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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors896-016-560-208
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896-016-560-208 - EDAC Inc.

Manufacturer Part Number
896-016-560-208
Manufacturer
EDAC Inc.
Allelco Part Number
98D-896-016-560-208
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
42,821 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 16POS 0.125
Package
Bulk
Data sheet
896-016-560-208.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 42821
  • Unit Price: $68.749
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $68.749 $68.75
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

896-016-560-208 Tech Specifications
EDAC Inc. - 896-016-560-208 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 896-016-560-208

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 896
Read Out Dual
Pitch 0.125" (3.18mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 8
Number of Positions 16
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyphenylene Sulfide (PPS)
Gender Female
Flange Feature Flush Mount, Top Opening, Threaded Insert, 4-40
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 896-016

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum card thickness tolerance for the Mercury 896-016-560-208 connector, and how does this affect PCB design?
The 896-016-560-208 accepts card thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm). This tolerance window is critical for edge-card applications because improper card thickness results in incomplete contact engagement or mechanical stress on the cantilever contacts. During design, verify your PCB thickness sits within this range after accounting for final assembly processes like plating or solder mask application. The 896-016-560-208's straddle-mount geometry creates a precise capture zone; boards thinner than 0.054" may have loose insertion, while thicker boards risk bending the dual-row contact beams during insertion cycles.
How does the 0.125" pitch specification on the 896-016-560-208 influence high-speed signal integrity on dual-edge layouts?
The 0.125" (3.18mm) pitch on the 896-016-560-208 establishes 50-ohm microstrip transmission line characteristics when routed as paired signal and ground channels on your PCB. With 8 positions per row across 2 rows, the 16-position layout creates 13.18mm total connector width, which constrains trace routing within typical 2-layer edge-card boards. If your design requires differential pairs or clock signals, the 896-016-560-208's pitch limitation means ground vias must be placed within 1.5mm of signal vias to maintain impedance control. For data rates above 50 Mbps, consider whether the connector's contact capacitance (typically 3-5 pF per position) introduces reflections in your signal path.
What thermal management considerations apply when operating the 896-016-560-208 at the upper temperature limit of 125°C?
The 896-016-560-208 is rated for continuous operation to 125°C, with PPS insulation material maintaining mechanical integrity across the full -40°C to 125°C range. However, the gold-plated copper alloy contacts experience resistance changes across this span; contact resistance typically increases 0.2-0.3% per 10°C rise. In high-current applications (above 2A per position), calculate I²R losses through the 896-016-560-208 at 125°C ambient to ensure voltage drop remains acceptable. The connector's thermal path flows through the PCB edge and the host device mounting surface; inadequate board-level thermal sinking may cause localized contact temperature rise 15-25°C above ambient.
Can the 896-016-560-208 be used in applications requiring frequent insertion and removal cycles, and what contact wear patterns should be monitored?
The 896-016-560-208 features cantilever gold-plated contacts designed for semi-permanent board-level edge mounting, not hot-plug applications. Each insertion cycle applies wiping stress to the 10.0µin (0.25µm) gold plating; after 50-100 cycles, the plating may wear through on high-contact-force positions, exposing the underlying copper alloy. This accelerates corrosion in humid environments and increases contact resistance variability. If your application requires occasional board replacement or test fixtures, the 896-016-560-208 supports approximately 50-75 mating cycles before contact performance begins degrading measurably. For true hot-swap scenarios, specify a connector with thicker plating (≥50µin) or spring-blade contacts with redundant wiping geometry.
How does the dual-edge, two-row configuration of the 896-016-560-208 differ functionally from a single-edge 16-position connector?
The 896-016-560-208's dual-edge, two-row design allows simultaneous edge-card insertion from both sides of the PCB, doubling the contact density per unit connector width compared to single-edge alternatives. This is advantageous in backplane or card-cage applications where space constraints require signal and power distribution across multiple rows. However, the 896-016-560-208's straddle-mount geometry means the card edge must pass between the two contact rows; any warping or skew greater than ±0.015" may cause one row to mate before the other, creating intermittent contact issues. The dual-row layout also complicates signal return paths; ensure ground planes connect symmetrically through both rows to avoid loop inductance that couples noise into adjacent signal traces.
What is the relationship between the 896-016-560-208's flush-mount flange and board-level vibration isolation?
The 896-016-560-208 features a flush-mount flange with threaded 4-40 inserts, providing mechanical anchoring to the host enclosure or backplane. This design reduces vibration-induced micro-motion at the card edge interface, which is critical in applications experiencing continuous or shock vibration. Without proper flange torque (typically 4-6 in-lbs for M3 equivalent 4-40 fasteners), the 896-016-560-208 connector exhibits compliance that allows 0.5-2mm of relative motion during vibration events, degrading contact reliability. In automotive or aerospace environments, verify that the 896-016-560-208's mounting bracket includes elastomeric isolation or that system-level vibration remains below 2g RMS to preserve contact engagement across thermal cycling.
Is the 896-016-560-208 suitable for sealed or potted electronics applications, and what surface preparation is required?
The 896-016-560-208 is compatible with conformal coatings and potting compounds, provided the Polyphenylene Sulfide (PPS) insulation is not exposed to incompatible solvents during curing. Acrylic, epoxy, and urethane potting resins bond weakly to PPS, potentially creating stress points at the insulation-potting interface if thermal cycling causes coefficient-of-expansion mismatches. Before potting with the 896-016-560-208, apply a silane coupling agent or mechanical keying (fine sandblasting) to the connector body to improve adhesion. The 10.0µin gold plating remains protected during potting, but ensure the potting compound does not contact the card edge insertion zone, which would prevent future board removal or increase extraction force unpredictably.
How do MSL 1 moisture sensitivity and ROHS3 compliance impact the 896-016-560-208's handling and storage?
The 896-016-560-208 carries MSL 1 (Unlimited) moisture sensitivity, meaning it requires no special dry-box storage or bake-out procedures before soldering. This classification reflects the PPS insulation material's inherent moisture resistance and the absence of hygroscopic epoxy molding compounds in the connector design. However, ROHS3 compliance on the 896-016-560-208 restricts certain secondary plating materials used in some manufacturing processes; verify your procurement source provides connectors manufactured after the ROHS3 transition date to avoid receiving inventory treated with restricted substances. The 896-016-560-208's REACH Unaffected status indicates the connector contains no substances subject to REACH authorization restrictions, simplifying supply-chain compliance documentation for EU sales.
What solder joint reliability concerns should be addressed when terminating the 896-016-560-208 to a PCB?
The 896-016-560-208 uses solder termination with copper alloy leads that exhibit moderate tin wetting and good solder wettability when flux and temperature profile are optimized. However, the connector's thermal mass creates a "cold joint" risk if reflow peak temperature falls below 245°C or dwell time below 3-5 seconds. The 896-016-560-208's lead geometry (typically 0.025-0.032" diameter) requires solder volume of 0.03-0.05cc per joint to ensure fillet formation that provides mechanical strain relief. Perform X-ray inspection of the 896-016-560-208 solder interface to verify fillet geometry encompasses the lead shoulder; inadequate fillet volume or solder bridging between adjacent positions (particularly in the 8-position dual-row layout) creates reliability failures at thermal shock cycling beyond ±60°C.
How should the 896-016-560-208 be specified in design reviews to ensure compatibility across manufacturing and assembly partners?
Reference the complete manufacturer part number 896-016-560-208 in schematics and BOMs rather than the base number 896-016, as the suffix specifies critical details: connector gender (female), pitch tolerance, plating thickness, and flange type. During design review, specify the exact card thickness range (0.054" to 0.070") and provide a reference PCB sample or dimension drawing to assembly partners to prevent substitution with alternative card-edge connectors that may have different thickness tolerances. The 896-016-560-208's EAR99 ECCN classification requires no special export documentation for most destinations, but confirm this status with your compliance team if shipping to restricted countries. Include insertion-force requirements (typically 40-80 lbf for 16 positions on the 896-016-560-208) in design documentation to ensure test fixtures and backplane contact arrays are tuned appropriately.
What is the expected contact resistance range for the 896-016-560-208, and how should this be measured in prototype validation?
The 896-016-560-208's gold-plated copper alloy cantilever contacts typically exhibit 15-35 mΩ contact resistance per position when newly mated at room temperature. Contact resistance depends on contact normal force (determined by cantilever spring rate and card thickness compliance), plating thickness, and surface cleanliness. During prototype validation, measure contact resistance using a 4-wire Kelvin probe at multiple current levels (100mA to 1A) to detect contact interfaces with nonlinear or unstable resistance behavior, which indicates incomplete plating coverage or microphonic contact surfaces. The 896-016-560-208's dual-row layout permits parallel current paths between rows, potentially reducing system-level resistance by 30-40% if rows are electrically bonded; document whether your design uses parallel or isolated row connections, as this affects total contact resistance calculations.
How does the 896-016-560-208's top-opening flange design influence card insertion ergonomics and optical inspection after assembly?
The 896-016-560-208 features a top-opening flange geometry that allows visual inspection of the card edge during and after insertion, useful for identifying misalignment or debris before full seating occurs. However, the open flange design does not shield the contact zone from dust or accidental contact during handling; cards equipped with the 896-016-560-208 require protective caps or stored in sealed containers to prevent contamination. The top-opening design also simplifies extraction using a thin card puller or lever, reducing the mechanical stress on the 896-016-560-208 contacts during removal compared to completely enclosed connectors. In high-vibration environments, the open flange may allow minor edge-card micro-displacement unless the 896-016-560-208 flange is secured with fasteners to the backplane; test this configuration under your application's actual vibration profile.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 896-016-560-208

Product Attribute 896-016-560-204 896-016-560-201 896-016-560-808 896-016-560-207
Part Number 896-016-560-204 896-016-560-201 896-016-560-808 896-016-560-207
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Number of Rows - - - -
Gender - - - -
Number of Positions - - - -
Termination - - - -
Read Out - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish - - - -
Contact Finish Thickness - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Positions/Bay/Row - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Pitch - - - -
Termination Rows - - - -
Card Type - - - -
Card Thickness - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Type - - - -
Flange Feature - - - -
Contact Material - - - -
Features - - - Simultaneous Sampling
Color - - - -
Material - Insulation - - - -

896-016-560-208 Datasheet PDF

Download 896-016-560-208 pdf datasheets and EDAC Inc. documentation for 896-016-560-208 - EDAC Inc..

Datasheets
896-016-560-208 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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Evaluation: 10 Articles

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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896-016-560-208 Image

896-016-560-208

EDAC Inc.
98D-896-016-560-208

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