commonly deployed in automotive aftermarket test benches, repair diagnostic stations, and development hardware rather than production vehicle integration.
How does the 78-position count of the 638-078-630-049 translate to real-world PCB routing and signal allocation?
The 638-078-630-049 provides 78 individual signal paths, typically allocated as power return planes, ground references, and payload signals in a 4-row footprint. Practical PCB designs using the 638-078-630-049 allocate approximately 25–35% of the 78 positions to ground/return paths to achieve adequate current return and impedance control, leaving 50–60 positions for differential or single-ended signals. The 638-078-630-049's high position count enables complex multi-channel data acquisition systems (e.g., 64-channel analog input with auxiliary power and control lines) in a compact connector footprint. However, PCB layout of the 638-078-630-049 requires careful via placement and trace routing to avoid crosstalk between the 4 rows; ground planes should be used liberally beneath the 638-078-630-049 footprint to minimize impedance discontinuities.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 638-078-630-049

Product Attribute 638-078-630-046 638-078-630-042 638-078-630-043 638-078-630-041
Part Number 638-078-630-046 638-078-630-042 638-078-630-043 638-078-630-041
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Contact Finish Thickness - - - -
Backset Spacing - - - -
Ingress Protection - - - -
Voltage Rating - - - -
Current Rating (Amps) - - - -
Flange Feature - - - -
Connector Style - - - -
Termination - - - -
Number of Positions - - - -
Shell Material, Finish - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Rows - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish - - - -
Material Flammability Rating - - - -
Connector Type - - - -
Dielectric Material - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Color - - - -
Contact Material - - - -
Wire Gauge - - - -
Features - - - Simultaneous Sampling
Contact Type - - - -
Shell Size, Connector Layout - - - -
Contact Form - - - -

638-078-630-049 Datasheet PDF

Download 638-078-630-049 pdf datasheets and EDAC Inc. documentation for 638-078-630-049 - EDAC Inc..

Datasheets
638-078-630-049 Drawing.pdf 637,638 Series Ordering Guide.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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638-078-630-049 Image

638-078-630-049

EDAC Inc.
98D-638-078-630-049

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