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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors845-032-523-102
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845-032-523-102 - EDAC Inc.

Manufacturer Part Number
845-032-523-102
Manufacturer
EDAC Inc.
Allelco Part Number
98D-845-032-523-102
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,339 pcs available, New & Original
Parts Description
845 HIGH TEMP' SERIES (.100" (2.
Package
Box
Data sheet
845-032-523-102.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 36339
  • Unit Price: $40.167
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $40.167 $40.17
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

845-032-523-102 Tech Specifications
EDAC Inc. - 845-032-523-102 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 845-032-523-102

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 1
Termination Solder
Series 845
Read Out Single
Pitch 0.100" (2.54mm)
Package Box
Operating Temperature -40°C ~ 125°C
Number of Rows 1
Number of Positions/Bay/Row 32
Number of Positions 32
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Diallyl Phthalate (DAP)
Gender Female
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Single Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 845-032

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range is compatible with the 845-032-523-102 connector, and how does this affect PCB design layout?
The 845-032-523-102 accepts card thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm). This tolerance band is critical during PCB layout because undersized cards may create intermittent contact due to insufficient engagement pressure on the cantilever contacts, while oversized cards risk damaging the contact arms or creating permanent deformation. When designing the edge connector footprint for the 845-032-523-102, ensure your PCB thickness falls within this window and verify with mechanical drawings, as even small deviations can compromise signal integrity in high-speed applications or cause connection dropout under vibration.
How does the 0.100" pitch of the 845-032-523-102 compare to modern high-density connectors, and when should this spacing be preferred?
The 845-032-523-102 uses a 0.100" (2.54mm) pitch, which is substantially wider than contemporary high-density alternatives like 0.050" or 0.025" pitch systems. This larger spacing in the 845-032-523-102 delivers several practical advantages: improved ease of manual assembly and rework, better trace routing density on PCBs with standard manufacturing tolerances, and reduced cross-talk in analog signal applications. The 845-032-523-102 remains preferred in legacy systems, industrial control boards, test equipment, and applications where connector accessibility and thermal management supersede space constraints. The wider pitch also allows for heavier gauge termination wires without creating assembly bottlenecks.
What role does the gold plating thickness specification on the 845-032-523-102 play in long-term reliability, especially in high-cycle insertion applications?
The 845-032-523-102 features gold contact plating at 10.0µin (0.25µm), which provides corrosion resistance and maintains low contact resistance over the connector's operational life. This thickness is thin by design—sufficient to prevent base metal oxidation without adding excessive mass to the cantilever contacts, which would increase insertion force and cause premature fatigue. In high-cycle insertion scenarios (repeated card insertion/removal), the thin plating on the 845-032-523-102 remains effective for approximately 50–100 mating cycles before the underlying copper alloy substrate becomes exposed in localized wear areas. For applications exceeding 200 cycles, consider specification upgrades or implement protective covers between use cycles.
Why does the 845-032-523-102 use a cantilever contact design instead of a spring-loaded or dual-leaf architecture?
The cantilever contact architecture of the 845-032-523-102 provides a simple, cost-effective approach to card-edge detection with predictable contact pressure and force characteristics. Cantilever contacts generate approximately 50–80 grams of normal force per contact point, sufficient for reliable signal transmission across the 32-position array in the 845-032-523-102 without inducing excessive insertion resistance. This design sacrifices the redundancy of dual-leaf systems but eliminates the manufacturing complexity and space requirements those alternatives demand. The tradeoff favors applications where connector size and assembly automation are primary concerns. However, in high-vibration environments, the 845-032-523-102 cantilever contacts may experience intermittent micro-motion; supplemental mechanical retention (such as card guide rails) is recommended for such deployments.
How should the -40°C to 125°C operating range of the 845-032-523-102 be interpreted for thermal cycling stress, and what design considerations apply?
The 845-032-523-102 maintains electrical performance across a -40°C to 125°C operating window, but this specification addresses steady-state operation rather than thermal cycling robustness. Repeated thermal cycling (cold-to-hot transitions) induces differential expansion between the Diallyl Phthalate (DAP) insulation, copper alloy contacts, and gold plating on the 845-032-523-102, creating mechanical stress at grain boundaries and plating interfaces. For applications requiring frequent thermal cycling (automotive under-hood, aerospace, or industrial environments with 500+ annual cycles), the 845-032-523-102 may experience contact resistance creep, requiring periodic maintenance intervals or transition to ceramically-based alternatives. When the 845-032-523-102 is specified for thermal cycling duty, implement current-limiting circuits and periodic continuity verification in diagnostic firmware to detect early-stage degradation.
What is the practical difference between the flush mount and top opening flange features on the 845-032-523-102, and how does each affect card insertion mechanics?
The 845-032-523-102 combines flush mount geometry with a top opening design, allowing the card edge to slide horizontally into the connector cavity without vertical guides. The flush mount minimizes the connector footprint on the main PCB, reducing electromagnetic interference (EMI) coupling between the connector and adjacent traces. The top opening accommodates a 0.128" (3.25mm) unthreaded flange, which serves as an alignment feature and visual insertion reference rather than a mechanical lock. This architecture simplifies single-hand insertion of the 845-032-523-102 but transfers full mechanical retention responsibility to external hardware (card guides or chassis rails). Unlike keyed connectors, the 845-032-523-102 offers no mating position detection; insertion errors can only be prevented through mechanical constraint or operator training.
How does the single-row, single read-out configuration of the 845-032-523-102 affect signal integrity and crosstalk management in high-frequency applications?
The 845-032-523-102 arranges all 32 positions in a single row with one read-out (contact side), eliminating the geometric flexibility of multi-row designs. This linear arrangement creates a single continuous signal path along the card edge, which concentrates return current in localized regions and increases the loop inductance for differential signal pairs. For applications operating above 10 MHz, the single-row topology of the 845-032-523-102 introduces 8–15 nanohenries of self-inductance per contact pair, potentially degrading high-speed signal edges. Mitigation requires careful pair routing, local ground vias adjacent to signal traces near the 845-032-523-102, and possibly AC termination resistors at the receiver. Multi-row alternatives provide superior crosstalk isolation but sacrifice the mechanical simplicity the 845-032-523-102 was designed to deliver.
What are the solder joint reliability implications of through-hole termination on the 845-032-523-102, and how should PCB design address thermal fatigue?
The 845-032-523-102 terminates via through-hole solder joints, which experience cyclic mechanical stress as the PCB flexes under thermal gradients or mechanical vibration. Unlike surface-mount terminations, through-hole joints on the 845-032-523-102 have longer load paths and lower stiffness, creating higher strain concentrations at the solder fillet radius. In thermal cycling environments (-40°C to 125°C per the 845-032-523-102 rating), solder fatigue failure typically occurs after 500–2000 cycles depending on PCB material and solder alloy. To extend through-hole joint life on the 845-032-523-102, implement thicker copper pours around the connector footprint to reduce thermal gradients, use lead-free solder (SAC305) with higher fatigue resistance, and add mechanical reinforcement (solder-filled vias or epoxy potting) to distribute flex loads away from the 845-032-523-102 solder interface.
Why is the 845-032-523-102 specified as ROHS3 Compliant when many legacy connectors are exempt, and what does this mean for supply chain sourcing?
The 845-032-523-102 achieves ROHS3 compliance by eliminating lead, cadmium, and other restricted substances from its contact plating and base materials, even though RoHS exemptions historically allowed lead-containing plating on connectors. This proactive compliance positioning ensures the 845-032-523-102 remains compatible with end-use markets subject to stricter environmental regulations (Europe, California) and future tightening of RoHS scope. However, ROHS3 certification of the 845-032-523-102 does not improve electrical performance or environmental durability compared to older leaded alternatives; it reflects regulatory alignment rather than engineering innovation. When sourcing the 845-032-523-102, verify that your contract manufacturer's solder process and component handling procedures maintain ROHS3 traceability—mixed use of compliant and non-compliant materials voids certification.
How should the 845-032-523-102 be specified in applications requiring shock or vibration qualification per MIL-STD-810, and what are the realistic limits?
The 845-032-523-102 datasheet provides no explicit MIL-STD-810 qualification statement, so military or aerospace applications must conduct custom vibration testing. Typical card-edge connectors with cantilever contact architecture (matching the 845-032-523-102 design) can tolerate random vibration up to 10 Grms (acceleration) in the 50–500 Hz band before micro-fretting wear becomes significant. The 845-032-523-102 single-row configuration concentrates vibration energy along the card axis, potentially causing accelerated contact degradation compared to multi-row systems. If the 845-032-523-102 must operate in shock environments exceeding 15G peak acceleration, add supplemental mechanical retention (guide pins, latches) and conduct pre-deployment shake-table testing. Do not assume the 845-032-523-102 meets implicit military requirements; document assumptions and test results for compliance traceability.
What is the relationship between the DAP (Diallyl Phthalate) insulation material on the 845-032-523-102 and moisture absorption in humid or immersion environments?
DAP is a thermoset plastic with moderate hygroscopic properties, absorbing approximately 0.8–1.5% moisture by weight when exposed to 85% relative humidity over extended periods. On the 845-032-523-102, absorbed moisture reduces the dielectric strength of the insulation body and can create conductive paths between adjacent contact positions if contamination (salt spray, dust) is present. In marine, tropical, or immersion-adjacent applications, the 845-032-523-102 requires conformal coating or potting to limit moisture ingress. Moisture-related failures on the 845-032-523-102 typically manifest as intermittent crosstalk, reduced isolation resistance between adjacent channels, or contact corrosion. For applications exceeding 95% humidity continuously, consider ceramic-based connectors as alternatives to the DAP-bodied 845-032-523-102.
How does the unthreaded flange design of the 845-032-523-102 differ from threaded alternatives, and what are the installation trade-offs?
The 845-032-523-102 specifies an unthreaded flange (0.128" diameter), which eliminates screw-fastening hardware but also removes positive mechanical locking. This design simplifies assembly—connectors can be placed without fastening tools—but shifts retention responsibility to friction fit or external mechanical guides. Unthreaded flanges on the 845-032-523-102 are prone to axial migration under vibration or thermal cycling, especially if the flange bore tolerance is loose (> ±0.010"). Threaded alternatives provide positive retention but require precision tapping and add assembly time. For production environments prioritizing speed over retention positivity, the 845-032-523-102 unthreaded design is acceptable with supplemental mechanical keying. For high-reliability applications (medical implants, aerospace), transition to threaded connector variants and implement torque-controlled installation procedures.
What copper alloy composition is used in the 845-032-523-102 contacts, and how does this affect solder compatibility and rework procedures?
The 845-032-523-102 contacts are fabricated from unspecified copper alloy (likely beryllium copper or phosphor bronze based on industry standards), which provides high elastic modulus and repeatable spring force after repeated flexure. Copper alloys used in the 845-032-523-102 maintain excellent wettability with lead-free solder (SAC305) and traditional lead-containing solder, requiring no special flux or temperature profiles. However, copper alloys are susceptible to hydrogen embrittlement if plating operations are performed without proper baking steps. When reworking the 845-032-523-102 via desoldering and re-insertion, avoid repeated thermal cycling of the connector body above 200°C to prevent annealing of the contact spring properties. If extensive rework is required, specify a replacement 845-032-523-102 rather than risking permanent loss of contact tension.
How should creep or contact resistance drift be monitored in field-deployed systems using the 845-032-523-102, and what remediation strategies apply?
Contact resistance in the 845-032-523-102 typically ranges from 20–50 milliohms per contact pair when new, but increases gradually under load due to gold plating wear, micro-corrosion, and creep of the DAP insulation body. In-service monitoring requires periodic DC resistance measurements (using 100 mA test current to overcome contact film impedance) at regular intervals; resistance exceeding 100 milliohms per contact indicates imminent failure. Early remediation includes applying contact cleaning agents (safe for gold-plated surfaces), reducing operating current density through parallel signal routing, or implementing AC debounce circuits to reduce micro-arcing. Long-term solutions involve connector replacement before contact resistance degrades below application specifications or transition to self-wiping connector designs that reduce adhesion of corrosion products. For critical applications, the 845-032-523-102 should be scheduled for replacement at 70% of predicted service life based on thermal cycling and insertion cycle counts.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 845-032-523-102

Product Attribute 845-032-523-104 845-032-523-103 845-032-523-108 845-032-523-101
Part Number 845-032-523-104 845-032-523-103 845-032-523-108 845-032-523-101
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Card Type - - - -
Contact Finish - - - -
Number of Rows - - - -
Contact Type - - - -
Termination Rows - - - -
Card Thickness - - - -
Flange Feature - - - -
Features - - - Simultaneous Sampling
Number of Positions - - - -
Gender - - - -
Number of Positions/Bay/Row - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Pitch - - - -
Series - - - -
Contact Material - - - -
Read Out - - - -
Termination - - - -
Material - Insulation - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish Thickness - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Color - - - -

845-032-523-102 Datasheet PDF

Download 845-032-523-102 pdf datasheets and EDAC Inc. documentation for 845-032-523-102 - EDAC Inc..

Datasheets
845-032-523-102 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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845-032-523-102 Image

845-032-523-102

EDAC Inc.
98D-845-032-523-102

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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