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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors846-054-522-204
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846-054-522-204 - EDAC Inc.

Manufacturer Part Number
846-054-522-204
Manufacturer
EDAC Inc.
Allelco Part Number
98D-846-054-522-204
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,458 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 54POS 0.125
Package
Box
Data sheet
846-054-522-204.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 44458
  • Unit Price: $57.771
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $57.771 $57.77
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

846-054-522-204 Tech Specifications
EDAC Inc. - 846-054-522-204 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 846-054-522-204

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 846
Read Out Dual
Pitch 0.125" (3.18mm)
Package Box
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 27
Number of Positions 54
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Diallyl Phthalate (DAP)
Gender Female
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.156" (3.96mm) Dia
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 846-054

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range does the 846-054-522-204 support, and how does this affect PCB layout decisions?
The 846-054-522-204 is designed for cards with a thickness between 0.054" and 0.070" (1.37mm to 1.78mm). This range is typical for standard FR-4 PCBs with copper and solder mask layers. During layout, ensure your card edge profile matches this specification; undersized cards may fail to seat fully and create intermittent contact, while oversized cards risk bending the cantilever contacts during insertion. The dual-edge configuration of the 846-054-522-204 means both sides of the card interface simultaneously, so thickness consistency across the entire card edge is critical to avoid stress concentration on individual contacts.
How does the 0.125" pitch of the 846-054-522-204 compare to finer-pitch alternatives, and what are the routing trade-offs?
The 846-054-522-204 uses a 0.125" (3.18mm) pitch, which is relatively coarse compared to modern 0.100" or 0.080" pitch connectors. This larger spacing simplifies PCB routing behind the connector footprint, reducing layer count requirements and improving signal integrity for lower-frequency designs. However, the 846-054-522-204's 54-position capacity across dual edges is achieved through increased physical size, making it less suitable for compact form factors. The coarser pitch also limits maximum edge connection density, so high-channel-count applications may require multiple 846-054-522-204 connectors or migration to specialized backplane architectures.
Can the 846-054-522-204 handle high-speed digital signals, and what precautions apply to signal integrity?
The 846-054-522-204's cantilever contact design and relatively coarse 0.125" pitch introduce capacitive coupling and crosstalk challenges for high-speed applications above approximately 50 MHz. The gold-plated copper alloy contacts minimize resistance but do not eliminate parasitic effects inherent to edge connectors. For the 846-054-522-204, signal integrity requires careful layer stackup planning, ground plane return paths directly beneath the connector, and potential use of series termination or differential pair routing. Applications using the 846-054-522-204 at frequencies above 100 MHz should validate signal quality with controlled impedance measurements rather than assume performance.
What is the practical current-carrying capacity per contact on the 846-054-522-204, and how does contact resistance affect thermal design?
The 846-054-522-204 datasheet does not explicitly state per-contact current limits, but dual-edge 54-position connectors with cantilever contacts typically support 5–15 amperes per contact depending on dwell time and environmental cooling. Contact resistance for the 846-054-522-204's gold-plated copper alloy is approximately 1–5 milliohms per mated pair, introducing resistive heating that scales with current density. For high-current applications using the 846-054-522-204, parallel contacts via multiple 846-054-522-204 connectors or heavier gauge conductors on the card itself reduce localized heating. Operating the 846-054-522-204 near its upper temperature limit (-40°C to 125°C) with sustained high current increases contact fretting corrosion risk.
How does the 846-054-522-204's cantilever contact design affect insertion force and connector reliability during repeated mating cycles?
The 846-054-522-204's cantilever contacts rely on elastic deformation to maintain wiping action and current continuity during insertion. Each mating cycle on the 846-054-522-204 applies stress to the contact spring, gradually reducing contact pressure through plastic deformation. Typical card edge connectors with this design support 50–200 insertion cycles before measurable contact resistance degradation occurs. For applications requiring frequent card changes, the 846-054-522-204 insertion force should be validated during first assembly; if force exceeds manufacturer specifications, contact wear accelerates. The dual-edge configuration of the 846-054-522-204 distributes mating force across both rows, but uneven card seating can concentrate stress on one edge.
Is the 846-054-522-204 suitable for outdoor or harsh environments, and what environmental protections are necessary?
The 846-054-522-204 is rated for -40°C to 125°C operation and uses ROHS3-compliant materials (DAP insulation with gold-plated contacts), making it suitable for industrial and military applications. However, the 846-054-522-204's open, unthreaded flush-mount design offers limited environmental sealing; moisture ingress into the contact area can cause corrosion even with gold plating. For outdoor or high-humidity deployments, the 846-054-522-204 should be protected with conformal coating on the carrier PCB, sealed card edge guides, or environmental enclosures. The green insulation color of the 846-054-522-204 is standard but does not provide additional environmental protection.
What is the difference between the dual-edge, dual-readout configuration of the 846-054-522-204 and single-edge alternatives in terms of redundancy and signal routing?
The 846-054-522-204 features two contact rows (27 positions per row, 54 total) that mate simultaneously on both edges of the inserted card. This dual-edge, dual-readout design provides inherent redundancy for critical signal paths; if one contact row becomes intermittent, the parallel row can maintain connectivity. However, the 846-054-522-204 requires careful routing discipline—signals cannot be arbitrarily assigned to either row without considering ground plane distribution and cross-talk. Some designs treat the 846-054-522-204's dual rows as independent buses (video + control, for example), while others parallel critical signals for active redundancy. Single-edge alternatives reduce routing complexity but eliminate this built-in redundancy option.
How does the 846-054-522-204's 10.0µin (0.25µm) gold plating thickness compare to industry standards, and does it affect contact longevity?
The 846-054-522-204 specifies 10.0µin of gold over the copper alloy base, which is below the 20–50µin thickness common in high-reliability aerospace connectors but typical for commercial-grade edge connectors. The thinner gold layer on the 846-054-522-204 reduces material cost and insertion force but accelerates wear-through of the gold plating during repeated mating. After approximately 50–100 cycles, the base copper alloy may begin to oxidize if the 846-054-522-204 is exposed to elevated humidity. For applications requiring long service life with minimal mating cycles, the 846-054-522-204's plating thickness is acceptable; for high-cycle or harsh environments, specify thicker gold or consider nickel underlayers.
What mounting considerations apply when installing the 846-054-522-204 on a system backplane, and how is mechanical alignment ensured?
The 846-054-522-204 uses through-hole solder termination, requiring PCB via placement aligned with the connector pin pattern. The flush-mount, top-opening flange with 0.156" unthreaded features provides mechanical guidance but minimal positive alignment; the 846-054-522-204 relies on careful PCB tolerance and card edge guide rails for repeatable seating. During assembly, the 846-054-522-204 must be soldered perpendicular to the PCB to avoid skewed mating; even slight angular misalignment causes uneven contact pressure across the dual rows. For high-volume production, a solder stencil fixture and optical verification of 846-054-522-204 placement before reflow improves first-pass reliability.
Are there known compatibility issues between the 846-054-522-204 and specific card edge profiles or guide rail designs?
The 846-054-522-204 is designed for non-specified dual-edge cards (0.054"–0.070" thickness) with standard 0.125" pitch, but compatibility depends on card guide alignment and edge profile geometry. Some guide rail designs used in legacy systems expect chamfered or beveled card edges; a square-cut edge on the card risks binding with the 846-054-522-204 or uneven contact engagement. The 846-054-522-204's top-opening flange design assumes insertion from the top face; retrofitting the 846-054-522-204 into systems designed for different connector families (such as 0.100" pitch or beveled-edge variants) requires prototype testing of insertion force and contact resistance before production deployment.
How do temperature cycling and thermal stress affect the 846-054-522-204's solder joint reliability over system lifetime?
The 846-054-522-204 operates across a -40°C to 125°C range, a span of 165°C that induces 2–3 complete thermal cycles per mission profile in some industrial equipment. The mismatch between FR-4 PCB expansion (17 ppm/K) and copper alloy contact pins (17 ppm/K) is minimal, but the solder joint at the 846-054-522-204's through-hole termination experiences differential stress with the PCB laminate (copper plating and insulation layers). High-reliability applications should specify no-lead-free or SAC305 solder with controlled reflow profiles to minimize void formation around the 846-054-522-204 pins. Periodic thermal cycling testing of 846-054-522-204 sample boards (IPC-9701 or equivalent) is recommended for long-life systems.
What testing and qualification procedures validate that a production run of 846-054-522-204 connectors meets contact resistance and mechanical performance specifications?
Contact resistance on the 846-054-522-204 should be verified using low-force contact resistance measurement (typically <10 mΩ per contact pair) immediately after mating and again after environmental stress (humidity, thermal cycling, or vibration per MIL-STD-1312). Mechanical performance testing of the 846-054-522-204 includes insertion force measurement (should be repeatable across multiple 846-054-522-204 samples) and visual inspection for contact misalignment or flange damage. For applications requiring traceability, establish a first-article-inspection protocol for the 846-054-522-204 from each manufacturing lot, measuring contact geometry via optical microscopy and gold plating thickness via X-ray fluorescence. Electrical continuity testing across all 54 contact positions of the 846-054-522-204 should be performed on 100% of connectors before shipment.
Can the 846-054-522-204 be reworked or repaired if a contact becomes damaged or a solder joint fails during system assembly?
Individual contacts on the 846-054-522-204 cannot be replaced without connector desoldering and PCB damage. If a single contact on the 846-054-522-204 fails during assembly, the entire connector must be removed via hot-air rework or selective wave soldering and replaced. The 846-054-522-204's through-hole termination design allows mechanical removal by drilling out solder joints, but this risks damaging the PCB pad and traces. For low-volume prototypes, accepting a non-functional contact may be acceptable if redundancy exists; for production, implement 100% continuity testing of 846-054-522-204 immediately after solder reflow to catch defects before system integration. Rework training and process qualification are essential for complex assemblies using the 846-054-522-204.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 846-054-522-204

Product Attribute 846-054-522-207 846-054-522-804 846-054-522-208 846-054-522-202
Part Number 846-054-522-207 846-054-522-804 846-054-522-208 846-054-522-202
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Read Out - - - -
Material - Insulation - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Color - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Rows - - - -
Flange Feature - - - -
Termination - - - -
Contact Finish Thickness - - - -
Number of Positions - - - -
Number of Positions/Bay/Row - - - -
Card Thickness - - - -
Contact Finish - - - -
Contact Material - - - -
Contact Type - - - -
Termination Rows - - - -
Features - - - Simultaneous Sampling
Series - - - -
Card Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Gender - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Pitch - - - -

846-054-522-204 Datasheet PDF

Download 846-054-522-204 pdf datasheets and EDAC Inc. documentation for 846-054-522-204 - EDAC Inc..

Datasheets
846-054-522-204 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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846-054-522-204 Image

846-054-522-204

EDAC Inc.
98D-846-054-522-204

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