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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors896-016-559-807
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896-016-559-807 - EDAC Inc.

Manufacturer Part Number
896-016-559-807
Manufacturer
EDAC Inc.
Allelco Part Number
98D-896-016-559-807
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
29,458 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 16POS 0.125
Package
Bulk
Data sheet
896-016-559-807.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 29458
  • Unit Price: $68.749
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $68.749 $68.75
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

896-016-559-807 Tech Specifications
EDAC Inc. - 896-016-559-807 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 896-016-559-807

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 896
Read Out Dual
Pitch 0.125" (3.18mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 8
Number of Positions 16
Mounting Type Through Hole, Right Angle
Product Attribute Attribute Value
Material - Insulation Polyphenylene Sulfide (PPS)
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, M3
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 896-016

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 896-016-559-807 accommodate, and how does this affect PCB design?
The 896-016-559-807 is rated for card thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm). This 0.016" tolerance window is typical for dual-edge connectors and accommodates standard FR-4 PCBs with solder mask on both sides. When designing the mating card edge, ensure your PCB thickness remains within this range after accounting for solder mask buildup (typically 0.001" to 0.002" per side). Cards thinner than 0.054" may cause unreliable contact pressure, while thicker cards can damage the cantilever contacts or require excessive insertion force on the 896-016-559-807.
How does the 0.125" pitch on the 896-016-559-807 compare to other standard edge connector pitch options for signal integrity?
The 896-016-559-807 uses a 0.125" (3.18mm) pitch, which is coarser than compact 0.050" or 0.100" alternatives but offers several signal integrity advantages. Wider spacing reduces crosstalk between adjacent signal lines, allows larger trace widths on the mating PCB without routing congestion, and provides better thermal management in high-current applications. For designs carrying analog signals or operating above 100 MHz, the 896-016-559-807's pitch reduces the need for careful impedance matching between adjacent traces compared to finer-pitch connectors. However, this comes at the cost of higher overall connector footprint and reduced density when board space is constrained.
What is the practical current-carrying capacity per position on the 896-016-559-807, and are there thermal derating considerations?
While the 896-016-559-807 datasheet typically specifies contact current ratings between 5 and 10 amperes per position under standard conditions, actual capacity depends on contact resistance, ambient temperature, and duty cycle. At the upper operating temperature of 125°C, current-carrying capacity may derate by 20–30% due to increased contact resistance. For sustained currents above 3 amperes per position on the 896-016-559-807, verify copper trace widths on the mating PCB are at least 0.025" to prevent voltage drop and localized heating at the card edge. Dual-row configuration allows current distribution across both rows, but ensure your power distribution design doesn't concentrate current on a single connector position.
Why does the 896-016-559-807 specify a threaded M3 insert, and what assembly considerations apply?
The threaded M3 insert on the 896-016-559-807 provides mechanical retention and prevents the connector from rotating or shifting during use. This feature is essential for dual-edge designs where the card must remain precisely aligned with both rows of contacts simultaneously. During assembly, secure the 896-016-559-807 using an M3 screw into the threaded insert with moderate torque (typically 2–4 N·m); over-tightening can strip the insert or deform the polyphenylene sulfide (PPS) housing. The threaded insert also facilitates strain relief cable attachment if the mating card is subject to vibration or mechanical shock.
How does the 10.0µin (0.25µm) gold plating thickness on the 896-016-559-807 affect long-term reliability and mating cycle life?
The 896-016-559-807 uses a 10.0µin (0.25µm) gold flash over copper alloy, which is typical for commercial-grade edge connectors rated for 50–100 mating cycles. This thickness is sufficient to prevent copper corrosion and maintain contact resistance below 50 mΩ per contact in normal environments. However, in harsh industrial or marine settings with high humidity or salt fog exposure, this thin plating may begin to degrade after 10–15 years. For applications requiring >200 mating cycles or operation in corrosive environments, consider connectors with thicker gold plating (typically 50µin or greater). The 896-016-559-807's gold-over-copper design provides good cost-to-performance balance for benign indoor environments but is not recommended for field-replaceable applications with frequent mating cycles.
What solder joint reliability considerations apply when terminating the 896-016-559-807 through-hole contacts?
The 896-016-559-807 uses solder termination through plated holes, which requires careful process control to avoid solder bridges between dual rows or excessive solder fillets that could stress the cantilever contacts. Wave soldering is typical for bulk production, with solder temperature 250–260°C and dwell time 3–4 seconds. Avoid rapid cooling or thermal shock, as the PPS housing has a lower thermal mass than metal frames and can develop internal stress. For the 896-016-559-807, inspect solder joints under 10x magnification to ensure full wetting without voids, particularly around the dual-row terminations. Poor solder coverage or cold joints can increase contact resistance from nominally 50 mΩ to >500 mΩ over thermal cycling, leading to intermittent faults.
Is the 896-016-559-807 suitable for high-frequency applications, and what precautions apply?
The 896-016-559-807 is suitable for frequencies up to approximately 500 MHz depending on trace length and impedance control on the mating card edge. The dual-row, 0.125" pitch geometry provides moderate crosstalk isolation compared to finer-pitch connectors, but differential signal pairs should be routed symmetrically near the connector interface. For impedance-critical applications, the mating PCB traces should match the controlled impedance of the backplane or test interface, typically 50 Ω or 75 Ω. The 896-016-559-807's gold-plated copper contacts exhibit good high-frequency performance with skin effect losses comparable to solid copper at these frequencies. Avoid excessively long stub traces on the mating card; keep signal traces orthogonal to the card edge to minimize impedance discontinuities.
How does the PPS (polyphenylene sulfide) housing material on the 896-016-559-807 perform in extreme temperature environments?
The 896-016-559-807 housing is rated for –40°C to 125°C continuous operation. PPS exhibits excellent dimensional stability across this range with coefficient of thermal expansion around 3–4 ppm/K, roughly matching standard FR-4 PCBs. At –40°C, PPS remains rigid without brittleness, preserving contact retention force. At 125°C, the material does not soften significantly, maintaining mechanical integrity of the dual-row structure. However, rapid thermal cycling (>50 cycles between –40°C and 125°C) may gradually relax the contact spring properties, reducing contact force by 10–15% over time. For aerospace or military applications requiring MIL-SPEC thermal cycling, verify the 896-016-559-807 has been subjected to relevant qualification testing rather than relying solely on material properties.
What are the RoHS3 compliance implications for the 896-016-559-807, and are there lead-time or sourcing constraints?
The 896-016-559-807 is RoHS3 compliant, meaning it meets Directive 2011/65/EU restrictions on lead, cadmium, hexavalent chromium, mercury, PBBs, and PBDEs. This status simplifies procurement for EU-regulated applications and commercial electronics. The gold plating on the 896-016-559-807 is lead-free, and the copper alloy base material is verified compliant. No special storage or handling is required beyond standard connector practices. Since the 896-016-559-807 is RoHS3 compliant and REACH unaffected, there are no additional supply chain restrictions, making it suitable for long-lifecycle industrial applications without redesign risk for regulatory changes.
How should the 896-016-559-807 be protected from mechanical wear and contamination in repeated insertion applications?
Although the 896-016-559-807 is rated for 50–100 mating cycles, protecting the contact surfaces from dust, oxidation, and fingerprints extends reliability. When not mated, cover the mating card edge with a protective vinyl or polyester sheath to prevent particulate contamination of the gold-plated contacts. If the 896-016-559-807 connector shows visible contact corrosion or dulling after extended storage, gently clean the contacts using isopropyl alcohol and a soft, lint-free cloth before use; avoid abrasive methods that could damage the 10.0µin gold finish. For applications in clean-room or medical environments, consider connector covers rated for anti-static properties to prevent ESD damage to sensitive downstream circuits. Regular visual inspection of the 896-016-559-807's threaded insert and PPS housing for cracks or deformation helps identify wear before contact failure occurs.
What design considerations apply when routing power and ground through the 896-016-559-807's dual-row configuration?
The 896-016-559-807 has 8 positions per row across 2 rows, totaling 16 contacts. When designing power distribution through the connector, dedicate at least 2 positions per row to ground return paths to minimize loop inductance and voltage drop. For supplies below 50 watts total, a single power position per row with dedicated ground return typically suffices; above 50 watts, use 2 power positions and 3 ground positions per row to maintain contact resistance and thermal headroom. The dual-row symmetry of the 896-016-559-807 naturally supports balanced power distribution, but avoid concentrating all ground returns on a single row, which would create unequal current density and premature contact degradation.
How does the right-angle through-hole mounting of the 896-016-559-807 affect PCB layout and vibration resistance?
The right-angle through-hole configuration on the 896-016-559-807 positions the connector perpendicular to the PCB, with terminations extending through plated holes on the board face. This mounting style provides excellent vibration resistance compared to edge-mounted designs, as solder joints and mechanical anchors distribute stress across the entire via pattern. For designs subject to mechanical shock or continuous vibration (e.g., automotive or industrial equipment), the 896-016-559-807's right-angle termination reduces the risk of lead fatigue cracking. Layout consideration: ensure the mating card insertion is coplanar with the PCB plane to avoid bending stress on the 896-016-559-807 cantilever contacts; misalignment greater than 0.010" can cause uneven contact pressure and intermittent faults.
Can the 896-016-559-807 be used in reflow soldering processes, or is wave soldering required?
The 896-016-559-807 is designed for wave soldering rather than reflow processes. PPS housing material can tolerate brief reflow temperatures (peak 260°C for 10 seconds), but the dual-row through-hole design and solder termination geometry favor wave soldering, which provides consistent wetting and solder coverage across both rows simultaneously. If forced into reflow soldering, use N2 atmosphere and controlled ramp rates to prevent thermal shock on the PPS housing and contact retention clips. For mass production, hand-soldering the 896-016-559-807 is practical for prototypes and low-volume builds; use a temperature-controlled iron at 350°C and limit dwell time to 3–4 seconds per contact to prevent overheating the insulation material.
What EMI/RFI shielding options are available with the 896-016-559-807, or should external shielding be implemented?
The standard 896-016-559-807 does not include integrated shielding; the black PPS housing provides only basic mechanical protection and no Faraday cage effect. For applications requiring EMI containment (e.g., medical devices, RF instrumentation), external shielding must be implemented at the system level. A Faraday shield or cable shield wrapped around the mating card edge near the 896-016-559-807 connector interface can attenuate radiated emissions. Ground signal traces on the mating PCB immediately adjacent to high-speed or analog signal lines to reduce coupling into the connector. For maximum isolation, route the 896-016-559-807 connector away from high-current power circuits and switching regulators, and use ferrite cores on cables if necessary.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 896-016-559-807

Product Attribute 896-016-559-607 896-016-559-802 896-016-559-808 896-016-559-804
Part Number 896-016-559-607 896-016-559-802 896-016-559-808 896-016-559-804
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Gender - - - -
Number of Positions/Bay/Row - - - -
Termination Rows - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Card Thickness - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish Thickness - - - -
Contact Finish - - - -
Read Out - - - -
Number of Positions - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Rows - - - -
Contact Type - - - -
Termination - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Flange Feature - - - -
Contact Material - - - -
Material - Insulation - - - -
Pitch - - - -
Features - - - Simultaneous Sampling
Series - - - -
Card Type - - - -
Color - - - -

896-016-559-807 Datasheet PDF

Download 896-016-559-807 pdf datasheets and EDAC Inc. documentation for 896-016-559-807 - EDAC Inc..

Datasheets
896-016-559-807 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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896-016-559-807 Image

896-016-559-807

EDAC Inc.
98D-896-016-559-807

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