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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors895-016-524-808
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895-016-524-808 - EDAC Inc.

Manufacturer Part Number
895-016-524-808
Manufacturer
EDAC Inc.
Allelco Part Number
98D-895-016-524-808
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,679 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 16POS 0.100
Package
Bulk
Data sheet
895-016-524-808.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 36679
  • Unit Price: $59.771
  • Subtotal: $0.00

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1+ $59.771 $59.77
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

895-016-524-808 Tech Specifications
EDAC Inc. - 895-016-524-808 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 895-016-524-808

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 895
Read Out Dual
Pitch 0.100" (2.54mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 8
Number of Positions 16
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Polyphenylene Sulfide (PPS)
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 895-016

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range is the 895-016-524-808 designed to accommodate, and how does this affect PCB layout decisions?
The 895-016-524-808 accommodates cards with a thickness range of 0.054" to 0.070" (1.37mm to 1.78mm). This specification is critical during PCB edge connector design because the card must fit snugly within the dual-edge contact geometry without excessive lateral movement or binding. Designers must verify that the final PCB thickness—after accounting for solder mask, copper layers, and any protective coatings—falls within this window. Undersized cards may cause inconsistent contact pressure and signal integrity issues, while oversized cards risk mechanical damage to the 895-016-524-808 contact cantilevers during insertion or removal cycles.
How does the dual-row, 16-position configuration of the 895-016-524-808 differ from single-row alternatives in terms of signal routing and footprint density?
The 895-016-524-808 provides 16 total positions arranged as two rows of 8 contacts each, creating a compact dual-edge footprint that maximizes signal density compared to single-row 8-position designs. This configuration allows engineers to route 16 independent signal paths, ground returns, or power rails within a smaller edge profile—approximately half the linear dimension of two stacked single-row connectors. The tradeoff is that the 895-016-524-808's dual-row geometry requires careful consideration of high-speed signal integrity; adjacent rows may introduce crosstalk if not properly impedance-matched or isolated with ground planes. Single-row alternatives offer simpler layout but demand additional edge-connector stacking or wider cards to achieve equivalent signal count.
What role does the 10.0µin gold contact finish on the 895-016-524-808 play in long-term reliability, and when might thicker plating be necessary?
The 895-016-524-808 features a 10.0µin (0.25µm) gold contact finish applied over a copper alloy base. This thickness is optimized for typical insertion cycles (50–500 mating cycles depending on use case) and provides corrosion resistance in indoor, controlled environments. However, the 895-016-524-808 gold plating may thin rapidly in high-humidity, salt-air, or thermal-cycling applications where repeated insertion stress accelerates wear. In such scenarios, components with 20–50µin gold plating are often specified to extend service life. For applications requiring minimal connector replacement and predictable contact resistance over a 10+ year lifespan, validation of the 895-016-524-808 under actual environmental conditions is recommended before design lock.
How do the 0.100" pitch contacts on the 895-016-524-808 affect signal integrity for high-speed or high-frequency applications?
The 895-016-524-808 uses a 0.100" (2.54mm) pitch, which is a legacy standard optimized for mechanical robustness and cost, not for high-speed digital or RF performance. At 2.54mm spacing, the 895-016-524-808 contacts exhibit relatively high mutual capacitance and inductance between adjacent signal lines, creating crosstalk susceptibility above ~50–100MHz. Designers working with gigabit Ethernet, PCI Express, or RF signals should expect signal degradation unless the 895-016-524-808 is paired with careful impedance control, solid ground planes adjacent to all signal rows, and possibly series termination. For baseband analog, low-speed digital (< 10MHz), or discrete power/ground distribution, the 895-016-524-808 pitch presents no practical limitation.
Is the 895-016-524-808 suitable for hot-swap or blind-mating applications, and what insertion force considerations apply?
The 895-016-524-808 is designed for board-to-board or card-cage edge insertion but is not specified for hot-swap blind mating. The dual-edge, top-mount geometry and cantilever contact design of the 895-016-524-808 require alignment before insertion; misaligned insertion can bend or permanently deform the contacts. Additionally, edge connectors like the 895-016-524-808 typically exhibit high insertion force (often 5–15N for a 16-position configuration) due to friction across multiple contact points simultaneously. This is acceptable for planned, guided insertion but creates hazards in blind-mate scenarios. If hot-swap capability is required, consider keyed or guided connectors with lower insertion forces and redundant alignment features rather than relying on the 895-016-524-808.
What is the difference between the 895-016-524-808 and other Mercury 895 series connectors in terms of position count and row configuration?
The Mercury 895 series encompasses multiple variants, with the 895-016-524-808 specifically offering 16 positions in a dual-row (2×8) configuration. Other 895 series models may provide 8-position single-row, 32-position quad-row, or specialized variants with different card thicknesses or contact finishes. The 895-016-524-808 base product number (895-016) identifies the core 16-position family, while the suffix (-524-808) specifies the exact geometry, gender, termination style, and finish. Engineers comparing Mercury edge connectors should verify the position count and row arrangement against signal routing requirements; upgrading from the 895-016-524-808 to a higher-position variant typically requires board redesign, whereas downgrading may create signal routing constraints.
What are the solder joint fatigue and rework considerations for the 895-016-524-808 with through-hole termination?
The 895-016-524-808 uses through-hole solder termination, which creates strong mechanical coupling between the connector body and the PCB. This provides excellent vibration resistance compared to surface-mount alternatives, but also concentrates mechanical stress at the solder fillet. In applications subject to thermal cycling (-40°C to 125°C operating range per the 895-016-524-808 specification) or mechanical shock, the through-hole solder joints are susceptible to fatigue cracking after 500–2000 cycles depending on board thickness and copper trace geometry. Rework of a failed 895-016-524-808 typically requires desoldering all 16 pins simultaneously, which risks heat damage to adjacent components and the PPS insulation material. For high-reliability applications, implementing mechanical stress relief—such as conformal coating or potting around the 895-016-524-808 solder joints—reduces fatigue risk.
How does the PPS (Polyphenylene Sulfide) insulation material of the 895-016-524-808 affect chemical resistance and temperature stability?
The 895-016-524-808 insulation body is molded from Polyphenylene Sulfide (PPS), a high-performance thermoplastic that provides superior chemical resistance and thermal stability compared to polyamide or acetal alternatives. PPS excels in exposure to hydrocarbon solvents, acids, and alkaline cleaners, making the 895-016-524-808 suitable for automotive, industrial, and aerospace environments where board-level cleaning processes or operational chemical exposure occurs. The 895-016-524-808 rated operating temperature of -40°C to 125°C reflects PPS's stable mechanical properties across this range; dimensional shift and contact pressure drift are minimal. However, PPS is hygroscopic and can absorb moisture if stored in uncontrolled environments, potentially affecting electrical properties. The 895-016-524-808 is rated MSL 1 (Unlimited), indicating moisture absorption is not a design constraint, but best practice still recommends dry storage to preserve insulation dielectric strength.
What is the threaded insert feature (4-40) on the 895-016-524-808, and when is it used in system design?
The 895-016-524-808 includes a threaded insert (4-40) as part of its top-mount opening flange feature. This insert allows the connector to be mechanically secured to an adjacent bracket, card cage, or front panel using a standard 4-40 machine screw, preventing accidental ejection and providing mechanical strain relief. In industrial card-cage systems or removable modules, the 895-016-524-808 threaded insert is essential for repeatability—ensuring that edge connectors remain mechanically aligned across insert/remove cycles and that contact pressure remains consistent. The screw also distributes mechanical stress away from the solder joints, improving fatigue resistance in vibration-prone environments. If the 895-016-524-808 is used without mechanical retention (free-floating edge insertion), the threaded insert remains unused and does not affect electrical performance.
How does the cantilever contact design of the 895-016-524-808 maintain consistent contact pressure across the card thickness range?
The 895-016-524-808 employs cantilever-beam contact springs that flex to accommodate the card thickness window of 0.054" to 0.070". As the card is inserted, the cantilevers deflect elastically, compressing against the card surface; the spring force is designed to deliver approximately 100–200 grams of normal force per contact, ensuring stable electrical connection across the entire thickness range. The cantilever geometry of the 895-016-524-808 is calibrated so that a minimum-thickness card (0.054") does not under-compress (risking open circuits), while a maximum-thickness card (0.070") does not over-compress (deforming the contact or card). Wear and relaxation of the cantilever springs over thousands of insertion cycles gradually reduce contact pressure in the 895-016-524-808; end-of-life contact resistance degradation typically becomes noticeable after 300–500 cycles depending on operating temperature and environmental conditions.
What EMI/RFI shielding or crosstalk mitigation strategies are effective when integrating the 895-016-524-808 into a multi-signal assembly?
The 895-016-524-808 itself provides no integrated shielding; all 16 contacts are exposed within a non-shielded PPS housing. To mitigate EMI and crosstalk in multi-signal designs, external measures are necessary: (1) dedicate alternating rows of the 895-016-524-808 to ground connections, creating a quasi-shielded topology; (2) route the 895-016-524-808 signal traces on inner PCB layers immediately adjacent to a solid ground plane; (3) implement series termination on high-speed lines exiting the 895-016-524-808 to control impedance and reduce reflection noise; (4) use differential pair routing for critical signals within the 895-016-524-808 signal allocation. The dual-row configuration of the 895-016-524-808 makes ground-sandwiching difficult without sacrificing signal capacity; many designers reserve one row entirely for ground/return paths and accept 8 effective signal positions rather than 16.
How do environmental compliance certifications (RoHS, REACH, ECCN) for the 895-016-524-808 affect procurement and export considerations?
The 895-016-524-808 is RoHS3 compliant, indicating that hazardous substances (lead, cadmium, mercury, etc.) have been eliminated or reduced below regulated thresholds; this is mandatory for most consumer and industrial EU markets. The 895-016-524-808 is listed as REACH Unaffected, meaning it does not contain Substances of Very High Concern (SVHCs) subject to authorization or restriction under EU REACH regulations. The ECCN classification (EAR99) indicates the 895-016-524-808 is not subject to U.S. export control restrictions; it may be sold internationally without special licensing. However, the 895-016-524-808 HTSUS code (8536.69.4040) affects tariff classification and import duties depending on destination; engineers sourcing the 895-016-524-808 for international manufacturing should verify local import requirements and supply-chain compliance documentation.
What is the expected insertion and withdrawal cycle life of the 895-016-524-808, and how does environmental temperature affect this specification?
Mercury does not publish explicit mechanical cycle life for the 895-016-524-808 in standard datasheets, but industry practice for edge connectors with cantilever contacts and 0.100" pitch suggests 500–1000 insertion cycles under controlled conditions (room temperature, dry environment, aligned insertion). The 895-016-524-808 operating temperature range (-40°C to 125°C) defines the thermal envelope, but cycling life degrades significantly at temperature extremes. At elevated temperature (100–125°C), PPS insulation creep and contact-spring relaxation accelerate, reducing the 895-016-524-808 cycle life to approximately 300–500 cycles. At cryogenic extremes (-40°C), PPS becomes brittle, increasing breakage risk during high-force insertion. For long-term reliability predictions, accelerated life testing under representative thermal and mechanical stress is strongly recommended before committing the 895-016-524-808 to high-cycle applications.
How should the 895-016-524-808 be integrated into test fixtures or development boards to ensure reliable prototyping and validation?
When using the 895-016-524-808 in test fixtures or prototype boards, several best practices improve reliability: (1) mount the 895-016-524-808 on a development board using high-quality solder paste and reflow; inspect the solder fillets visually or via X-ray for voids; (2) provide adequate mechanical support—use a test-card PCB with stiffening ribs if the card will be inserted repeatedly, preventing flex-induced contact bounce; (3) verify that test-card thickness complies with the 895-016-524-808 specification (0.054–0.070"); (4) label insertion direction clearly to prevent reverse insertion or misalignment of the 895-016-524-808; (5) periodically check contact resistance using a four-wire ohm measurement after 50 and 200 insertion cycles to detect early contact degradation. Test fixtures with the 895-016-524-808 typically remain serviceable for 50–200 cycles if handled carefully; beyond that, contact resistance drift becomes noticeable and fixture replacement is advisable.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 895-016-524-808

Product Attribute 895-016-524-802 895-016-524-608 895-016-524-803 895-016-524-804
Part Number 895-016-524-802 895-016-524-608 895-016-524-803 895-016-524-804
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Card Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Termination Rows - - - -
Color - - - -
Flange Feature - - - -
Pitch - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Material - - - -
Number of Rows - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Gender - - - -
Card Thickness - - - -
Number of Positions/Bay/Row - - - -
Termination - - - -
Read Out - - - -
Material - Insulation - - - -
Number of Positions - - - -
Contact Finish Thickness - - - -
Features - - - Simultaneous Sampling
Contact Type - - - -

895-016-524-808 Datasheet PDF

Download 895-016-524-808 pdf datasheets and EDAC Inc. documentation for 895-016-524-808 - EDAC Inc..

Datasheets
895-016-524-808 Datasheet.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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895-016-524-808 Image

895-016-524-808

EDAC Inc.
98D-895-016-524-808

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