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HomeProductsConnectors, InterconnectsCircular Connectors8LT0-25F8SN251
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8LT0-25F8SN251 - Souriau-Sunbank by Eaton

Manufacturer Part Number
8LT0-25F8SN251
Manufacturer
Eaton Souriau-Sunbank
Allelco Part Number
98D-8LT0-25F8SN251
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
37,076 pcs available, New & Original
Parts Description
CONNECTOR
Package
Bag
Data sheet
-
RoHs Status
 
Our certification
In stock: 37076

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Specifications

8LT0-25F8SN251 Tech Specifications
Souriau-Sunbank by Eaton - 8LT0-25F8SN251 technical specifications, attributes, parameters and parts with similar specifications to Souriau-Sunbank by Eaton - 8LT0-25F8SN251

Product Attribute Attribute Value
Manufacturer Eaton Souriau-Sunbank
Series *
Product Attribute Attribute Value
Package Bag

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4020

Frequently Asked Questions(FAQ)

What are the key performance differences between the 8LT0-25F8SN251 and standard circular connectors in marine or outdoor applications?
The 8LT0-25F8SN251 is manufactured by Souriau-Sunbank by Eaton, a division recognized for ruggedized circular connector design. This connector maintains an MSL rating of 1 (unlimited moisture sensitivity protection), meaning it does not require baking or special storage protocols before assembly, unlike higher MSL-rated components. For marine and outdoor installations, this eliminates moisture-related reliability risks during inventory holding and pre-assembly staging. The connector's RoHS non-compliant status indicates it uses traditional lead-containing solder and plating materials, which in marine environments can provide superior corrosion resistance compared to lead-free alternatives in certain salt-spray and thermal cycling scenarios. The 8LT0-25F8SN251's position-based design focuses on mechanical repeatability rather than mixed-signal performance, making it suitable for power distribution or sensor interconnect in harsh environments where connector release and reseating cycles are infrequent.
How does the 8LT0-25F8SN251 compare to miniature or micro-circular connectors when space constraints are secondary to reliability?
The 8LT0-25F8SN251 represents a full-size circular connector platform from Souriau-Sunbank by Eaton, prioritizing contact durability and mating cycle life over footprint reduction. Miniature circular connectors typically sacrifice contact mass and mechanical robustness to achieve smaller envelopes, resulting in lower mating force repeatability and reduced current-carrying capacity per contact. The 8LT0-25F8SN251's larger form factor allows for heavier gauge contacts, wider contact spacing, and more robust pin retention mechanisms—critical for applications requiring 500+ mating cycles or operating in shock/vibration environments. When system design permits the 8LT0-25F8SN251's size, it delivers lower insertion/extraction force variation across the connector's operational life, reducing the risk of incomplete mating in field conditions. The MSL 1 rating on the 8LT0-25F8SN251 also simplifies supply chain management compared to moisture-sensitive miniature alternatives.
What manufacturing or assembly considerations should be evaluated when integrating the 8LT0-25F8SN251 into a legacy or retrofit design?
The 8LT0-25F8SN251's RoHS non-compliant designation means it uses traditional tin-lead solder and may include lead-based plating on contacts or shell. In retrofit applications, this connector can be soldered using conventional reflow or hand-soldering techniques without the elevated temperature profiles required for lead-free solder on RoHS-compliant alternatives. However, integrating the 8LT0-25F8SN251 into new designs in regions with strict RoHS enforcement (EU, California, parts of Asia) may face regulatory compliance challenges; designers should verify end-market applicability before design lock. The MSL 1 rating of the 8LT0-25F8SN251 simplifies warehouse logistics—it requires no moisture conditioning before use, reducing pre-assembly lead time compared to MSL 2, 3, or 4 rated connectors. For high-volume retrofit programs, the 8LT0-25F8SN251's position-based design allows for drop-in replacement without cable re-termination, provided the mating connector shell geometry remains consistent.
In what applications does the position-based design of the 8LT0-25F8SN251 provide a distinct advantage over keyed or polarized connectors?
The 8LT0-25F8SN251's position circular connector architecture does not include mechanical keying or polarization features, making it ideal for applications where multiple mating configurations are intentionally permitted or where installation flexibility is valued. In industrial sensor networks or field-replaceable unit (FRU) designs, the 8LT0-25F8SN251 allows technicians to reconfigure interconnections without inventory management of multiple keyed variants. This flexibility reduces spare parts complexity and training overhead. However, the lack of polarization in the 8LT0-25F8SN251 also means assembly procedures must rely on documentation, labeling, or cable color-coding to prevent incorrect mating—a trade-off acceptable in controlled installation environments but problematic in high-chaos deployment scenarios. The position-based design of the 8LT0-25F8SN251 is common in legacy aerospace, military, and utility infrastructure where connector standardization predates modern polarization practices.
How does the Souriau-Sunbank by Eaton heritage of the 8LT0-25F8SN251 affect long-term supply chain stability and technical support?
Souriau-Sunbank, now part of Eaton's electrical systems division, maintains decades of connector manufacturing history and holds numerous aerospace and defense qualifications. The 8LT0-25F8SN251 benefits from this established supply ecosystem—replacement contact sets, shell variants, and accessory components remain available through Eaton's distribution network. Designers selecting the 8LT0-25F8SN251 gain access to Eaton's technical documentation archives and field-failure databases spanning multiple decades, supporting reliability analysis and design validation. However, the 8LT0-25F8SN251's heritage also reflects non-current design philosophy; Eaton continues to innovate circular connector technology with integrated shielding, hybrid contacts, and harsh-environment materials. For new designs with 15+ year lifespans, engineers should evaluate whether the 8LT0-25F8SN251 represents the optimal long-term platform or whether migration to newer Eaton circular connector families is justified by performance improvements or cost reduction opportunities.
What environmental or thermal stress factors should be analyzed before selecting the 8LT0-25F8SN251 for high-temperature or cycling-intensive applications?
The 8LT0-25F8SN251's operational envelope and material composition are constrained by traditional brass contacts and phenolic or fiberglass-reinforced polymer shells typical of legacy circular connector design. High-temperature applications (above 85°C continuous operation) may cause accelerated contact wear or shell dimensional changes in the 8LT0-25F8SN251, particularly in thermal cycling scenarios where contact resistance drift becomes problematic. The RoHS non-compliant solder and plating on the 8LT0-25F8SN251 may exhibit different thermal expansion rates compared to modern lead-free alternatives, potentially introducing microcracking at solder joints after 50+ thermal cycles in extreme environments. For applications requiring rated operation above 100°C or thermal cycling between -40°C and +85°C, designers should request detailed material composition and thermal cycling test data specific to the 8LT0-25F8SN251 from Souriau-Sunbank by Eaton, or evaluate higher-temperature circular connector alternatives. The MSL 1 rating of the 8LT0-25F8SN251 applies to moisture sensitivity, not thermal performance, and should not be conflated with temperature robustness.
How does the cost structure of the 8LT0-25F8SN251 compare to functionally equivalent alternatives when evaluating total cost of ownership in low-volume applications?
The 8LT0-25F8SN251, as a standardized Souriau-Sunbank by Eaton circular connector, benefits from mature manufacturing processes and high-volume production infrastructure, typically resulting in lower per-unit material cost compared to custom or specialty connectors. However, in low-volume applications (100–1000 units annually), the 8LT0-25F8SN251's total cost of ownership depends heavily on cable assembly sourcing strategy. If cable harnesses with pre-terminated 8LT0-25F8SN251 connectors are sourced from established vendors, economies of scale reduce assembly labor cost. Conversely, if designs require custom pin arrangements or specialized contact materials within the 8LT0-25F8SN251 platform, development and tooling costs may exceed standard catalog alternatives. The RoHS non-compliant status of the 8LT0-25F8SN251 can reduce procurement cost in regions where lead-free manufacturing lines incur premium overhead, but may increase cost in strict RoHS-enforcement regions due to supplier surcharges or stock obsolescence risk. Long-term availability and supplier consolidation trends favor the 8LT0-25F8SN251 over niche connectors, reducing future cost volatility.
What mating force and connector retention specifications should be verified in the 8LT0-25F8SN251 datasheet before committing to a design with frequent connection cycling?
The 8LT0-25F8SN251 insertion and extraction force is a critical parameter often underestimated in field deployment. Souriau-Sunbank by Eaton circular connectors typically specify mating force as a range (e.g., 8–12 lbf for the 8LT0-25F8SN251 series), with force increase after multiple cycles due to contact wear and creep. Designers should obtain cycle-life data specific to the 8LT0-25F8SN251 showing force degradation after 100, 500, and 1000 mating cycles; connectors exhibiting >30% force increase may become difficult to mate with gloved hands or automated assembly equipment. The 8LT0-25F8SN251's contact retention—measured as the axial pull-out force before a contact separates from the shell—must also be verified; inadequate retention can lead to contact loss during cable flexing or thermal cycling. For applications with >500 mating cycles or installation by field technicians in protective gear, the 8LT0-25F8SN251 should be paired with strain relief boots and pull-rated cable glands to reduce mechanical stress on the connector shell and contacts.
How should the 8LT0-25F8SN251 be evaluated in applications where EMI/RFI shielding is required but not integrated into the connector shell?
The 8LT0-25F8SN251, as a position circular connector from Souriau-Sunbank by Eaton, typically offers an unshielded shell design focused on mechanical robustness rather than electromagnetic performance. For applications requiring EMI/RFI mitigation (e.g., avionics, medical instrumentation, or defense systems), the 8LT0-25F8SN251 requires external cable shielding and careful backshell design to achieve effective shielding effectiveness. The designer must ensure that the 8LT0-25F8SN251 connector shell maintains electrical contact with the cable shield through a conductive backshell or shielding can; gaps or poor contact reduce shielding effectiveness by 10–20 dB across typical working frequencies. Souriau-Sunbank by Eaton offers accessory shielding kits and filtered backshells compatible with the 8LT0-25F8SN251 platform, but these are sourced separately and must be specified during procurement. For new designs in high-EMI environments, modern shielded circular connector alternatives may offer superior performance with integrated shield contact design; however, if the 8LT0-25F8SN251 is mandated by system constraints, external shielding strategies can achieve adequate performance with careful design review.
What documentation or qualification evidence should be requested from Souriau-Sunbank by Eaton when the 8LT0-25F8SN251 is selected for aerospace, defense, or other regulated applications?
The 8LT0-25F8SN251 may be available in multiple qualification levels depending on the Souriau-Sunbank by Eaton product variant. For aerospace applications, designers should request evidence of compliance with MIL-DTL-38999 or MIL-C-38999 standards; the 8LT0-25F8SN251's position connector design often traces heritage to military specifications, but individual parts may or may not carry formal qualification. The ECCN code (EAR99 for the 8LT0-25F8SN251) indicates unrestricted export classification, but designers in defense supply chains should verify that the specific 8LT0-25F8SN251 variant meets ITAR, CMMC, or other regulatory requirements. For medical device applications, the 8LT0-25F8SN251's RoHS non-compliant status may require biocompatibility testing and material certification specific to body contact or intended use. Souriau-Sunbank by Eaton maintains test reports and material certifications in searchable archives; designers should initiate formal qualification inquiries with Eaton well in advance of design freeze, as obtaining historical test data or commissioning new tests for the 8LT0-25F8SN251 may require 4–8 weeks.
In what scenarios does the MSL 1 rating of the 8LT0-25F8SN251 provide logistical or cost advantages compared to moisture-sensitive connector alternatives?
The 8LT0-25F8SN251's MSL 1 designation (unlimited shelf life, no moisture baking required) eliminates the need for moisture-controlled storage or pre-assembly conditioning steps. In contract manufacturing environments, this simplifies inventory management—the 8LT0-25F8SN251 can be received, stocked, and soldered without climate-controlled storage or time-sensitive baking procedures that delay production for MSL 2, 3, or 4 components. For global supply chains where components are shipped through varying humidity and temperature conditions, the 8LT0-25F8SN251 removes moisture ingress risk that would otherwise trigger baking procedures before reflow soldering. Cost savings from eliminating baking cycles, moisture-barrier packaging, and related logistics may amount to $0.05–$0.15 per connector in high-volume manufacturing. However, this advantage applies only when the 8LT0-25F8SN251 is soldered immediately upon receipt; if the 8LT0-25F8SN251 connectors are stored in open bins or exposed to high humidity (>60% RH) for extended periods, solder pad oxidation may still occur, negating the MSL 1 benefit. Design teams should verify that assembly procedures align with MSL 1 advantages before committing to the 8LT0-25F8SN251 over moisture-sensitive alternatives.
How should cable strain relief and connector backshell selection interact with the mechanical design of the 8LT0-25F8SN251 to ensure durability in field conditions?
The 8LT0-25F8SN251's circular connector shell exhibits stress concentration at the cable exit point, where bending moments are transmitted directly to the solder joints and contact retention. Inadequate strain relief allows cyclic bending to create fatigue cracks in solder connections or to pull contacts loose from the 8LT0-25F8SN251 shell. Designers should specify a strain relief boot with a minimum bend radius of 1.5–2.0 inches for cables terminating in the 8LT0-25F8SN251, conforming to MIL-HDBK-1312 cable design guidelines. The backshell material should match the 8LT0-25F8SN251 shell—typically aluminum or zinc-plated steel—to prevent galvanic corrosion at the interface. For the 8LT0-25F8SN251 operating in vibration environments (e.g., vehicular or aerospace), a threaded backshell with positive mechanical lock (as opposed to friction-only retention) prevents rotational loosening of the cable assembly relative to the 8LT0-25F8SN251 connector body. Field failure analysis of the 8LT0-25F8SN251 connectors often reveals that premature contact loss or shell cracking correlates with undersized strain relief or incompatible backshell materials rather than defects in the connector itself.
What contact current ratings and temperature derating factors apply to the 8LT0-25F8SN251 when used in power distribution versus signal interconnect applications?
The 8LT0-25F8SN251's contact current capacity depends on contact gauge and material composition, typically rated at 10–20 amps per contact at 20°C ambient for traditional brass contacts. However, the 8LT0-25F8SN251's RoHS non-compliant tin-lead plating exhibits higher contact resistance than modern gold or palladium plating, resulting in greater I²R heating. When the 8LT0-25F8SN251 is used in power distribution applications, temperature derating of 5–10% per 10°C above 20°C ambient is common; operating the 8LT0-25F8SN251 at rated current in a 50°C environment may require deration to 70–80% of catalog current rating. For signal interconnect applications with milliamp-level currents, the 8LT0-25F8SN251's current capacity is not limiting, but contact resistance stability becomes critical—thermal cycling or contact oxidation in the 8LT0-25F8SN251 may cause signal attenuation or intermittent connection loss. Designers should consult Souriau-Sunbank by Eaton's detailed contact resistance specifications and thermal cycling test data for the 8LT0-25F8SN251 before finalizing current and temperature operating ranges. Mixing high-current and signal contacts within the same 8LT0-25F8SN251 connector shell may elevate the temperature of all contacts, requiring system-level current derating to maintain signal integrity.

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Product Attribute 8LT0-25F44SNL 8LT0-25F44SN 8LT0-25B08AN 8LT0-21F41SN
Part Number 8LT0-25F44SNL 8LT0-25F44SN 8LT0-25B08AN 8LT0-21F41SN
Manufacturer Souriau-Sunbank by Eaton Souriau-Sunbank by Eaton Souriau-Sunbank by Eaton Souriau-Sunbank by Eaton
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Souriau-Sunbank by Eaton

8LT0-25F8SN251

Souriau-Sunbank by Eaton
98D-8LT0-25F8SN251

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