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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors837-052-523-803
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837-052-523-803 - EDAC Inc.

Manufacturer Part Number
837-052-523-803
Manufacturer
EDAC Inc.
Allelco Part Number
98D-837-052-523-803
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
30,056 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 52POS 0.156
Package
Box
Data sheet
837-052-523-803.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 30056
  • Unit Price: $87.885
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $87.885 $87.89
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

837-052-523-803 Tech Specifications
EDAC Inc. - 837-052-523-803 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 837-052-523-803

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 837
Read Out Dual
Pitch 0.156" (3.96mm)
Package Box
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 26
Number of Positions 52
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Diallyl Phthalate (DAP)
Gender Female
Flange Feature Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 837-052

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 837-052-523-803 connector accommodate, and how does this affect PCB design margins?
The 837-052-523-803 is specified for card thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm). This 0.016" tolerance window is typical for dual-edge connectors but requires careful attention during PCB layout. If your board thickness falls outside this range, the cantilever contacts on the 837-052-523-803 may either over-compress (reducing contact life) or under-engage (increasing insertion resistance and contact resistance). Verify your PCB supplier's thickness tolerance stack-up against the connector's specification; even a ±0.005" board tolerance can consume half the available margin.
How does the gold contact finish thickness on the 837-052-523-803 impact long-term reliability in industrial environments?
The 837-052-523-803 features a 10.0µin (0.25µm) gold plating over copper alloy contacts. This thin gold layer is sufficient for typical indoor and commercial applications but provides limited protection against corrosion in high-humidity or chemically aggressive environments. In industrial settings with temperature cycling between -40°C and 125°C, the differential expansion between the thin gold layer and underlying copper can eventually expose the base material, increasing corrosion risk after 5–10 years. For aerospace, marine, or outdoor applications, consider connectors with thicker gold plating (25–50µin) or alternative contact finishes.
What is the practical insertion force requirement for the 837-052-523-803, and how does the floating bobbin design affect mating cycles?
The 837-052-523-803 uses a floating bobbin design with cantilever contacts, which typically results in moderate insertion forces (8–15 lbf for a 52-position dual-edge configuration). The floating bobbin allows slight vertical compliance during insertion, reducing peak forces and improving alignment tolerance. However, this compliance can increase cumulative wear across repeated mating cycles. At 50 mating cycles, contact resistance typically remains stable; beyond 100 cycles, mechanical wear on the cantilever contact tails may begin to increase contact resistance by 5–10%. For applications requiring frequent interconnection changes, mechanical life testing is recommended.
How does the 0.156" pitch on the 837-052-523-803 compare to alternatives, and what design challenges does it present?
The 837-052-523-803 operates at 0.156" (3.96mm) pitch, placing it in the mid-range for edge connectors. This pitch is wider than fine-pitch alternatives (0.100") but narrower than legacy 0.200" connectors, resulting in 52 positions in a dual-edge configuration. The trade-off is signal integrity: at 0.156" pitch, adjacent signal traces are 3.96mm apart, requiring careful impedance control and ground plane management above 100 MHz. For high-speed applications (DDR memory, PCI bus emulation), the 837-052-523-803 may require controlled-impedance card edge traces and shielding to prevent crosstalk.
Is the 837-052-523-803 suitable for direct replacement of older connectors, and what compatibility issues should be evaluated?
The 837-052-523-803 belongs to Mercury's 837 series and shares the dual-edge, 0.156" pitch standard with legacy designs. However, direct compatibility depends on three factors: (1) card thickness tolerance overlap—older PCBs may fall outside the 0.054"–0.070" window due to manufacturing drift; (2) contact pitch alignment—verify that existing card edge traces align exactly with the 837-052-523-803's 26 positions per row; (3) mechanical mounting—the 837-052-523-803 features top-mount opening with floating bobbin, which may differ from older bayonet or friction-lock designs. Before field substitution, test a prototype mating to confirm proper seating and contact pressure.
What solder joint reliability should be expected from the 837-052-523-803 in thermal cycling environments?
The 837-052-523-803 uses through-hole termination with solder attachment points distributed across two termination rows. In thermal cycling between -40°C and 125°C (ΔT = 165°C), solder joints experience mechanical strain from the mismatch between the copper alloy connector body (CTE ~17 ppm/°C) and typical FR-4 PCB (CTE ~16–18 ppm/°C). Over 300+ thermal cycles, fatigue cracking at the solder fillet can occur if the 837-052-523-803 is mounted near PCB edges or under mechanical stress. To improve reliability, ensure solder fillets are well-formed (>45° angle), use a low-Pb alloy with appropriate reflow profile, and consider stress-relief PCB mounting brackets for high-vibration applications.
How do the dual-read capability and two-row configuration of the 837-052-523-803 affect signal routing and backplane design?
The 837-052-523-803 provides 52 total positions arranged in two rows of 26, enabling dual-read access to the same card. This topology supports redundant signal paths or simultaneous access from multiple backplanes. However, routing the 837-052-523-803 on a multi-layer PCB requires careful planning: each of the two termination rows occupies different Z-height on the board stack-up, necessitating vias to connect row 1 traces (near the surface) and row 2 traces (internal or opposite surface). Signal integrity analysis should account for via resonance and the additional propagation delay (~0.5–1 ns) introduced by internal routing. Backplane designs using the 837-052-523-803 must reserve trace separation and ground planes between the two rows to prevent crosstalk.
What environmental sealing or potting compatibility does the 837-052-523-803 offer for harsh outdoor or marine applications?
The 837-052-523-803 connector body is molded from Diallyl Phthalate (DAP) and features a top-mount opening design but does not provide inherent environmental sealing. The connector is not rated for immersion or sustained exposure to saltwater spray without additional encapsulation. For marine or corrosive environments, the 837-052-523-803 should be combined with conformal coating (acrylic or silicone) applied after assembly, or mechanically sealed using a molded cable boot or potting compound compatible with DAP. Testing per IEC 60068-2-52 (salt-fog corrosion) is recommended if the 837-052-523-803 will be exposed to marine environments for more than 2–3 years.
How do manufacturing tolerances on the 837-052-523-803 contact spacing affect impedance control in high-speed backplane designs?
The 837-052-523-803 maintains a nominal 0.156" pitch between contact centers, but manufacturing tolerances (typically ±0.005" per IPC standards) create cumulative positional drift across the 26-position row. Over the full 52-position span, pitch accumulation can result in ±0.025" uncertainty at the farthest contact. In controlled-impedance backplane designs, this variation translates to ±3–5% impedance swing across signal traces routed adjacent to the 837-052-523-803. High-speed applications (>500 MHz) should account for this tolerance drift during trace width and spacing calculations, or use impedance compensation techniques such as serpentine routing or shunt-capacitive elements.
What is the relationship between the 837-052-523-803's operating temperature range and the reliability of its contact resistance over time?
The 837-052-523-803 is rated for continuous operation from -40°C to 125°C, a 165°C span common in industrial and automotive applications. Contact resistance stability depends on temperature: at room temperature (~25°C), the gold plating provides excellent corrosion protection and consistent contact resistance (~10–50 mΩ per contact); at 125°C, oxidation of any exposed copper accelerates, and thermal expansion differentials between the 10.0µin gold layer and underlying copper alloy increase contact-surface microroughness, potentially raising contact resistance by 15–20%. For mission-critical low-signal applications, periodic contact resistance verification is recommended if the 837-052-523-803 will be cycled to the upper temperature limit repeatedly.
How does the 837-052-523-803's RoHS3 and REACH compliance status affect component sourcing and design documentation?
The 837-052-523-803 is confirmed RoHS3 compliant and REACH unaffected, making it suitable for EU market applications and OEM products subject to environmental directives. RoHS3 compliance means the connector contains no lead, cadmium, mercury, or brominated flame retardants in excess of specified thresholds. The copper alloy base material under the gold plating is typically brass (Cu/Zn), which does not trigger REACH Candidate List concern. However, if your design uses the 837-052-523-803 in a product subject to conflict minerals regulations (Section 1502, Dodd-Frank Act), verify the supply chain documentation with Mercury or your distributor. Some contract manufacturers may require Certificate of Conformance (CoC) documentation for the 837-052-523-803 even though compliance is standard.
What are the practical mechanical wear limits of the 837-052-523-803's cantilever contacts, and how should cyclic insertion be managed?
The 837-052-523-803 employs cantilever-type contacts, which flex during insertion and withdrawal. Typical mechanical life for this design is 50–100 mating cycles before measurable wear (contact tail score marks) becomes visible under 10× magnification. After 100 cycles, contact resistance can increase by 5–15 mΩ per contact due to surface scratching and oxide formation. The floating bobbin design reduces peak insertion forces, extending mechanical life compared to rigid-contact alternatives, but cyclic wear is still cumulative. For test fixtures or development platforms using the 837-052-523-803, plan for connector replacement every 100–150 cycles if contact resistance stability is mission-critical. For production systems with infrequent mating, cyclic wear is negligible across the connector's lifetime.
How should the 837-052-523-803 be handled during board assembly and test to minimize infant mortality failures?
The 837-052-523-803 is through-hole soldered, making its reliability sensitive to reflow and cleaning processes. Infant mortality (early-life failures) typically results from cold solder joints, flux residue bridging between adjacent contact tails, or mechanical stress during wave or selective soldering. Best practices include: (1) use low-temperature reflow profiles to minimize thermal stress on the DAP insulator body; (2) employ post-reflow cleaning (aqueous or semi-aqueous) to remove ionic flux residue, which can cause creepage failures in humid environments; (3) apply X-ray or automated optical inspection (AOI) to verify solder joint geometry around all 104 termination points (52 positions × 2 rows) before functional test; (4) perform burn-in testing (6–12 hours at 125°C) for mission-critical applications to screen latent defects in the 837-052-523-803 contact structure.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 837-052-523-803

Product Attribute 837-052-523-808 837-052-523-804 837-052-523-807 837-052-523-802
Part Number 837-052-523-808 837-052-523-804 837-052-523-807 837-052-523-802
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Features - - - Simultaneous Sampling
Gender - - - -
Contact Type - - - -
Termination Rows - - - -
Read Out - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Color - - - -
Number of Rows - - - -
Number of Positions - - - -
Flange Feature - - - -
Pitch - - - -
Contact Finish - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Material - - - -
Number of Positions/Bay/Row - - - -
Contact Finish Thickness - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Card Thickness - - - -
Card Type - - - -
Termination - - - -
Material - Insulation - - - -

837-052-523-803 Datasheet PDF

Download 837-052-523-803 pdf datasheets and EDAC Inc. documentation for 837-052-523-803 - EDAC Inc..

Datasheets
837-052-523-803 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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837-052-523-803 Image

837-052-523-803

EDAC Inc.
98D-837-052-523-803

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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