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HomeProductsConnectors, InterconnectsCircular Connectors - HousingsMS27468T15B35P-LC
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MS27468T15B35P-LC - Souriau-Sunbank by Eaton

Manufacturer Part Number
MS27468T15B35P-LC
Manufacturer
Eaton Souriau-Sunbank
Allelco Part Number
98D-MS27468T15B35P-LC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,883 pcs available, New & Original
Parts Description
8LT 37C 37#22D PIN J/N
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 44883
  • Unit Price: $42.471
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $42.471 $42.47
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MS27468T15B35P-LC Tech Specifications
Souriau-Sunbank by Eaton - MS27468T15B35P-LC technical specifications, attributes, parameters and parts with similar specifications to Souriau-Sunbank by Eaton - MS27468T15B35P-LC

Product Attribute Attribute Value
Manufacturer Eaton Souriau-Sunbank
Series *
Product Attribute Attribute Value
Package Bulk
Base Product Number MS27468T15B

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8538.90.8180

Frequently Asked Questions(FAQ)

What are the key differences between the MS27468T15B35P-LC and standard commercial circular connectors for aerospace applications?
The MS27468T15B35P-LC is a MIL-spec circular connector designed to meet stringent aerospace reliability standards, unlike commercial alternatives. Its 37-position, size 15 configuration with jam nut shell design provides robust mechanical coupling suitable for vibration-intensive environments. The olive drab cadmium shell plating and gold contact plating on the MS27468T15B35P-LC deliver superior corrosion resistance compared to standard nickel or tin plating found in commercial connectors. With a 500 V rating and 5 A per contact capacity, the MS27468T15B35P-LC supports moderate-power signal and control circuits. The EREL qualification indicates compliance with established aerospace reliability protocols, making it suitable for mission-critical applications where failure rates and performance predictability are regulated.
How does panel mounting configuration affect installation and maintenance procedures for the MS27468T15B35P-LC?
The MS27468T15B35P-LC is configured for panel mounting with receptacle orientation, meaning the connector body mounts flush through a bulkhead or enclosure wall. This design allows mating plugs to connect and disconnect from the external side without requiring internal access. The jam nut shell style on the MS27468T15B35P-LC enables hand-tool tightening for secure mechanical engagement, reducing the need for specialized installation equipment. Panel mounting simplifies field replacement and maintenance workflows because technicians can service the connector from one side only. The crimp termination style of the MS27468T15B35P-LC requires proper wire preparation and crimping tools during initial assembly, but once installed, the contacts remain mechanically stable through vibration cycles and thermal cycling, reducing maintenance frequency.
What wire gauge compatibility and current distribution considerations apply when designing harnesses for the MS27468T15B35P-LC?
The MS27468T15B35P-LC is specified for 22 AWG wire gauge, which represents a standard choice for aerospace interconnect applications balancing flexibility with current-carrying capacity. At the 5 A contact rating, each individual contact on the MS27468T15B35P-LC can safely carry up to 5 amperes, but actual circuit current should account for contact resistance, environmental temperature, and bundle heating effects. With 37 positions available on the MS27468T15B35P-LC, designers must distribute high-current circuits across multiple contacts rather than concentrating power through a single pathway. For example, a 10 A power bus would require minimum two contacts on the MS27468T15B35P-LC, with consideration for return paths to maintain balanced current distribution. Wire gauge uniformity across all circuits using the MS27468T15B35P-LC simplifies manufacturing, reduces assembly errors, and maintains predictable voltage drop performance across the connector interface.
How do the MS27468T15B35P-LC gold plating specifications compare to other contact finishes for long-term signal integrity in harsh environments?
The MS27468T15B35P-LC employs gold plating on all current-carrying contacts, which provides superior electrical conductivity and corrosion resistance compared to silver or tin alternatives. Gold does not form stable oxides under normal atmospheric exposure, preserving contact resistance stability over years of storage and operational cycles. In the MS27468T15B35P-LC design, gold plating thickness typically ranges from 50-100 microinches, sufficient to prevent base metal migration during thermal cycling and salt-fog exposure. Compared to unplated or base-metal contacts, the MS27468T15B35P-LC gold finish maintains consistent millivolt-level contact resistance even after exposure to humidity, salt spray, or industrial contamination. However, gold's higher cost is reflected in the MS27468T15B35P-LC pricing relative to commercial tin-plated alternatives. For applications requiring long-term reliability in aerospace, marine, or high-vibration environments, the MS27468T15B35P-LC gold contact specification justifies the cost through reduced maintenance and failure risk.
What thermal and voltage derating factors should be applied when using the MS27468T15B35P-LC in continuous high-temperature operations?
The MS27468T15B35P-LC is rated for 500 V maximum, but this specification assumes standard ambient temperature conditions. In continuous high-temperature environments exceeding 70°C, contact resistance on the MS27468T15B35P-LC increases slightly due to reduced gold conductivity and insulation material softening. For every 10°C temperature rise above 70°C, designers should conservatively reduce the MS27468T15B35P-LC 5 A contact rating by approximately 10%, meaning at 100°C operation, effective current capacity drops to roughly 4.5 A per contact. The aluminum alloy shell of the MS27468T15B35P-LC exhibits excellent thermal conductivity, helping dissipate localized contact heating, but wire insulation inside the connector mating area may limit overall thermal performance. Voltage stress on the MS27468T15B35P-LC also increases with temperature; maintaining a safety margin of 20-30% below the 500 V rating in continuous high-temperature applications ensures long-term dielectric integrity and reduces the risk of intermittent arcing or flashover.
How does the jam nut attachment style of the MS27468T15B35P-LC affect connector retention and repeatability across multiple mate-demate cycles?
The MS27468T15B35P-LC jam nut design uses threaded coupling for quick-disconnect functionality with hand-tool engagement suitable for field environments. Unlike bayonet or push-pull alternatives, the jam nut mechanism on the MS27468T15B35P-LC allows technicians to control coupling force directly, ensuring consistent mating pressure across repeated connections. After approximately 50-100 mate-demate cycles on a properly installed MS27468T15B35P-LC, the jam nut threads may develop slight play, but gold-plated contacts and the crimp termination design resist wear-induced contact resistance changes. The MS27468T15B35P-LC jam nut does not require specialized mating tools beyond a wrench or pliers, reducing support logistics for remote deployments. However, the MS27468T15B35P-LC requires deliberate disconnection effort, preventing accidental separation compared to lighter-duty push-pull connectors. For applications requiring frequent field maintenance, the MS27468T15B35P-LC jam nut design supports reliable repeatability when personnel follow proper hand-tool procedures and inspect threads periodically for cross-threading damage.
What is the functional difference between the MS27468T15B35P-LC and similar 37-position alternatives with different shell sizes or contact plating specifications?
The MS27468T15B35P-LC specifies size 15 shell geometry, which accommodates 37 contacts in a physically compact cylindrical package measuring approximately 1.5 inches in diameter. Larger shell sizes, such as size 20 or 28, offer higher contact counts but increase connector mass, panel cutout requirements, and cable transition complexity. The MS27468T15B35P-LC olive drab cadmium plating on the aluminum shell provides military-specification corrosion protection suitable for aircraft exteriors and salty environments, whereas commercial alternatives often use painted or anodized finishes with lower durability ratings. The MS27468T15B35P-LC gold contact plating ensures low and stable contact resistance; connectors with nickel or tin plating exhibit higher resistance drift under thermal cycling. The 5 A per-contact rating on the MS27468T15B35P-LC is typical for size 15 designs, but higher-current variants exist with thicker contact pins. For applications requiring 37-signal integration with MIL-spec compliance, environmental durability, and proven field history, the MS27468T15B35P-LC represents a standardized choice; non-standard alternatives introduce qualification uncertainty and supply chain complexity.
How do the crimp termination requirements of the MS27468T15B35P-LC impact manufacturing quality and field reliability compared to solder or terminal-strip alternatives?
The MS27468T15B35P-LC utilizes crimp termination, where individual 22 AWG wires are mechanically deformed onto contact pin barrels using calibrated crimping tools. This method eliminates heat stress on insulation and connector body, reducing the risk of thermal damage compared to soldering. Proper crimp geometry on the MS27468T15B35P-LC creates a gas-tight wire-to-contact interface that resists corrosion and vibration-induced loosening over decades of service. Incorrect crimp force or wire preparation on the MS27468T15B35P-LC contacts results in high resistance, noise, or intermittent faults; therefore, manufacturing requires crimping tool calibration and periodic process audits. Field repair of the MS27468T15B35P-LC is straightforward: defective contacts can be replaced using standard aerospace repair practices without removing the connector from the panel. Solder-terminated alternatives eliminate specialized tools but introduce thermal stress to insulation and require longer cooling cycles. The MS27468T15B35P-LC crimp design balances manufacturing precision, field replaceability, and long-term electrical stability, making it preferred for aerospace applications where reliability documentation and traceability are required.
What EMI and shielding considerations apply when integrating the MS27468T15B35P-LC in high-frequency signal or power distribution networks?
The MS27468T15B35P-LC is an unshielded circular connector, meaning individual signals share the common aluminum shell cavity without isolated shields. For low-frequency applications (audio, control circuits below 1 MHz), the MS27468T15B35P-LC aluminum shell provides adequate common-mode coupling reduction. At higher frequencies or in environments with strong RF sources, the MS27468T15B35P-LC may exhibit cross-talk between adjacent contacts, potentially degrading signal integrity on sensitive analog or high-speed digital lines. Designers using the MS27468T15B35P-LC in avionics or radar systems should separate high-frequency and low-frequency circuits across different connector positions, group return paths near signal contacts, and consider external shielded cable bundles for sensitive circuits. The MS27468T15B35P-LC shell plating and contact gold finish do not degrade electromagnetic performance but do not add active shielding. If EMI suppression is critical, shielded variants of similar MIL-spec 37-position connectors exist but increase cost and complexity; the MS27468T15B35P-LC represents the standard choice for applications without strict RF isolation requirements.
How do RoHS compliance implications affect the MS27468T15B35P-LC supply chain and long-term procurement strategy?
The MS27468T15B35P-LC is designated as non-RoHS compliant (RoHS: N), indicating the presence of restricted substances such as cadmium in the shell plating and lead in solder materials. For commercial markets, RoHS compliance is mandatory in many jurisdictions, but aerospace and defense applications operate under exemptions that allow continued use of cadmium-plated connectors like the MS27468T15B35P-LC. The MS27468T15B35P-LC cadmium plating provides superior corrosion resistance and environmental durability compared to RoHS-compliant alternatives such as nickel or zinc, particularly in salt-fog and high-altitude exposure. Procurement teams using the MS27468T15B35P-LC must document non-RoHS status for supply chain partners and end-customer compliance tracking; failure to disclose this can trigger compliance audits or contract disputes. The MS27468T15B35P-LC supply chain remains stable because military and aerospace programs accept cadmium plating under formal exemptions, but regulations may evolve. For long-term programs, designers should confirm that the MS27468T15B35P-LC specification aligns with customer environmental declarations and regulatory roadmaps to avoid mid-production design transitions.
What are the mechanical stress and vibration performance limits of the MS27468T15B35P-LC when deployed in high-shock aerospace environments?
The MS27468T15B35P-LC aluminum alloy shell and crimp contact design are engineered to withstand vibration and shock conditions typical of aircraft and missile applications. The EREL qualification on the MS27468T15B35P-LC indicates compliance with established military vibration standards (typically 10-2000 Hz sweep rates with peak acceleration around 10-20 G). The jam nut attachment and panel-mount configuration of the MS27468T15B35P-LC distribute mechanical stress across the mating surface, preventing connector loosening or separation during high-G maneuvers. Contact retention force on the MS27468T15B35P-LC is typically 8-12 ounces per contact, sufficient to maintain electrical continuity through transient shock events without permanent deformation. Wire gauge and insulation selection on harnesses using the MS27468T15B35P-LC should match connector mechanical capabilities; undersized wires can fracture under bundle vibration, causing intermittent faults. The MS27468T15B35P-LC is not recommended for direct exposure to sustained vibration above 50 G or thermal shock exceeding ±100°C per minute; such environments require ruggedized variants or potted connector housings to isolate the MS27468T15B35P-LC from transient mechanical coupling.
How should the MS27468T15B35P-LC be specified and validated during the design-in phase to minimize supply chain delays and production qualification cycles?
Early MS27468T15B35P-LC specification during design reviews ensures that connector geometry, pin assignments, and environmental requirements align with system architecture and procurement lead times. The MS27468T15B35P-LC is an established MIL-spec connector with multiple qualified suppliers (Amphenol Aerospace and alternatives), reducing supply risk compared to custom designs. During prototype build, engineers should source MS27468T15B35P-LC samples from the intended production supplier and perform mating cycle tests, contact resistance measurements, and environmental exposure (salt-fog, thermal cycling) to validate design assumptions. The MS27468T15B35P-LC qualification package typically includes manufacturing process certifications, material compliance data, and electrical test reports; these should be archived for traceability and future design reviews. If the MS27468T15B35P-LC design is finalized late in the development cycle, procurement lead times (typically 12-16 weeks for production quantities) may compress the production schedule. Early MS27468T15B35P-LC supplier engagement, design freeze documentation, and process audits reduce the risk of compatibility surprises, rework, and schedule delays during manufacturing ramp-up.

Parts with Similar Specifications

The three parts on the right have similar specifications to Souriau-Sunbank by Eaton MS27468T15B35P-LC

Product Attribute MS27468T15B35PA-LC MS27468T15B35PA-LC MS27468T15B35J-LC MS27468T15B35JA-LC
Part Number MS27468T15B35PA-LC MS27468T15B35PA-LC MS27468T15B35J-LC MS27468T15B35JA-LC
Manufacturer Conesys Souriau-Sunbank by Eaton TE Connectivity Deutsch Connectors TE Connectivity Deutsch Connectors
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -

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Souriau-Sunbank by Eaton

MS27468T15B35P-LC

Souriau-Sunbank by Eaton
98D-MS27468T15B35P-LC

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