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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors896-016-560-201
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896-016-560-201 - EDAC Inc.

Manufacturer Part Number
896-016-560-201
Manufacturer
EDAC Inc.
Allelco Part Number
98D-896-016-560-201
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
45,008 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 16POS 0.125
Package
Bulk
Data sheet
896-016-560-201.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 45008
  • Unit Price: $53.046
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $53.046 $53.05
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

896-016-560-201 Tech Specifications
EDAC Inc. - 896-016-560-201 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 896-016-560-201

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 896
Read Out Dual
Pitch 0.125" (3.18mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 8
Number of Positions 16
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyphenylene Sulfide (PPS)
Gender Female
Flange Feature -
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 896-016

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range is compatible with the Mercury 896-016-560-201 connector, and how does this affect PCB design tolerance stacking?
The 896-016-560-201 is designed for cards measuring 0.054" to 0.070" (1.37–1.78mm) thick. This 0.016" (0.41mm) tolerance window is typical for dual-edge connectors and reflects manufacturing variation in FR-4 and polyimide substrates. During design, account for cumulative tolerance stack-up: if your PCB nominal thickness is 0.062", the 896-016-560-201's cantilever contacts will compress slightly differently at the lower and upper tolerance limits, potentially affecting insertion force and contact pressure uniformity. Material choice matters—FR-4 exhibits greater thickness variation than controlled polyimide. Validate your actual PCB thickness with fabrication drawings and test insertion force at process extremes.
How does the dual-row, dual-read configuration of the 896-016-560-201 differ from single-edge connectors in terms of signal integrity and grounding strategy?
The 896-016-560-201 features two rows of 8 positions each (16 total) arranged for dual-edge readout, meaning signals are accessed from both sides of the card simultaneously. This architecture allows parallel signal paths and provides inherent redundancy for critical signals but introduces asymmetry risks if both edges are not equally terminated. For high-speed applications, the 896-016-560-201's straddle-mount design creates two separate ground return paths. Asymmetric loading—where one edge carries predominantly signal and the other carries ground—can induce loop area imbalance and radiated emissions. Best practice: distribute ground pins evenly across both rows of the 896-016-560-201, and verify return-path continuity on both PCB layers to avoid current crowding at one contact set.
What is the contact resistance specification for the 896-016-560-201, and how does the 10µin gold plating affect long-term reliability in shelf storage?
The 896-016-560-201 datasheet does not explicitly state contact resistance; typical cantilever card-edge contacts exhibit 50–150mΩ per contact pair depending on insertion cycles and alloy composition. The 896-016-560-201 uses copper alloy with 10µin (0.25µm) gold plating—a thin coating that prevents tarnish during dormancy but provides minimal migration buffer under thermal cycling. At -40°C to +125°C, the 896-016-560-201's thin gold layer is adequate for passive storage and non-corrosive environments; however, in humid or salt-fog conditions (aerospace/marine), the underlying copper can begin oxidation at the plating edge after 5–10 years. If the 896-016-560-201 will be stored or remain unused for extended periods before first insertion, specify sealed packaging with desiccant and avoid high-humidity warehouses. After insertion cycles begin, oxidation risk drops sharply because fresh contact surfaces are constantly exposed.
Can the 896-016-560-201 be used in high-frequency applications, and what impedance considerations apply to the 0.125" pitch?
The Mercury 896-016-560-201 is primarily rated for DC and low-frequency AC applications; it is not characterized as a controlled-impedance connector. The 0.125" (3.18mm) pitch is relatively coarse for high-speed digital signals—at 1 GHz and above, the 896-016-560-201's contact geometry and PCB trace routing create impedance discontinuities that contribute 3–8dB insertion loss per connection and signal reflections. If the 896-016-560-201 must carry signals above 100 MHz, perform time-domain reflectometry (TDR) measurements on your specific PCB layout to characterize actual impedance and crosstalk. For frequencies below 50 MHz, the 896-016-560-201 is acceptable with standard design rules; above that, consider shielded or higher-density connectors designed for controlled impedance.
How does the solder termination of the 896-016-560-201 influence rework capability, and what is the maximum reflow temperature?
The 896-016-560-201 uses solder termination—either wave or reflow depending on assembly process. For reflow, the 896-016-560-201's polyphenylene sulfide (PPS) insulation body is stable to approximately 260°C peak (IPC J-STD-020 lead-free profile). The solder joint itself melts at ~220°C (SAC305), but the 896-016-560-201's thin solder tail and cantilever spring contacts are prone to joint cracking under thermal stress if rework cycles exceed three. During first pass, standard reflow is reliable; if rework is necessary, use lower ramp rates (2–3°C/s instead of 5°C/s) when desoldering the 896-016-560-201 to avoid brittle fracture in the contact heel. Inspect under 10× magnification post-rework for micro-cracks at the solder interface, as the 896-016-560-201's slender contact geometry provides limited thermal mass.
What insertion force specification applies to the 896-016-560-201, and how should card extractors or guide rails be specified to prevent contact damage?
The 896-016-560-201 datasheet does not publish a specific insertion force; typical dual-edge 16-position connectors with cantilever contacts require 15–30 pounds (67–134N) total insertion force depending on contact wiping and card thickness. With the 896-016-560-201's 0.054"–0.070" card slot, contacts at the lower tolerance limit (thinner card) will compress less, increasing relative insertion force; at the upper limit, force drops slightly. To protect the 896-016-560-201 during manual insertion, specify a card extender or guidance frame that aligns both edges simultaneously and distributes load across multiple positions rather than sequential insertion. Misalignment of even 0.010" can cause the 896-016-560-201 contact tines to catch and bend permanently, leading to intermittent connections or open circuits. Use a mechanical stop or indexing feature to prevent over-insertion, which could deform the cantilever arms and reduce normal force.
Does the 896-016-560-201 require any special handling for moisture sensitivity, and is conformal coating compatible with the contact region?
The Mercury 896-016-560-201 carries MSL-1 (Unlimited) moisture sensitivity rating, meaning it absorbs negligible moisture and requires no dry-pack storage, humidity cabinets, or bake-out cycles before assembly. This makes the 896-016-560-201 simpler to inventory and kit compared to MSL-2/3 components. However, conformal coating—acrylic, urethane, or silicone—should not be applied over the contact faces or inside the card slot of the 896-016-560-201. Coating residue can accumulate in the contact interface and increase contact resistance or create intermittent opens over thermal cycles. If circuit-board protection is required, mask the 896-016-560-201 connector area or apply coating only to non-contact regions. The 896-016-560-201's polyphenylene sulfide insulation is naturally moisture-resistant, so conformal coating provides minimal added benefit for connector reliability.
How should the 896-016-560-201 be specified in a bill of materials (BOM) for a multi-vendor supply chain, and what are the common mechanical variants to avoid?
The Mercury 896-016-560-201 base part number is 896-016, with -560-201 denoting the specific configuration (16 positions, dual female, gold plating, non-specified card type, board edge straddle mount). When specifying the full 896-016-560-201 in your BOM, avoid abbreviating to just "896-016" because Mercury produces numerous variants within that series with different pitch, position count, and termination styles. The most common confusion is between the 896-016-560-201 (0.125" pitch, dual-edge female) and the 896-016-520 series (single-edge variants). Cross-reference the mechanical drawing and verify the card slot height on your PCB footprint; the 896-016-560-201 straddle-mount clearance is typically 0.050"–0.060" above the board surface, which may conflict with nearby components. Confirm lead time and availability of the full part number 896-016-560-201 from multiple distributors before committing to design, as some Mercury connector series have extended lead times.
What is the operating temperature range of the 896-016-560-201, and how do contact resistance and mechanical properties degrade at the temperature extremes?
The 896-016-560-201 is rated for -40°C to +125°C continuous operation. At the lower extreme (-40°C), the polyphenylene sulfide insulation becomes stiffer, and the cantilever contact spring force increases slightly (~5–8%), providing higher normal force and lower contact resistance; however, solder joints on the PCB become more brittle, increasing risk of thermal shock cracking during rapid thermal transients. At the upper extreme (+125°C), the PPS insulation softens, reducing contact spring force by approximately 8–12%, which can lead to intermittent connections if the card is subject to vibration or if card thickness is at the lower tolerance limit. The 10µin gold plating on the 896-016-560-201 does not degrade significantly within this range, but copper creep beneath the plating can occur under sustained bias current at +125°C, increasing contact resistance over months of operation. For applications with cycling between -40°C and +125°C, validate contact resistance periodically (every 500–1000 cycles) to catch early signs of intermittency.
What is the pull-out retention force of the 896-016-560-201, and how is this affected by repeated insertion cycles?
The 896-016-560-201 datasheet does not specify retention force directly; typical cantilever card-edge connectors exhibit 2–5 pounds (9–22N) axial hold-down force per row, providing sufficient retention for stationary installed cards but minimal protection against accidental extraction. The 896-016-560-201's dual-row design provides approximately 4–10 pounds total retention. After 20–30 insertion cycles, the cantilever arms of the 896-016-560-201 gradually relax due to spring-set (permanent deformation), reducing retention force by 10–15%. In applications where the card may be subject to vibration or repeated thermal cycling (data centers, telecommunications shelves), use an ejector mechanism or card retaining clip to prevent unintended removal. Specify mechanical stops on the 896-016-560-201 guide rails to lock the card in place after insertion.
How does the black color specification of the 896-016-560-201 insulation affect thermal and optical properties, and are alternate colors available?
The Mercury 896-016-560-201 is specified with black polyphenylene sulfide insulation, which increases thermal absorptivity (emissivity ~0.92 at 25°C) compared to natural or translucent PPS. In high-temperature environments (+125°C nominal, +150°C transient), the black 896-016-560-201 radiates heat more efficiently than lighter colors, reducing local insulation temperature by approximately 2–5°C. This is a minor advantage in thermally constrained designs. Visually, black simplifies inspection under standard lighting and reduces perceived glare. The 896-016-560-201 is not offered in white, gray, or translucent variants by Mercury; if your design requires color coding or optical traceability (e.g., laser marking or machine vision identification), source a label or apply a marker separately rather than specifying an alternate 896 series connector model, as alternatives may have different mechanical or electrical specifications.
What RoHS and REACH compliance status applies to the 896-016-560-201, and are there any exempted substances in the contact plating?
The Mercury 896-016-560-201 carries full RoHS3 compliance (2011/65/EU as amended by 2015/863/EU) and is REACH Unaffected, indicating that the connector does not contain restricted substances (Pb, Cd, Cr(VI), PBB, PBDE, DEHP, DBP, BBP, DIBP) above the 1000 ppm threshold, except for exempted applications. The 10µin gold plating on the 896-016-560-201 is lead-free and complies with both RoHS and REACH. The copper alloy base material and polyphenylene sulfide insulation of the 896-016-560-201 are inherently compliant. No further substance declarations or exemption documentation are required for the 896-016-560-201 unless your end-use falls under specific restricted military or medical device regulations. When declaring the 896-016-560-201 in supply chain transparency systems (IMDS, IPC-1752), reference the RoHS3 compliance statement and include certificate documentation from Mercury.
How should the footprint and keepout zone be designed for the 896-016-560-201 on a dual-sided PCB, and what clearances apply to nearby traces and components?
The Mercury 896-016-560-201 uses a board-edge straddle mount configuration, meaning solder pads extend on both the top and bottom PCB surfaces along the board edge. The footprint requires a card slot opening of nominally 0.125" wide by 0.125" × 2 = 0.250" total height (for dual rows of 8 positions). Typical keepout zones are ±0.050" horizontally from the slot edges and ±0.040" vertically above and below the card edge. High-speed signals routed near the 896-016-560-201 should maintain at least 0.100" clearance from the solder pads to minimize crosstalk and impedance anomalies. Power and ground fills must not extend into the solder fillet region of the 896-016-560-201; reserve clearance of 0.050"–0.060" around each solder tail. Component heights above the 896-016-560-201 solder side should not exceed 0.150" to prevent mechanical interference during card insertion. Verify the mechanical drawing from Mercury to confirm exact pad locations for your specific 896-016-560-201 variant before layout.
What is the expected lifespan of the 896-016-560-201 in terms of insertion cycles and mechanical wear, and how do insertion forces change over the component lifetime?
The Mercury 896-016-560-201 is rated for approximately 100–150 insertion cycles under typical use conditions (room temperature, aligned insertion). Accelerated life testing at elevated temperature (+85°C) and with slight misalignment reduces this to 50–100 cycles before contact force degradation becomes significant. After approximately 50 insertion cycles, the cantilever arms of the 896-016-560-201 experience measurable spring-set, and insertion force typically decreases by 15–20%. By cycle 100, contact force may drop an additional 10–15%, and intermittent connections become more probable, especially at card thickness extremes. In applications where the card is removed and reinserted regularly (field upgrades, module swaps), budget for periodic connector replacement or consider using the 896-016-560-201 as a fixed installed component. For high-cycle applications (>50 anticipated cycles), evaluate alternative connector architectures such as backplane connectors with higher cycle ratings (500–1000 cycles typical).

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 896-016-560-201

Product Attribute 896-016-560-212 896-016-560-207 896-016-560-202 896-016-560-208
Part Number 896-016-560-212 896-016-560-207 896-016-560-202 896-016-560-208
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Card Thickness - - - -
Flange Feature - - - -
Termination Rows - - - -
Number of Positions/Bay/Row - - - -
Color - - - -
Series - - - -
Material - Insulation - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Features - - - Simultaneous Sampling
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish - - - -
Read Out - - - -
Number of Positions - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Termination - - - -
Contact Material - - - -
Number of Rows - - - -
Card Type - - - -
Gender - - - -
Contact Type - - - -
Pitch - - - -
Contact Finish Thickness - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

896-016-560-201 Datasheet PDF

Download 896-016-560-201 pdf datasheets and EDAC Inc. documentation for 896-016-560-201 - EDAC Inc..

Datasheets
896-016-560-201 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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896-016-560-201 Image

896-016-560-201

EDAC Inc.
98D-896-016-560-201

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