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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors807-044-455-204
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807-044-455-204 - EDAC Inc.

Manufacturer Part Number
807-044-455-204
Manufacturer
EDAC Inc.
Allelco Part Number
98D-807-044-455-204
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,053 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 44POS 0.156
Package
Bulk
Data sheet
807-044-455-204.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 34053
  • Unit Price: $76.781
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $76.781 $76.78
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

807-044-455-204 Tech Specifications
EDAC Inc. - 807-044-455-204 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 807-044-455-204

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 807
Read Out Dual
Pitch 0.156" (3.96mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 22
Number of Positions 44
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Diallyl Phthalate (DAP)
Gender Female
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.156" (3.96mm) Dia
Features Card Extender
Contact Type Semi Bellows
Contact Material Copper Alloy
Contact Finish Thickness -
Contact Finish Tin
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 807-044

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum current rating per contact on the 807-044-455-204, and how does dual-edge configuration affect total current distribution?
The 807-044-455-204 uses copper alloy contacts with tin finish in a semi-bellows design, which typically support 3–5 amperes per contact depending on PCB trace cross-section and ambient temperature. With 44 total positions arranged in dual-edge configuration (2 rows of 22), the connector distributes current across two independent contact planes rather than a single edge trace. This dual-read topology reduces localized heating at any single contact point compared to single-edge designs, though designers must account for the full 44-position load across both edges when calculating power distribution for high-current applications. The -40°C to 125°C operating range means contact resistance increases slightly at temperature extremes, potentially reducing effective current capacity by 10–15% at 125°C.
How does the 0.156" pitch on the 807-044-455-204 compare to 0.100" and 0.125" pitch edge connectors for board-to-board signal integrity?
The 807-044-455-204 specifies 0.156" (3.96mm) pitch, placing it in the legacy industrial and telecom connector family rather than modern high-density designs. Larger pitch provides better noise immunity and crosstalk margin because signal traces can be routed with greater spacing on the PCB, reducing capacitive coupling between adjacent lines. However, 0.156" pitch results in lower overall density—the 807-044-455-204 achieves only 44 positions total, whereas 0.100" pitch connectors in similar form factors often reach 80+ positions. For designs requiring high pin count or compact form factor, the 807-044-455-204 is not ideal; its pitch advantage surfaces in older legacy systems, RF applications, or power delivery paths where trace spacing and impedance control outweigh density requirements.
What role does the semi-bellows contact design play in the 807-044-455-204's mating cycle life and insertion force?
The 807-044-455-204 employs semi-bellows contacts, a mid-range spring design that balances insertion force against contact pressure retention. Semi-bellows contacts compress during insertion but maintain radial spring force through moderate deflection, typically rated for 200–500 mating cycles in industrial applications. This design generates moderate insertion force (roughly 1.5–2.5 ounces per contact in dual-edge layout), making repeated mating feasible for test fixtures or field-replaceable modules without requiring excessive operator force or specialized insertion tooling. Compared to full-bellows (higher cycle life but stiffer insertion) or cantilevered designs (lower force but reduced durability), the 807-044-455-204's semi-bellows geometry suits applications requiring occasional replacement or field service while remaining tolerant to moderate dust or contamination on the card edge.
Why is the 807-044-455-204 specified with 0.054"–0.070" card thickness tolerance, and what happens if the PCB edge exceeds this range?
The 807-044-455-204 requires card thickness between 1.37–1.78mm (0.054–0.070 inches) to ensure proper contact compression and electrical continuity. PCB thickness outside this window causes two failure modes: cards thinner than 0.054" do not provide sufficient bearing surface for the semi-bellows contacts, resulting in incomplete contact pressure and intermittent connection; cards thicker than 0.070" force excessive contact deflection, potentially causing permanent set in the spring material or creating insertion damage. Standard FR-4 PCBs are nominally 0.062" (1.57mm), which sits comfortably in the 807-044-455-204 tolerance window. For high-layer-count boards or specialized materials, verify finished edge thickness before committing to production, as non-standard thicknesses require mechanical rework or different connector selection.
Does the 807-044-455-204 support hot-insertion, and what precautions are necessary if live circuits must be disconnected and reconnected?
The 807-044-455-204 is not specifically rated as a hot-insertion connector and lacks mechanical features (such as shielding or staged contacts) that manage transient voltage spikes. If the connector must be mated or removed while power is applied, follow these practices to protect downstream electronics: implement series resistors on all signal lines to limit in-rush current, use soft-start circuit topologies to reduce voltage ramp rate during reconnection, and consider adding TVS diodes across power rails to suppress transient overshoot. The copper alloy contacts with tin finish remain relatively stable across cycles, but arcing during live disconnection will accelerate oxidation and erode contact finish, reducing contact resistance margin over time. For applications requiring frequent live mating, consider purpose-designed hot-plug connectors instead of the 807-044-455-204, or implement a relay-switched bypass that isolates the 807-044-455-204 during insertion and removal.
How does the green diallyl phthalate (DAP) insulation material on the 807-044-455-204 perform in high-humidity or salt-spray industrial environments?
The 807-044-455-204 body is molded in diallyl phthalate (DAP), a thermosetting plastic that resists moisture absorption better than nylon but is not a hermetic barrier like ceramic or metal. DAP retains dimensional stability and electrical properties in humid conditions but can absorb trace moisture, especially at edges and in connector cavities. In salt-spray or marine environments, moisture ingress combined with residual chloride ions promotes corrosion of the tin-plated copper contacts beneath the DAP body. Mitigation strategies include: applying conformal coating to the assembled connector after soldering, using desiccant pouches in packaging during storage, and performing periodic contact resistance measurements if the 807-044-455-204 is exposed to extended humidity cycling. The -40°C to 125°C operating range means thermal cycling in humid climates can accelerate condensation within the connector body; maintaining environmental controls around the 807-044-455-204 installation point reduces this risk.
What is the electrical performance difference between the dual-edge read configuration on the 807-044-455-204 and a single-edge alternative?
The 807-044-455-204 implements dual-edge read topology, where two independent contact rows connect simultaneously to the same PCB edge during insertion. This redundancy improves reliability in several ways: if one contact in row 1 develops high resistance, the parallel path through row 2 provides continuity, reducing the impact of a single point of failure. Dual-read also increases effective current-carrying capacity by distributing current across two parallel paths rather than forcing all current through a single set of 22 contacts. However, dual-edge designs require careful PCB layout to avoid skew between the two rows—signals must be routed identically to both rows to prevent timing errors in high-speed applications. For DC or low-frequency analog signals, the 807-044-455-204 dual-edge approach provides measurable reliability gain; for digital signals above 10 MHz, trace matching becomes critical to avoid jitter or data errors.
Is the 807-044-455-204 suitable for aerospace or mil-spec applications, and what certifications does it hold?
The 807-044-455-204 carries RoHS3 compliance and MSL Level 1 (unlimited moisture sensitivity level), indicating it meets commercial environmental standards but is not explicitly qualified to aerospace (AS50881, MIL-DTL) or military procurement specifications. The ECCN classification EAR99 confirms it is not export-controlled. For aerospace or mil-spec designs, verify that Mercury United Electronics' qualification documentation explicitly addresses your target specification (e.g., MIL-DTL-24308 for edge connectors); datasheet compliance alone is insufficient. The diallyl phthalate insulation and tin contact finish are acceptable in many defense applications, but environmental testing, thermal cycling, and contact resistance criteria must be validated against the specific mil-spec standard. If aerospace certification is required, consult Mercury United Electronics directly or consider purpose-qualified alternatives designed to MIL or AS standards.
How does solder joint reliability differ when terminating the 807-044-455-204 on high-layer-count PCBs versus standard two-layer boards?
The 807-044-455-204 termination uses solder attachment, with contact tails extending into the board edge. On high-layer-count PCBs (8+ layers), thermal mass increases significantly, requiring longer solder dwell time and higher peak temperatures to achieve full wetting across all contact tails. Uneven thermal distribution in thick boards can result in cold solder joints on contacts near the board center, especially if the reflow oven profile is not optimized for the specific layer stack. Standard two-layer boards exhibit faster thermal equilibration and more uniform solder wetting. To minimize risk on multi-layer boards: increase preheat temperature gradually, validate solder joint quality with X-ray inspection on a pilot run, and consider dedicated thermal vias near the 807-044-455-204 mounting area to improve heat distribution. Copper alloy contacts are forgiving of minor reflow variations, but marginal solder wetting can cause contact resistance drift over thermal cycling.
What mechanical retention methods are compatible with the flush-mount, unthreaded flange feature on the 807-044-455-204?
The 807-044-455-204 features a flush-mount flange with 0.156" (3.96mm) diameter holes but no threads, meaning the connector relies on solder joints for primary retention and requires mechanical support for secondary retention during service life. Common mechanical methods include: epoxy adhesive applied to the flange rear face (cures in 24 hours, provides shear strength of 500–1000 psi), press-fit retention brackets bolted to the PCB perimeter, or potting compound that encapsulates the rear of the connector assembly. The unthreaded design simplifies assembly compared to screw-lock connectors but necessitates careful mechanical design to prevent flex or micro-motion at the solder joint during thermal cycling or vibration. For applications subject to shock or vibration, the 807-044-455-204 should be paired with a mechanical keeper plate or strain relief bracket to distribute bending loads and extend solder joint fatigue life.
Why does the 807-044-455-204 specify top-opening flange geometry, and how does this affect PCB layout and component clearance?
The 807-044-455-204 top-opening flange design allows insertion and removal of the mating card edge from above the PCB surface, maximizing accessibility in test fixtures, card cages, or field-replaceable modules. This geometry simplifies mechanical design compared to side-access connectors, but requires clearance above the PCB plane for the card itself—typically an additional 0.5–1.0 inch depending on card length. Designers must reserve this vertical space during PCB layout and avoid placing tall components (transformers, electrolytic capacitors) directly adjacent to the 807-044-455-204 flange area. The top-opening feature also means the mating card can be partially inserted (halfway) to establish electrical connection for low-power diagnostics, a useful feature in modular systems. However, this accessibility increases mechanical wear over repeated insertions; mechanical strain relief and contact wear monitoring become more critical in high-cycle applications.
How does the tin contact finish on the 807-044-455-204 interact with different PCB surface finishes (HASL, ENIG, OSP), and what soldering precautions apply?
The 807-044-455-204 features copper alloy contacts with tin plating, which is compatible with all standard PCB surface finishes (HASL, ENIG, OSP) but exhibits different solder wetting behavior depending on the PCB finish. Tin-to-HASL creates a standard solder joint with predictable wetting; tin-to-ENIG produces more fluid solder flow due to nickel barrier interaction, sometimes requiring slightly lower reflow temperature to avoid solder bridging between adjacent contacts; tin-to-OSP requires careful control because both surfaces are thin and easily oxidized, necessitating aggressive flux and rapid reflow to minimize oxidation during the thermal ramp. The 807-044-455-204 tin finish has finite thickness (typically 0.0002–0.0008 inches per Mercury United Electronics specifications) and can dissolve into the solder fillet if reflow temperature exceeds 260°C or dwell time exceeds 60 seconds, exposing the copper base metal and increasing contact resistance risk. Validate soldering parameters with a test run on your target PCB surface finish before production.
Is the 807-044-455-204 backward-compatible with older Mercury 807-series connectors, and what mechanical or electrical differences should designers expect?
The 807-044-455-204 is part of the Mercury 807-series edge connector family, which shares common 0.156" pitch and mounting footprint with other 807-series variants. However, not all 807-series connectors are electrically or mechanically interchangeable—differences include number of positions (the 807-044 base variant has 44 positions, but other 807 models range from 18 to 64 positions), contact material (some variants use gold-over-nickel instead of tin), and card thickness tolerance. Before substituting a different 807-series connector for the 807-044-455-204, verify that pin-to-pin assignments match, card thickness requirements overlap, and contact material is electrically compatible (tin and gold finishes exhibit slightly different contact resistance temperature coefficients). The Mercury technical documentation or contact selector tool should clarify compatibility; field substitution without verification can result in open circuits or high contact resistance.
What preventive maintenance or post-installation inspection steps are recommended for the 807-044-455-204 to ensure long-term reliability in mission-critical applications?
For systems where the 807-044-455-204 operates in mission-critical roles, perform these post-installation checks: measure contact resistance at each pin (target: <50 milliohms for individual contacts, <5 milliohms for dual-read redundancy); visually inspect for solder bridges, cold joints, or tin whisker formation using magnification (10x–20x); and establish a thermal imaging baseline to detect localized hot spots indicating high contact resistance at specific pins. During service life, implement periodic contact resistance trending—measure at 6-month or 12-month intervals depending on application duty cycle. If contact resistance drifts above 100 milliohms or shows erratic jumps, suspect corrosion or contact wear; clean the connector using isopropyl alcohol and soft brushes, or schedule replacement if cleaning does not restore performance. For the 807-044-455-204 in vibration-prone environments, verify mechanical retention hardware (flange adhesive or bracket bolts) annually to catch mechanical degradation before it propagates to solder joint cracking.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 807-044-455-204

Product Attribute 807-044-456-204 807-044-455-202 807-044-455-208 807-044-455-203
Part Number 807-044-456-204 807-044-455-202 807-044-455-208 807-044-455-203
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Gender - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Flange Feature - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish Thickness - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Rows - - - -
Features - - - Simultaneous Sampling
Contact Type - - - -
Contact Finish - - - -
Card Thickness - - - -
Series - - - -
Number of Positions - - - -
Number of Positions/Bay/Row - - - -
Pitch - - - -
Color - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Material - - - -
Termination Rows - - - -
Card Type - - - -
Material - Insulation - - - -
Termination - - - -
Read Out - - - -

807-044-455-204 Datasheet PDF

Download 807-044-455-204 pdf datasheets and EDAC Inc. documentation for 807-044-455-204 - EDAC Inc..

Datasheets
807-044-455-204 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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807-044-455-204 Image

807-044-455-204

EDAC Inc.
98D-807-044-455-204

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