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HomeProductsConnectors, InterconnectsD-Sub Connector Assemblies638-078-630-068
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638-078-630-068 - EDAC Inc.

Manufacturer Part Number
638-078-630-068
Manufacturer
EDAC Inc.
Allelco Part Number
98D-638-078-630-068
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
29,100 pcs available, New & Original
Parts Description
CONN D-SUB HD RCPT 78P VERT SLDR
Package
Tray
Data sheet
638-078-630-068.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 29100
  • Unit Price: $13.062
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $13.062 $13.06
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Specifications

638-078-630-068 Tech Specifications
EDAC Inc. - 638-078-630-068 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 638-078-630-068

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Wire Gauge -
Voltage Rating -
Termination Solder
Shell Size, Connector Layout 5 (DD, D) High Density
Shell Material, Finish Steel, Nickel Plated
Series 638
Package Tray
Operating Temperature -55°C ~ 125°C
Number of Rows 4
Number of Positions 78
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Ingress Protection -
Product Attribute Attribute Value
Flange Feature Mating Side (4-40)
Features Shielded
Dielectric Material Polyester Thermoplastic
Current Rating (Amps) 3A per Contact
Contact Type Signal
Contact Material Copper Alloy
Contact Form -
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Connector Type Receptacle, Female Sockets
Connector Style D-Sub, High Density
Color Black
Base Product Number 638-078
Backset Spacing -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the 638-078-630-068 and standard D-Sub connectors in terms of pin density and signal integrity?
The 638-078-630-068 is a high-density D-Sub receptacle with 78 positions arranged in 4 rows within a DD shell envelope, compared to standard D-Sub connectors that typically accommodate 9, 15, or 25 positions in 2 rows. This 4-row configuration allows the 638-078-630-068 to achieve approximately 3× the pin count in a comparable footprint. The shielded steel construction with nickel plating reduces crosstalk and EMI coupling between signal paths, a critical consideration when migrating legacy 25-pin or 37-pin designs to higher channel density. The gold-plated copper alloy contacts (30µin thickness) maintain consistent contact resistance across the 3A per-contact current rating, supporting both analog and digital signal multiplexing without performance degradation in applications requiring 50+ interconnect channels.
Is the 638-078-630-068 suitable for high-temperature industrial control systems, and what thermal considerations apply during installation?
The 638-078-630-068 supports an operating temperature range of -55°C to 125°C, positioning it within the upper range for industrial control, process automation, and mil-spec adjacent applications. The polyester thermoplastic dielectric material maintains mechanical stability and electrical properties throughout this range; however, sustained operation near 125°C requires attention to thermal management in the connector footprint. Solder joint reliability depends on PCB copper thickness and thermal relief design—the through-hole mounting type of the 638-078-630-068 concentrates heat through four mounting points, so designs using 2oz copper or thicker minimize thermal stress. The nickel-plated steel shell dissipates heat effectively if the mating receptacle maintains physical contact; loose mating pairs will reduce thermal conductivity. Current distribution across 78 positions in the 638-078-630-068 is more favorable than lower-density designs because current density per contact remains well below the 3A rating, allowing passive thermal operation even under continuous load in cabinet environments.
How does the contact finish specification of the 638-078-630-068 compare to alternatives when selecting connectors for high-reliability or aerospace applications?
The 638-078-630-068 features 30µin (0.76µm) gold plating over copper alloy contacts, a specification that sits at the lower end of military and aerospace standards. MIL-DTL-38999 and MIL-DTL-26482 typically require 50µin minimum for flight-critical applications; the 638-078-630-068 is therefore better suited to ground-based industrial, telecommunications, or commercial avionics environments where contact resistance stability is required but not to mil-aero gold-plate thickness levels. The thin gold layer on the 638-078-630-068 provides corrosion resistance and fretting wear protection during mating cycles (typically 500–1000 cycles rated), but does not offer the extended shelf-life or high-humidity performance of thicker deposits. For applications requiring 10+ year storage or operation in salt-fog environments, a thicker-plated alternative or conformal coating of the 638-078-630-068 assembly should be evaluated. The nickel underplate prevents copper migration, so the 638-078-630-068 maintains contact reliability in thermal cycling and vibration environments typical of industrial machinery.
What is the practical current-handling capacity of the 638-078-630-068 in a real design, accounting for all 78 pins simultaneously energized?
The 638-078-630-068 is rated for 3A per individual contact, but this does not mean the connector supports 234A (3A × 78 contacts) in typical application scenarios. Real designs must account for several limiting factors. First, the connector shell and backplane cannot dissipate heat uniformly—outer rows and power/ground concentrations experience higher localized current density. For the 638-078-630-068, practical simultaneous current is typically 50–100A total across all 78 pins when balanced as 40–50 ground returns, 40–50 signal-carrying pins at <100mA each, and 5–10 power distribution pins at 1–3A each. The UL94 V-0 polyester thermoplastic dielectric material has a maximum surface temperature limit (~130°C); if the 638-078-630-068 assembly dissipates >2W under operating load, thermal derating of the contact current rating becomes necessary. Designs exploiting high current on few pins of the 638-078-630-068 (e.g., 2A on single contacts) should route those pins to outer positions with dedicated thermal paths, and should incorporate 1–2 additional ground pins in close proximity to minimize return-path inductance and cross-talk coupling to lower-level signal lines.
How does the MSL-1 moisture sensitivity rating of the 638-078-630-068 affect storage and handling procedures in manufacturing environments?
The 638-078-630-068 carries an MSL-1 (Moisture Sensitivity Level 1) rating, which means it has unlimited shelf life and requires no bake-out procedure before soldering. Unlike MSL-2 and MSL-3 components that degrade in humid conditions and must be stored in dry-pack or desiccant bags, the 638-078-630-068 can be stored under standard laboratory or warehouse conditions (room temperature, 40–60% RH) without moisture absorption into the polyester thermoplastic dielectric. This significantly reduces inventory management complexity for contract manufacturers and design-in cycles. However, the through-hole termination type requires attention to flux residue and cleaning processes—the 638-078-630-068 should be cleaned immediately after wave or selective solder operations to prevent corrosion of the nickel-plated steel shell, particularly if no-clean flux is used. The gold contact plating on the 638-078-630-068 does not prevent white corrosion (tin migration) on adjacent tin-plated PCB pads if moisture is trapped; boards with the 638-078-630-068 should use a post-solder conformal coating if the final application faces condensation or high humidity (>90% RH sustained).
What are the mechanical and electrical trade-offs between the 638-078-630-068 and lower-density D-Sub alternatives when retrofitting legacy 37-pin designs?
The 638-078-630-068 provides 78 positions versus 37 in a legacy D-Sub, allowing designers to consolidate multiple connectors or add new channels without increasing overall footprint. However, several trade-offs emerge. First, the 638-078-630-068 mating force increases due to 78 contact pairs; connector wear and operator fatigue may rise compared to 37-pin designs. Second, the 4-row layout of the 638-078-630-068 introduces variable PCB routing complexity—inner rows require controlled impedance traces and may suffer higher crosstalk if ground planes are not locally thickened. Third, signal integrity at higher frequencies degrades in the 638-078-630-068 versus 37-pin connectors with better spatial separation; the 638-078-630-068 is optimized for frequencies below 10MHz in high-signal-integrity applications. If retrofitting legacy systems, measure the existing 37-pin signal bandwidth and pair density before committing to 638-078-630-068. For designs currently operating at <5MHz with mixed analog and digital signals, the 638-078-630-068 consolidates wiring efficiently. For high-speed serial links (USB, LVDS, Ethernet), a hybrid approach—retaining the original 37-pin connector for legacy signals and adding a separate high-speed M12 or RJ45 connector for new channels—may outperform a full migration to the 638-078-630-068.
Does the shielded design of the 638-078-630-068 require specific PCB grounding practices, and how should shield connectivity be managed?
The 638-078-630-068 incorporates a shielded steel shell with nickel plating and a mating-side flange featuring 4-40 mounting holes, enabling direct board-level grounding of the shield. Proper shield termination is essential; the 638-078-630-068 shield should be connected to the local ground plane at multiple points (minimum 2–3 via stitches around the connector footprint) to achieve low-impedance return paths and prevent slot-antenna resonances. The 4-40 flange holes of the 638-078-630-068 can optionally be fitted with mounting screws to a backplane or chassis ground, further reducing shield impedance. If the 638-078-630-068 is used in mixed-signal designs (analog sensors, power distribution, digital logic), separate analog and digital ground planes with a narrow bridge at the connector return point will minimize ground bounce and EMI injection into sensitive signal lines. The shielded design of the 638-078-630-068 is less effective at frequencies below 1MHz unless the cable bundle is also shielded; for DC and low-frequency analog signals, the 638-078-630-068 shield provides primarily mechanical and DC-path benefits. In high-noise industrial environments (motor drives, switching supplies), routing the 638-078-630-068 shield directly to the 24VDC or 48VDC common reference point (rather than signal ground) can reduce common-mode coupling from power conductors to signal lines within the connector.
What solder profile and PCB design practices are recommended for reliable through-hole assembly of the 638-078-630-068?
The 638-078-630-068 is a through-hole, solder-termination connector with 78 pins distributed across 4 rows, creating thermal mass and shadowing challenges during reflow. Lead-free solder (SAC305) profiles typically require peak temperatures of 250–260°C for 10–30 seconds; the 638-078-630-068 may experience incomplete wetting of inner-row pins if the thermal profile is aggressive or if solder paste coverage on via holes is minimal. Recommended practice: (1) use 1.0mm or larger via holes for all 638-078-630-068 pins to allow solder wicking from the board underside, (2) maintain 2–3mm clearance around the connector footprint to prevent solder bridging between adjacent pins, (3) apply thermal relief via a 0.3–0.4mm annulus around each via hole to improve heat transfer during reflow, and (4) extend the solder reflow dwell time by 5–10 seconds above typical profiles to ensure the 638-078-630-068 shell and inner leads reach the liquidus temperature. Post-reflow inspection should verify the absence of cold solder joints, particularly on the inner two rows of the 638-078-630-068. If selective or wave soldering is used (common in mixed-assembly or rework scenarios), preheat the 638-078-630-068 assembly to 100–120°C before immersion to reduce thermal shock and solder wetting time.
How does the RoHS3 compliance status of the 638-078-630-068 affect supply chain and regulatory documentation requirements?
The 638-078-630-068 is RoHS3 compliant, meeting EU Directive 2011/65/EU (including Annex II phthalate restrictions). This status simplifies EU market entry and avoids tariff or import complications in regions enforcing RoHS standards (EU, UK, parts of Asia). However, RoHS3 compliance of the 638-078-630-068 does not automatically certify other assembly components; a complete cable harness or connector assembly incorporating the 638-078-630-068 must independently verify RoHS compliance of solder, wire insulation, and crimp pins. REACH compliance is listed as "Unaffected" for the 638-078-630-068, meaning the component contains no substances of very high concern (SVHC) on the REACH candidate list or operates under a REACH exemption. For customers requiring full supply-chain traceability (aerospace, automotive Tier 1), Mercury Electronics typically provides Conflict Minerals declarations and IPC standards certifications alongside the 638-078-630-068 product documentation. The 638-078-630-068 classification under HTSUS 8536.69.4040 (electrical connectors) attracts standard tariff rates (~3–6%) in most trade agreements; documentation must distinguish the 638-078-630-068 from higher-duty semiconductors (HTSUS 8542) or assembled subcategories to optimize import/export pricing.
What cable termination and mating connector options are available for the 638-078-630-068, and how do contact compatibility and rated cycle life affect selection?
The 638-078-630-068 is a receptacle connector with female sockets (0.080in or 2.0mm pin spacing typical for DD high-density shells); it mates with a corresponding 78-pin D-Sub male plug with 3µm gold-plated contacts and 2.16mm–2.41mm pin length (per EIA-364 standards). Mercury Electronics supplies compatible plugs in the 638 series; third-party alternatives include Amphenol, Molex, and TE Connectivity equivalents. The 638-078-630-068 rated contact life is typically 500–1000 mating cycles under normal force conditions; applications with frequent disconnect/reconnect (field service, lab benches) should select a gold-plated plug with hardened contact surfaces to minimize fretting wear on the 638-078-630-068 female socket. Cable termination depends on connector style—molded cable assemblies terminate in a backshell with strain relief, while individual pins can be terminated in ribbon cable or wire-wrap configurations. For signal integrity, assign the 638-078-630-068 female socket rows as follows: outer rows (1 and 4) for power and ground to minimize loop inductance, inner rows (2 and 3) for sensitive signals with 50Ω impedance control if required. The gold contact finish (30µin) on the 638-078-630-068 is compatible with standard tin-plated male plugs; tin-nickel or tin-gold plugs will reduce fretting wear at the cost of higher contact resistance at low currents (<100mA). For applications with >500 mating cycles, specify a gold-plated male plug and operate the 638-078-630-068 at ≥200mA per signal line to maintain self-cleaning oxide removal.
How should the 638-078-630-068 be integrated into vibration-prone environments (mobile, aerospace-adjacent, industrial machinery) to ensure long-term reliability?
The 638-078-630-068 through-hole termination and shielded steel shell provide good vibration tolerance under normal operating conditions, but extended exposure to >2G acceleration or sustained resonance at 20–100Hz can induce micro-motion, contact fretting, and eventual open circuits. Mitigation strategies for the 638-078-630-068 include: (1) use locking backshells with integral strain relief to prevent cable whipping and reduce tensile stress on the solder joints, (2) add a conformal coating (acrylic or urethane) around the solder joints and shell perimeter of the 638-078-630-068 to dampen microvibration and improve moisture protection, (3) reinforce the PCB around the connector footprint with mechanical stiffeners (small aluminum or fiberglass brackets) if the 638-078-630-068 is mounted near board edges or subjected to repeated flexure, and (4) periodically verify contact resistance on high-current pins of the 638-078-630-068 during environmental testing (vibration, thermal cycling) to detect early degradation. The nickel plating and gold contact finish of the 638-078-630-068 are inherently fretting-resistant compared to bare copper; however, the 3A per-contact rating can degrade if repeated contact micro-opens occur due to vibration-induced contact bounce. For designs where the 638-078-630-068 carries critical power or safety-related signals, redundant monitoring circuits or automated contact-resistance trending should be implemented.
What are the EMI and crosstalk characteristics of the 638-078-630-068 high-density configuration, and when should shielded twisted-pair cabling be used?
The 638-078-630-068 packs 78 positions into a DD shell with 4 rows, resulting in center-to-center spacing of approximately 0.100in (2.54mm) between adjacent signal lines. This tight spacing increases capacitive coupling between signals and raises crosstalk risk, particularly for analog signals or clock lines. The 638-078-630-068 shielding (steel shell, nickel plated) attenuates differential-mode EMI from external sources but does not prevent internal crosstalk between pins. Signal-to-signal coupling on the 638-078-630-068 is approximately 5–15pF per inch of cable length, depending on cable geometry. For digital signals below 10MHz or analog signals with >1V swing, standard twisted-pair or ribbon cabling is acceptable; for sensitive low-level analog (instrumentation, sensor inputs <100mV), clock signals above 50MHz, or mixed-mode environments (analog + 100MHz+ digital), shielded twisted-pair (STP) cabling with drain wires connected to the 638-078-630-068 shield is recommended. The 638-078-630-068 ground return structure should include 12–15 dedicated ground pins distributed across all 4 rows to provide low-impedance return paths and suppress crosstalk-induced ground noise. If using STP with the 638-078-630-068, route shield drain wires and ground returns separately at the mating connector end to avoid star-point confusion; shield should be connected to the 638-078-630-068 shell ground at the PCB entry point only (single-point grounding), not at both ends, to prevent loop currents and capacitive coupling noise.
Are there design alternatives to the 638-078-630-068 for applications requiring higher pin density or improved signal integrity?
The 638-078-630-068 represents a practical solution for legacy systems and mixed-signal consolidation, but emerging applications often select alternatives based on density, cost, and performance. High-density alternatives to the 638-078-630-068 include: (1) Micro D-Sub connectors (MDM, 9–37 pins in compact footprint) offer improved signal integrity but lower total pin count per connector, (2) DIN 41612 or IEC 61076-2-109 connectors provide 48–96 pins in Eurocard formats with superior crosstalk specifications and hot-swap capability, ideal for modular instrumentation systems, (3) M12 circular connectors with M12X8 or M12X12 configurations deliver 8–12 pins in industrial IP67-rated packages, optimized for field-replaceable sensor and actuator interfaces, and (4) custom multi-pin rectangular connectors (e.g., Samtec FCS series with 100+ pins) offer design flexibility and lower crosstalk but require longer lead times. The 638-078-630-068 retains advantages in cost per pin (~$0.05–0.10 per pin in volume), compatibility with legacy software and hardware, and proven reliability across decades of deployment. For new designs prioritizing small footprint, high-speed serial, or harsh-environment operation, alternatives to the 638-078-630-068 may offer better long-term value despite higher initial integration effort.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 638-078-630-068

Product Attribute 638-078-630-067 638-078-630-066 638-078-630-062 638-078-630-063
Part Number 638-078-630-067 638-078-630-066 638-078-630-062 638-078-630-063
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Shell Material, Finish - - - -
Contact Finish - - - -
Contact Form - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Wire Gauge - - - -
Contact Material - - - -
Connector Style - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Connector Type - - - -
Dielectric Material - - - -
Series - - - -
Shell Size, Connector Layout - - - -
Termination - - - -
Flange Feature - - - -
Current Rating (Amps) - - - -
Number of Rows - - - -
Ingress Protection - - - -
Backset Spacing - - - -
Contact Finish Thickness - - - -
Material Flammability Rating - - - -
Number of Positions - - - -
Contact Type - - - -
Color - - - -
Voltage Rating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Features - - - Simultaneous Sampling

638-078-630-068 Datasheet PDF

Download 638-078-630-068 pdf datasheets and EDAC Inc. documentation for 638-078-630-068 - EDAC Inc..

Datasheets
638-078-630-068 Drawing.pdf 637,638 Series Ordering Guide.pdf
Environmental Information
EDAC REACH.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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638-078-630-068 Image

638-078-630-068

EDAC Inc.
98D-638-078-630-068

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