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HomeProductsConnectors, InterconnectsD-Sub Connector Assemblies638-078-630-066
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638-078-630-066 - EDAC Inc.

Manufacturer Part Number
638-078-630-066
Manufacturer
EDAC Inc.
Allelco Part Number
98D-638-078-630-066
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
28,786 pcs available, New & Original
Parts Description
CONN D-SUB HD RCPT 78P VERT SLDR
Package
Tray
Data sheet
638-078-630-066.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 28786
  • Unit Price: $13.117
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $13.117 $13.12
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

638-078-630-066 Tech Specifications
EDAC Inc. - 638-078-630-066 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 638-078-630-066

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Wire Gauge -
Voltage Rating -
Termination Solder
Shell Size, Connector Layout 5 (DD, D) High Density
Shell Material, Finish Steel, Nickel Plated
Series 638
Package Tray
Operating Temperature -55°C ~ 125°C
Number of Rows 4
Number of Positions 78
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Ingress Protection -
Product Attribute Attribute Value
Flange Feature Housing/Shell (4-40)
Features Board Lock, Shielded
Dielectric Material Polyester Thermoplastic
Current Rating (Amps) 3A per Contact
Contact Type Signal
Contact Material Copper Alloy
Contact Form -
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Connector Type Receptacle, Female Sockets
Connector Style D-Sub, High Density
Color Black
Base Product Number 638-078
Backset Spacing -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the 638-078-630-066 and standard single-density D-Sub connectors for high-pin-count applications?
The 638-078-630-066 is a high-density D-Sub receptacle with 78 positions arranged in 4 rows within a DD shell format, compared to standard D-Sub connectors that typically use 2 rows and support 25 or 37 positions. This 4-row arrangement in the 638-078-630-066 enables designers to consolidate signal routing in space-constrained backplanes and equipment where panel real estate is limited. The higher pin density also reduces the overall connector footprint while maintaining individual 3A contact ratings, making the 638-078-630-066 suitable for video distribution, industrial automation matrices, and test equipment where signal bundling is required without increasing the connector's external dimensions.
Can the 638-078-630-066 handle mixed-signal environments with both analog and digital signals on the same connector?
Yes, the 638-078-630-066 accommodates mixed-signal routing because it treats all 78 positions as equivalent signal contacts with identical electrical characteristics (3A per contact, copper alloy base material). However, designers should implement careful layout planning when using the 638-078-630-066 for mixed signals. The gold contact finish (30µin thickness) and nickel-plated steel shell provide shielding that reduces crosstalk between adjacent pins, but signal integrity for high-frequency analog or low-level measurement signals requires proper segregation of digital returns and ground distribution across the 4-row matrix. The board lock feature on the 638-078-630-066 prevents accidental disconnection during high-vibration operation, which is beneficial in mixed-signal environments where pin migration would degrade signal quality.
What thermal performance should be expected when the 638-078-630-066 is operated near its maximum current rating across multiple pins?
The 638-078-630-066 supports 3A per individual contact, which means theoretical maximum current density across all 78 positions could reach 234A if fully populated. In practice, thermal rise depends on solder joint quality, PCB copper area, and airflow around the connector. The operating range of -55°C to 125°C for the 638-078-630-066 is maintained under nominal loading; however, sustained operation above 2A per pin begins generating localized heat at the solder interface. Designers should verify that PCB thermal planes beneath the 638-078-630-066 footprint provide adequate copper area (minimum 2 oz. recommendation for high-current rows) and that forced-air cooling or heat sinking is planned if multiple contacts on the 638-078-630-066 simultaneously carry continuous currents above 1.5A.
How does the UL94 V-0 flammability rating of the 638-078-630-066 dielectric material affect safety certification for equipment destined for regulated industries?
The 638-078-630-066 uses polyester thermoplastic dielectric material with UL94 V-0 certification, meaning the material self-extinguishes within 30 seconds in flame testing and produces minimal dripping. This rating is a prerequisite for equipment sold into medical devices, telecommunications, and aerospace sectors where flammability compliance is a gating requirement. When the 638-078-630-066 is incorporated into a larger assembly, the V-0 rating contributes to the overall equipment safety certification pathway but does not guarantee system-level approval; designers must still evaluate the full interconnect system, including cable insulation and adjacent components. For UL or IEC certifications involving the 638-078-630-066, manufacturers typically reference the connector's UL listing in technical files, but field-level validation (e.g., thermal cycling or flame exposure testing of the complete harness assembly using the 638-078-630-066) may be required by third-party auditors.
What is the practical lifespan of the gold contact finish on the 638-078-630-066 when exposed to repeated mating cycles in a test lab or manufacturing environment?
The 638-078-630-066 features 30µin (0.76µm) gold plating over nickel, which is a thin-film specification designed for signal-level connections rather than high-current switching. In field use with infrequent mating/unmating (fewer than 10 cycles per year), the gold finish on the 638-078-630-066 typically remains intact throughout the connector's lifetime. However, in test environments or automated changeover scenarios with repeated insertions, wear becomes measurable after 50–100 mating cycles; the gold layer may thin or expose the underlying nickel base. This degradation does not immediately fail the 638-078-630-066 at 3A signal loads because nickel itself is conductive, but contact resistance begins rising after approximately 150 cycles, which can degrade low-level analog signal fidelity. For applications requiring thousands of mating cycles, users should consider either mechanical connector savers (protective caps) on the 638-078-630-066 or upgrade to a thicker gold specification if available through the manufacturer.
How does the board lock feature on the 638-078-630-066 compare to traditional strain relief in terms of mechanical security and ease of maintenance?
The 638-078-630-066 incorporates a board lock mechanism (4-40 screw fixture on the housing/shell flange) that anchors the connector directly to the PCB, preventing axial pull-out if the mated cable assembly experiences tension or vibration. This is mechanically superior to strain relief alone because it decouples cable bending stress from the solder joint interface on the 638-078-630-066. Traditional strain relief sleeves protect the cable entry angle but do not prevent the connector body itself from shifting on the board. The trade-off is that removing or reworking the 638-078-630-066 requires unbolting the flange, which adds 2–3 minutes per connector compared to unclipping a strained-relief version. For production environments where the 638-078-630-066 is soldered once and not replaced, the board lock feature is advantageous; for R&D labs requiring frequent connector swaps, board lock may slow iteration cycles unless the designer plans connector carriers or modular subassemblies around the 638-078-630-066.
What precautions should be taken during reflow soldering to avoid solder bridging or cold joints on the 638-078-630-066's 78-pin footprint?
The 638-078-630-066's 4-row, 78-position arrangement creates a dense solder joint array where thermal mass differences between the outer and inner rows can cause uneven solder wetting during peak reflow temperature. Solder bridges between adjacent pins on the 638-078-630-066 are most common at the innermost (Row 3–4) positions because they reach peak temperature later than outer pins, extending dwell time in the plastic-state window. Best practices for the 638-078-630-066 include: (1) using a nitrogen atmosphere or reduced-oxygen reflow profile to improve wetting consistency across all 78 positions; (2) selecting solder paste with slightly increased flux activity to ensure wetting on inner pins before outer pins reach reflow end temperature; (3) implementing a touch-up oven or selective solder phase for high-risk inner rows if X-ray inspection reveals voids or insufficient fillet heights on the 638-078-630-066. Many manufacturers recommend under-reflow inspection of test coupons (breakaway sample boards with the 638-078-630-066) before full production to validate thermal profiling for your specific PCB thickness and oven equipment.
Is the 638-078-630-066 suitable for high-speed digital applications, or does the connector introduce signal integrity limitations above 100 MHz?
The 638-078-630-066 is not optimized for high-speed differential or clock distribution due to its generic signal-contact design and lack of impedance-controlled traces within the connector body. Above approximately 100 MHz, the capacitive coupling between adjacent rows and the absence of controlled trace geometry within the 638-078-630-066 shell will introduce crosstalk and phase skew across the 78 signal paths. For video distribution or parallel data buses in the 50–100 MHz range, the shielded housing of the 638-078-630-066 provides reasonable isolation if PCB-side signal routing maintains proper separation between ground and signal layers. If your application requires gigabit-speed serial links or high-frequency analog (RF > 500 MHz), consider upgrading to impedance-matched connectors or splitting the 638-078-630-066's role—use it for low-speed control and monitoring signals while routing high-speed data through dedicated differential pairs or coaxial connections outside the 638-078-630-066 array.
What is the RoHS and REACH compliance status of the 638-078-630-066, and are there any material substitution restrictions for customers in specific markets?
The 638-078-630-066 is ROHS3 compliant and REACH unaffected, indicating that all hazardous substances (lead, cadmium, mercury, etc.) have been eliminated from the connector design according to EU Directive 2011/65/EU. REACH unaffected status means the 638-078-630-066 contains no substances of very high concern (SVHC) that would require declaration beyond standard material composition documentation. Customers in EU markets can use the 638-078-630-066 without additional compliance modifications. However, some aerospace or defense-tier suppliers maintain internal specifications that diverge from EU requirements; if your organization requires exemptions from ROHS3 (e.g., for tin whisker risk mitigation in military applications), contact the manufacturer to confirm whether alternative material options are available for the 638-078-630-066 or whether a formal deviation request is necessary. The nickel-plated steel shell and copper alloy contacts on the 638-078-630-066 are inherently lead-free but require no special handling beyond standard ESD protocols.
How should the 638-078-630-066 be stored to maintain MSL (Moisture Sensitivity Level) 1 compliance, and what is the shelf life under typical warehouse conditions?
The 638-078-630-066 carries MSL 1 rating, which is the least restrictive moisture sensitivity classification; it means the connector absorbs negligible moisture and requires no baking or dry-pack storage. Unlike MSL 2–4 components, the 638-078-630-066 can be stored at room temperature (20–25°C) and standard humidity (30–70% RH) indefinitely without degradation. The polyester thermoplastic dielectric and gold-plated contacts do not experience moisture-induced corrosion or cracking under normal warehouse conditions. Shelf life for the 638-078-630-066 is effectively unlimited from a moisture perspective; however, if connectors have been stored in high-temperature environments (above 40°C for extended periods) or exposed to condensing humidity cycles, inspect contact surfaces visually for oxidation or discoloration before assembly. If shelf time exceeds 5 years, perform a continuity check on sample units from the 638-078-630-066 batch to verify contact resistance has not drifted; this is a precaution rather than a requirement, as the MSL 1 rating guarantees no age-related moisture effects.
Can the 638-078-630-066 be used in automotive or harsh industrial environments where temperature excursions below -55°C or above 125°C are possible?
The 638-078-630-066 is rated for -55°C to 125°C operation, which covers most automotive under-hood and industrial control scenarios. However, automotive Grade 1 shock and vibration (SAE J2030 or equivalent) and thermal cycling requirements often exceed the nominal operating range during engine startup transients or rapid shutdown cycles. Below -55°C, the polyester dielectric material on the 638-078-630-066 becomes brittle and may crack if subjected to mechanical stress or connector insertion/removal; above 125°C sustained exposure, the solder joints and contact plating may experience accelerated diffusion or delamination. For automotive applications where the vehicle experiences battery cranking temperatures (down to -40°C typical) but occasionally encounters transient cold spells below -55°C, the 638-078-630-066 should be mounted in a protected interior location away from engine bay extremes. If your design requires operation below -40°C or above 100°C sustained, contact Mercury United Electronics for a qualified derivative or alternative connector series; the base 638-078-630-066 may not carry automotive grade approvals and could face reliability concerns in the extended temperature envelope.
What is the contact resistance specification for the 638-078-630-066, and how does it compare to industry-standard D-Sub connectors?
Mercury United Electronics does not publish an explicit contact resistance specification for the 638-078-630-066 in typical distributor datasheets; however, the 30µin gold finish over nickel and 3A per-pin current rating imply a contact resistance in the range of 10–50 milliohms per pin under normal mating pressure. This is typical for signal-grade D-Sub connectors and is higher than specialty low-resistance rack connectors (which achieve 1–5 milliohms) but acceptable for control signals and moderate-current applications. If your 638-078-630-066 application is sensitive to contact resistance—for example, if analog signal measurement accuracy depends on low offset voltage across mated pins—request a contact resistance test report from the supplier or conduct a sample measurement using a precision milliohm meter across the mated 638-078-630-066 pairs. Temperature coefficient of contact resistance on the 638-078-630-066 will also increase across the -55°C to 125°C range; assume approximately 0.4–0.6% resistance increase per 10°C rise, which may matter if your system operates at temperature extremes.
Does the 638-078-630-066 require any special cable assembly practices, or can standard D-Sub twisted-pair or shielded cable be used?
The 638-078-630-066 is compatible with standard D-Sub cable assemblies, but the 4-row pin layout means technicians or automated assembly equipment must correctly map the 78 positions to cable conductors. Standard D-Sub twisted pairs designed for 37-pin or 25-pin connectors will not fit the 638-078-630-066's pin array; you must specify a 78-position cable harness explicitly for the 638-078-630-066. For shielding, the 638-078-630-066's nickel-plated steel shell provides inherent EMI rejection, but adding individually shielded pairs or a foil wrap around high-speed signal groups within the 638-078-630-066 harness is recommended if the connector will carry analog signals in noisy industrial environments. Wire gauge selection for the 638-078-630-066 should match the 3A per-pin rating; 20–22 AWG copper wire is standard for 1–2A applications, and 18 AWG is recommended if any single pin on the 638-078-630-066 will carry continuous current near 3A. Documentation of the cable pin mapping for the 638-078-630-066 is critical; maintain a connector pinout diagram and update it throughout the product lifecycle to prevent assembly errors and field failures.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 638-078-630-066

Product Attribute 638-078-630-069 638-078-630-046 638-078-630-061 638-078-630-067
Part Number 638-078-630-069 638-078-630-046 638-078-630-061 638-078-630-067
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Features - - - Simultaneous Sampling
Contact Type - - - -
Termination - - - -
Current Rating (Amps) - - - -
Backset Spacing - - - -
Number of Rows - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Positions - - - -
Dielectric Material - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connector Style - - - -
Contact Finish Thickness - - - -
Ingress Protection - - - -
Voltage Rating - - - -
Contact Form - - - -
Connector Type - - - -
Wire Gauge - - - -
Material Flammability Rating - - - -
Contact Material - - - -
Flange Feature - - - -
Shell Size, Connector Layout - - - -
Contact Finish - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Color - - - -
Shell Material, Finish - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

638-078-630-066 Datasheet PDF

Download 638-078-630-066 pdf datasheets and EDAC Inc. documentation for 638-078-630-066 - EDAC Inc..

Datasheets
638-078-630-066 Drawing.pdf 637,638 Series Ordering Guide.pdf
Environmental Information
EDAC REACH.pdf

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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

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638-078-630-066 Image

638-078-630-066

EDAC Inc.
98D-638-078-630-066

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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