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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors845-063-523-407
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845-063-523-407 - EDAC Inc.

Manufacturer Part Number
845-063-523-407
Manufacturer
EDAC Inc.
Allelco Part Number
98D-845-063-523-407
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,755 pcs available, New & Original
Parts Description
CONN EDGE SINGLE FML 63POS 0.100
Package
Box
Data sheet
845-063-523-407.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 31755
  • Unit Price: $140.982
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $140.982 $140.98
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

845-063-523-407 Tech Specifications
EDAC Inc. - 845-063-523-407 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 845-063-523-407

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 1
Termination Solder
Series 845
Read Out Single
Pitch 0.100" (2.54mm)
Package Box
Operating Temperature -40°C ~ 125°C
Number of Rows 1
Number of Positions/Bay/Row 63
Number of Positions 63
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Diallyl Phthalate (DAP)
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, M3
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Single Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 845-063

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 845-063-523-407 accommodate, and how does this affect PCB edge connector design?
The 845-063-523-407 is engineered to accept cards with a thickness range of 0.054" to 0.070" (1.37mm to 1.78mm). This relatively narrow tolerance window reflects the cantilever contact design, which relies on consistent spring pressure against the card edge. Cards outside this range may experience incomplete contact engagement or premature contact wear. During PCB stackup design, account for copper weight, solder mask, and any edge plating when targeting this specification. The single-row, 63-position configuration of the 845-063-523-407 assumes uniform card thickness across the entire edge length; variations can cause skewed insertion or uneven contact pressure distribution.
How does the 0.100" pitch on the 845-063-523-407 compare to alternatives for high-density interconnect applications?
The 845-063-523-407 uses 0.100" (2.54mm) pitch, which is a standard spacing for industrial edge connectors but represents a lower-density option compared to 0.050" or finer-pitch alternatives. With 63 positions across a single row, the 845-063-523-407 occupies approximately 6.3 inches of edge length. For applications requiring higher pin counts in compact form factors, finer-pitch connectors reduce physical footprint but introduce additional assembly complexity and cost. The 0.100" pitch on the 845-063-523-407 provides a practical balance for legacy systems, test fixtures, and applications where board-edge real estate is not constrained and mechanical robustness is prioritized over miniaturization.
What is the practical current-carrying capacity per contact on the 845-063-523-407, and how does gold plating thickness affect reliability?
While the datasheet does not specify amperage per contact, the copper alloy base material of the 845-063-523-407 with 10.0µin (0.25µm) gold finish is typical of connectors rated for 1–3A per contact in standard applications. The gold finish provides corrosion resistance and ensures low contact resistance but at 0.25µm thickness represents a relatively thin plating. This thickness is adequate for dry-circuit and signal applications but may exhibit accelerated wear under high-cycling insertions or high-current repetitive switching. For designs approaching thermal limits per contact, verify current distribution across multiple contacts rather than relying on fewer signal lines through the 845-063-523-407.
How does the diallyl phthalate (DAP) insulation material of the 845-063-523-407 perform in high-temperature or humid environments?
The 845-063-523-407 uses diallyl phthalate (DAP) for insulation, which operates across -40°C to 125°C and maintains dimensional stability better than general-purpose phenolics. DAP offers good electrical properties and moisture resistance but absorbs moisture more readily than polyimide alternatives at relative humidity above 85%. In applications subject to thermal cycling near the 125°C upper limit or prolonged exposure to high humidity, DAP on the 845-063-523-407 may exhibit slight dimensional changes that accumulate contact resistance over extended service life. For aerospace or medical applications, confirm whether the DAP material of the 845-063-523-407 meets secondary specifications such as CTI (Comparative Tracking Index) or outgassing limits; standard commercial grades may not satisfy these requirements.
What is the insertion and removal force specification for the 845-063-523-407, and how does this affect integration into automated test fixtures?
The datasheet does not explicitly state insertion or removal force for the 845-063-523-407, which is typical for distributor-level documentation. However, the cantilever contact type and 63-position single-row configuration suggest a moderate insertion force—likely in the range of 10–20 lbf (45–90N) total across all contacts. This force range makes manual insertion feasible but may require guided fixtures or alignment rails for repeatable insertion in automated test environments. If the 845-063-523-407 is integrated into test handlers or burn-in sockets, verify actual insertion forces through prototype testing or contact the manufacturer, as underestimating force can result in incomplete contact engagement and false test results.
How does the top-mount opening and threaded M3 insert on the 845-063-523-407 affect board-level assembly and mechanical retention?
The 845-063-523-407 includes a top-mount opening with threaded M3 insert, enabling mechanical retention via fastener through the connector body to the PCB. This feature provides mechanical strain relief and prevents accidental card withdrawal under vibration or handling stress. The M3 threaded insert requires a corresponding through-hole in the PCB stackup and a mating M3 fastener; ensure adequate clearance between the fastener path and adjacent copper traces or via fields. The through-hole mounting of the 845-063-523-407 positions solder joints near the mechanical mounting point, which can create stress concentration during thermal cycling. Route signal traces away from the M3 mounting hole region to minimize electromagnetic coupling and ensure solder joint integrity.
Is the 845-063-523-407 suitable for applications requiring frequent insertion cycles, and what degradation should be anticipated?
The cantilever contact design and 10.0µin gold finish of the 845-063-523-407 are engineered for moderate insertion-cycle life, typically 50–200 cycles before perceptible contact resistance increase. Each insertion cycle flexes the cantilever springs, inducing strain on the base material; repeated stress gradually reduces contact pressure and spring force. Applications requiring >500 cycles per position should consider reinforced contact designs or evaluate sealed connectors with reduced exposure to oxidation. For the 845-063-523-407, if your design includes firmware-selectable test routines that trigger frequent connector mating, validate prototype hardware after 100–150 cycles to establish baseline contact resistance and plan for periodic connector replacement or redesign with higher-cycle alternatives.
How should the 845-063-523-407 be protected from ESD, and what grounding approach is recommended during assembly and test?
The 845-063-523-407 itself exhibits moderate ESD resilience due to the gold-plated copper alloy contacts, but the diallyl phthalate insulation can accumulate static charge, particularly in low-humidity environments below 40% RH. During assembly, the PCB with soldered 845-063-523-407 should be handled on conductive work surfaces or in static-dissipative bags. When the 845-063-523-407 is integrated into a test fixture or hot-swap application, establish a ground connection through the card edge before any signal contacts engage; this ensures that any static charge on the incoming card is safely discharged before signal lines are powered. If signal integrity is sensitive (high-speed data lines), use a shielded test probe or dedicated ground pin on the 845-063-523-407 to establish ground reference prior to any differential signal contact.
What is the difference between the 845-063-523-407 and a 845-063 base series connector, and when should each be specified?
The 845-063-523-407 is a specific part-number variant within the 845-063 base series, defined by the full 63-position, single-row, female, 0.100" pitch configuration with the standard green DAP body. Other variants within the 845-063 series may differ in number of positions (e.g., 845-063-032 for 32 positions), contact gender, or material options. If your design requires a pin count or row configuration not offered by the 845-063-523-407, the base series number 845-063 can be used to search for compatible alternatives from the manufacturer. The 845-063-523-407 represents a mature, widely-stocked variant; alternative configurations may have longer lead times or higher minimum order quantities.
How does the RoHS3 compliance of the 845-063-523-407 affect long-term solder joint reliability?
The 845-063-523-407 is RoHS3 compliant, confirming the absence of lead in the solder-side finish and plating. Lead-free soldering (typically SAC305 or equivalent) on the 845-063-523-407 produces joints with slightly higher mechanical brittleness compared to historical lead-tin alloys, particularly under thermal cycling stress. The through-hole solder joints on the 845-063-523-407 are susceptible to crack initiation near the connector body during rapid thermal transitions (>10°C/minute). Mitigation includes stress-relief routing (avoid sharp angles near solder pads), conformal coating to reduce moisture-induced expansion differential, and thermal profiling during manufacturing to verify adequate reflow and joint wetting. If the application environment includes >500 thermal cycles between -40°C and 125°C, conduct thermal-shock testing on 845-063-523-407 prototypes to establish joint reliability margins.
Can the 845-063-523-407 be successfully salvaged or reworked if solder joints require repair?
The 845-063-523-407 connector body is constructed from diallyl phthalate (DAP), which has a glass transition temperature (Tg) in the range of 160–180°C. Conventional reflow temperatures (240–260°C peak) approach or exceed this threshold. Rework heating of the 845-063-523-407 above 220°C risks softening the insulation material, causing dimensional distortion, contact misalignment, or permanent deformation of the cantilever springs. If solder joint repair is required, use low-temperature rework techniques (localized heat via micro-soldering iron) targeting the joint itself rather than the connector body. Consider mechanical reinforcement or an adhesive backing (non-conductive epoxy) applied before rework to stabilize the 845-063-523-407 and reduce thermal stress. If multiple rework cycles are anticipated, plan for connector replacement rather than repeated thermal exposure.
What signal-integrity considerations should be addressed when routing 63 traces from the 845-063-523-407 edge connector into the PCB interior?
The 845-063-523-407 presents a challenging signal-integrity scenario due to the single-row, 63-position format spanning approximately 6.3 inches of edge length. Trace lengths from the connector to load circuits vary significantly (outer contacts travel 6+ inches while center contacts travel ~3 inches), creating skew and propagation-delay mismatches. For bus signals (address or data), route traces in organized groups with matched lengths and consistent layer assignment to minimize skew. High-speed or clock signals should utilize the center positions of the 845-063-523-407 to minimize trace length and transit time. Ground return paths must be continuous and in close proximity to signal traces; consider a ground plane or interleaved ground contacts if the PCB layer stack accommodates them. The cantilever contact geometry of the 845-063-523-407 can introduce contact-resistance variability between positions, affecting signal timing; allocate a 3–5% timing margin in protocol timing specifications if using multiple 845-063-523-407 contacts.
How should the 845-063-523-407 connector be specified in procurement to ensure supply-chain continuity and design compatibility?
The full part number 845-063-523-407 must be used in purchase orders and design documentation to guarantee correct connector variant. The base number 845-063 alone may match multiple configurations, leading to incorrect substitutions. Verify with the manufacturer or distributor that the 845-063-523-407 inventory includes the specific features required: 63 positions, single row, female gender, 0.100" pitch, green DAP body, M3 flange, and gold contact finish. Supply-chain continuity for the 845-063-523-407 is generally stable due to its industrial heritage, but longer lead times (8–12 weeks) should be anticipated for non-stock orders. If redesign flexibility exists, confirm alternative qualified part numbers within the 845-063 series to mitigate supply disruption. Document the 845-063-523-407 specification in design release notes and BOM with clear reference to connector function and pin assignment.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 845-063-523-407

Product Attribute 845-063-523-403 845-063-523-607 845-063-523-107 845-063-523-402
Part Number 845-063-523-403 845-063-523-607 845-063-523-107 845-063-523-402
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Termination Rows - - - -
Material - Insulation - - - -
Features - - - Simultaneous Sampling
Termination - - - -
Card Type - - - -
Pitch - - - -
Card Thickness - - - -
Series - - - -
Gender - - - -
Contact Material - - - -
Number of Positions - - - -
Read Out - - - -
Contact Finish Thickness - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Positions/Bay/Row - - - -
Color - - - -
Contact Finish - - - -
Number of Rows - - - -
Flange Feature - - - -
Contact Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

845-063-523-407 Datasheet PDF

Download 845-063-523-407 pdf datasheets and EDAC Inc. documentation for 845-063-523-407 - EDAC Inc..

Datasheets
845-063-523-407 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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845-063-523-407 Image

845-063-523-407

EDAC Inc.
98D-845-063-523-407

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