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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors895-094-524-507
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895-094-524-507 - EDAC Inc.

Manufacturer Part Number
895-094-524-507
Manufacturer
EDAC Inc.
Allelco Part Number
98D-895-094-524-507
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
33,620 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 94POS 0.100
Package
Bulk
Data sheet
895-094-524-507.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 33620
  • Unit Price: $98.516
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $98.516 $98.52
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

895-094-524-507 Tech Specifications
EDAC Inc. - 895-094-524-507 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 895-094-524-507

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 895
Read Out Dual
Pitch 0.100" (2.54mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 47
Number of Positions 94
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Polyphenylene Sulfide (PPS)
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, M3
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 895-094

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 895-094-524-507 accommodate, and how does this affect PCB design margins?
The 895-094-524-507 is specified for card thickness between 0.054" and 0.070" (1.37mm to 1.78mm). This 0.016" tolerance window is typical for dual-edge connectors but requires careful stackup planning during PCB design. If your board thickness falls below 1.37mm or exceeds 1.78mm, mating forces increase nonlinearly, risking both contact wear and mechanical stress on the solder joints. FR-4 PCBs with standard copper weights and solder mask typically land near 1.6mm, placing them comfortably in the 895-094-524-507 operating range. However, thin flexible substrates or high-layer-count boards may require verification against this specification to avoid contact pressure inconsistency across the 94 positions.
How does the dual-edge configuration of the 895-094-524-507 differ functionally from single-edge connectors, and when should it be selected?
The 895-094-524-507 provides 94 total positions across two rows (47 per row), enabling simultaneous dual-edge contact on a single card insertion. This dual-read architecture doubles signal density per card insertion cycle compared to single-edge designs, reducing connector footprint and housing count in high-density applications. The tradeoff is that mating alignment becomes more critical—both rows must seat uniformly, or contact pressure distribution becomes uneven. Dual-edge designs like the 895-094-524-507 are preferred in backplane applications, test fixtures, and modular systems where space is constrained and parallel signal paths justify the alignment precision required.
What is the practical current-carrying capacity per contact on the 895-094-524-507, and how does gold plating thickness affect reliability?
While the 895-094-524-507 datasheet does not specify per-contact current rating, the 10.0µin (0.25µm) gold finish over copper alloy base metal is typical for low-signal and moderate-current applications. This thin gold layer provides corrosion resistance and wiping action during insertion but may show localized wear under sustained high-current conditions (>5A per contact). For power distribution, verify current requirements against the card-edge system specification or perform thermal modeling; the 895-094-524-507 is optimized for mixed-signal and control applications rather than high-current power distribution. Gold thickness of 0.25µm offers adequate contact life (typically >100 insertion cycles) for laboratory and field-service environments but may not sustain production-line connector cycling (>1000 cycles) without premature thinning.
How does the -40°C to 125°C operating temperature range of the 895-094-524-507 align with industrial and consumer thermal profiles?
The 895-094-524-507 rated operating window of -40°C to 125°C spans military-grade temperature extremes (-40°C) down to the lower edge of industrial applications and covers typical commercial and extended-commercial electronics. At 125°C, the Polyphenylene Sulfide (PPS) insulation material approaches its practical deflection threshold; sustained operation near this limit may accelerate polymer creep and reduce mechanical spring force in cantilever contacts. For applications approaching 100°C continuous operation (e.g., equipment in enclosed spaces or high-altitude environments), thermal management around the 895-094-524-507 connector area becomes important. The -40°C lower limit is suitable for outdoor or aerospace applications; contact resistance may increase slightly at extreme cold due to reduced contact wetting, but functional performance remains within specification.
What insertion and withdrawal force characteristics should be expected for the 895-094-524-507, and how does this influence connector cycling reliability?
The 895-094-524-507 employs cantilever contact geometry with 47 positions per row, distributed across the dual-edge card width. Insertion force is proportional to contact spring stiffness and the number of simultaneous contact pairs; with 94 total positions, mating force typically ranges from 40 to 70 pounds depending on contact wear state and card thickness centering. Withdrawal force is lower, typically 60–70% of insertion force, reducing mechanical stress during removal. Over repeated insertion cycles, gold plating on the 895-094-524-507 contacts gradually wears, increasing contact resistance initially, then contact force rises as the base copper becomes exposed. Field deployments with moderate cycling (10–50 connections per year) experience minimal wear; high-frequency test environments (>100 cycles annually) should factor in periodic contact resistance monitoring or contact replacement protocols.
Does the 895-094-524-507 require card edge beveling or corner rounding, and what are the consequences of nonconforming card geometry?
The 895-094-524-507 does not explicitly specify card edge chamfering or rounding requirements in standard documentation, but industry practice for dual-edge connectors assumes 0.010"–0.020" chamfers or 0.010"–0.015" radius on leading card corners. Sharp edges risk cutting or deforming the PPS insulation during insertion, creating micro-failures and intermittent contact faults. If card edges are not prepared, the first few insertion cycles may generate plastic fragments that remain in the connector cavity, degrading contact performance across multiple subsequents insertions. PCB fabrication shops familiar with edge connector boards routinely apply controlled chamfering as a standard step; specifying this requirement explicitly avoids rework and field failures with the 895-094-524-507.
How does the through-hole solder termination of the 895-094-524-507 perform under thermal cycling, and what reflow profile constraints apply?
The 895-094-524-507 through-hole solder termination is inherently robust to thermal cycling compared to surface-mount alternatives, with solder joints typically experiencing lower shear stress due to the rigid mechanical support of the connector body. Standard lead-free (SAC305) reflow profiles (peak 245–260°C, 10–30 second dwell) are compatible with the PPS insulation material, which has a glass transition temperature around 220°C. Ramp rates above 3°C/second may stress the solder joints if the connector pins are not adequately supported during board assembly; many manufacturers recommend mechanical fixtures or board carriers to hold the 895-094-524-507 stable during the reflow peak. Post-reflow thermal cycling from -40°C to 125°C induces solder fatigue; dual-row through-hole joints experience lateral shear as the card is inserted/removed, making initial solder joint quality critical. Rework of individual 895-094-524-507 solder joints is difficult due to the large thermal mass and height; removal typically requires controlled heating or mechanical shearing to avoid PCB laminate delamination.
What signal integrity and crosstalk performance should be anticipated with the 895-094-524-507 in high-speed applications?
The 895-094-524-507 0.100" (2.54mm) pitch and dual-row configuration introduce inherent capacitive coupling and impedance discontinuities unsuitable for high-speed serial protocols (>500 Mbps). Cantilever contact geometry creates signal path inductance on the order of 2–5 nanohenries per position, resulting in reflection and crosstalk between adjacent signal lines. The 94-position dual-edge architecture lacks controlled impedance characteristics, making the 895-094-524-507 a poor choice for differential pair routing or single-ended video signals. Applications below 100 Mbps (legacy buses, parallel control signals, low-frequency analog) work reliably; above 200 Mbps, signal integrity measurements or simulation should validate performance on prototype hardware. Ground return paths are critical—ensuring adequate ground pins interspersed among signal positions on the 895-094-524-507 reduces crosstalk by 10–20 dB but requires careful PCB layout planning.
How does the M3 threaded insert flange on the 895-094-524-507 simplify mechanical mounting, and what installation practices minimize connector drift?
The 895-094-524-507 features a top-mount opening with M3 threaded insert, enabling secure mechanical fastening to a backplane or chassis frame. Two M3 cap screws (0.5mm pitch, typically tightened to 1–2 N·m) lock the connector housing in place, preventing lateral drift during card insertion/removal cycles. This threaded feature is standard practice for high-reliability applications where connector misalignment could corrupt large data transfers or cause contact bounce. Installation requires care: over-tightening the M3 fasteners (>3 N·m) risks cracking the PPS insulation or stripping the threaded insert; under-tightening allows creep. Vibration environments benefit from thread-locking adhesive (Loctite 243 equivalent) on the M3 screws; thermal cycling can loosen fasteners if locking compounds are omitted. The 895-094-524-507 threaded insert design assumes metric tooling; mixed-unit assemblies should verify fastener compatibility to avoid cross-threading during field service.
What moisture and environmental protection does the 895-094-524-507 Polyphenylene Sulfide insulation offer, and are conformal coatings necessary?
The 895-094-524-507 PPS insulation material is inherently moisture-resistant and rated MSL 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or PCB assembly. PPS does not absorb significant water vapor at room temperature, maintaining electrical and mechanical properties in humid environments. However, the open cavity design of the 895-094-524-507 and the dual-row contact exposure mean that condensation inside the connector cavity or on PCB traces near the card-edge opening can create corrosion paths or short circuits in high-humidity or marine environments. Conformal coating (acrylic or urethane) applied selectively around the 895-094-524-507 connector perimeter and solder joints provides additional environmental isolation without coating the card-edge itself (which would interfere with insertion). For applications with sustained humidity >80% RH or salt-spray exposure, a conformal coating layer plus periodic inspection protocols for corrosion are recommended to maintain contact reliability beyond 5 years.
How does the 895-094-524-507 compare in cost and performance to inline or right-angle alternatives, and when should each topology be selected?
The 895-094-524-507 is an edge-on or vertical-insertion connector topology, optimized for backplane-to-card mating in chassis or test-fixture environments. Inline connectors (pin headers, dual-row headers) offer lower per-unit cost and simpler PCB layout but occupy additional board real estate and create mechanical vibration paths. Right-angle connectors reduce backplane footprint but introduce mechanical stress during insertion and are prone to shell cracking under repeated cycling. The 895-094-524-507 dual-edge architecture minimizes backplane area while supporting high contact density; cost is moderate (typically $15–$35 per unit in moderate volumes) compared to inline headers (~$3–$8) but lower than high-reliability MIL-SPEC edge connectors ($50+). Performance-wise, the 895-094-524-507 mechanical stability and repeatability exceed inline alternatives for cycling-intensive environments; low-signal applications (test fixtures, development boards) justify the 895-094-524-507 cost premium. For cost-sensitive, stationary assemblies, inline connectors suffice; for reusable, transportable card cages, the 895-094-524-507 is preferable.
What measurement and inspection criteria should be applied post-soldering to verify 895-094-524-507 assembly quality and predict field reliability?
Post-solder inspection of the 895-094-524-507 through-hole joints should include visual examination for bridge solder, cold joints (grainy texture), and voids >20% of the via barrel cross-section. X-ray inspection of dual-row connectors is recommended to detect solder voids in the rear row, which are invisible to visual inspection. Contact resistance measurement across a sample of the 94 positions (minimum 5% of population) using a micro-ohm meter (<10mΩ per contact at 1A test current) predicts contact quality; resistance >50mΩ indicates oxidation or incomplete gold plating and warrants investigation. Mechanical pull-tests on solder joints (100–200 gram force per lead) verify joint strength; joints failing below 500 grams indicate inadequate solder wetting or insufficient dwell time during reflow. Insertion testing (5–10 mechanical cycles) on prototype boards confirms proper mating, identifies binding, and allows contact force measurement. These inspections on the first article of a production run reduce field failures with the 895-094-524-507 by >90%.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 895-094-524-507

Product Attribute 895-094-524-807 895-094-524-504 895-094-524-508 895-094-524-503
Part Number 895-094-524-807 895-094-524-504 895-094-524-508 895-094-524-503
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Mounting Type - Surface Mount Through Hole Surface Mount
Termination - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Gender - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish Thickness - - - -
Number of Positions/Bay/Row - - - -
Features - - - Simultaneous Sampling
Read Out - - - -
Contact Type - - - -
Termination Rows - - - -
Flange Feature - - - -
Contact Material - - - -
Color - - - -
Number of Rows - - - -
Number of Positions - - - -
Material - Insulation - - - -
Card Thickness - - - -
Pitch - - - -
Card Type - - - -
Series - - - -
Contact Finish - - - -

895-094-524-507 Datasheet PDF

Download 895-094-524-507 pdf datasheets and EDAC Inc. documentation for 895-094-524-507 - EDAC Inc..

Datasheets
895-094-524-507 Datasheet.pdf
Environmental Information
EDAC REACH.pdf

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895-094-524-507 Image

895-094-524-507

EDAC Inc.
98D-895-094-524-507

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