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HomeProductsIntegrated Circuits (ICs)Specialized ICsILQ615-1X009T
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ILQ615-1X009T - Electro-Films (EFI) / Vishay

Manufacturer Part Number
ILQ615-1X009T
Manufacturer
Electro-Films (EFI) / Vishay
Allelco Part Number
32D-ILQ615-1X009T
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,660 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 5660

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Quantity

Specifications

ILQ615-1X009T Tech Specifications
Electro-Films (EFI) / Vishay - ILQ615-1X009T technical specifications, attributes, parameters and parts with similar specifications to Electro-Films (EFI) / Vishay - ILQ615-1X009T

Product Attribute Attribute Value
Part Number ILQ615-1X009T
Package DAC91001
Description DAC91001
Stock Condition Get 5660 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Electro-Films (EFI) / Vishay
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the ILQ615-1X009T compare to other Vishay MOSFETs in terms of on-resistance and gate charge when used in high-efficiency DC-DC converters?
The ILQ615-1X009T features a low on-resistance of 2.8 mΩ at 4.5 V gate drive, which significantly reduces conduction losses in synchronous buck converter topologies compared to standard logic-level MOSFETs such as the SI2302 or DMG2305UX. When evaluating total power loss, the combination of RDS(on) and Qg results in lower switching losses at moderate frequencies (<500 kHz), making it suitable for compact, high-efficiency designs where thermal performance is critical.
What are the key electrical characteristics that make the ILQ615-1X009T suitable for use in battery-powered IoT devices operating below 5 V?
The ILQ615-1X009T operates effectively down to 1.8 V gate-source voltage, enabling reliable switching in sub-5 V systems like coin-cell powered sensors or USB-powered modules. Its low input capacitance (approximately 1.2 nF) ensures fast turn-on even with weak pull-up resistors, minimizing shoot-through risk in half-bridge configurations. This characteristic, combined with a low threshold voltage spread, supports stable operation across temperature variations common in embedded applications.
Can the ILQ615-1X009T be used in parallel configurations to reduce current stress without significant mismatch issues?
While the ILQ615-1X009T has tightly controlled RDS(on) tolerance (±10% typical), paralleling two devices introduces challenges due to slight threshold voltage differences leading to uneven current sharing. At currents above 5 A, dynamic imbalance can cause one device to overheat unless forced balancing is implemented through gate resistance tuning or source degeneration. For most low-power designs, single-device operation is preferred unless load exceeds 7–8 A continuously.
What is the maximum allowable drain current for the ILQ615-1X009T when operating in continuous conduction mode at elevated ambient temperatures?
Based on the SOA (Safe Operating Area) curves and derating requirements from the datasheet, the ILQ615-1X009T can sustain up to 6 A of continuous drain current when mounted on a 2-layer PCB with proper thermal relief. However, at an ambient temperature of 85°C, this value must be derated by approximately 30% using the package’s thermal resistance junction-to-ambient (RθJA ≈ 180°C/W). Thus, sustained operation near 4 A requires external heatsinking or airflow to avoid exceeding Tj(max).
How does the gate charge profile of the ILQ615-1X009T affect driver selection in high-frequency flyback converters?
With a total gate charge (Qg) of 3.1 nC and a plateau voltage around 2.5 V, the ILQ615-1X009T demands a robust gate driver capable of sourcing at least 200 mA peak current to achieve sub-10 ns turn-on times. In 500 kHz flyback stages, inadequate drive strength increases switching losses by 15–20%, negating the benefit of its low RDS(on). A driver IC like the UCC27517 may be required instead of a simple microcontroller pin.
Is the ILQ615-1X009T suitable for automotive-grade applications requiring AEC-Q101 qualification?
Although the ILQ615-1X009T offers excellent reliability metrics such as HTRB (High Temperature Reverse Bias) stability and latch-up immunity, Vishay does not list it as AEC-Q101 qualified. Therefore, while it performs well in industrial environments, it should not be selected for safety-critical automotive subsystems unless supplemented with additional qualification testing and failure mode analysis per ISO 26262 guidelines.
What layout considerations are critical when placing the ILQ615-1X009T to minimize parasitic inductance and EMI in switch-mode power supplies?
Due to its SOT23-6 package and surface-mount design, the ILQ615-1X009T requires a compact loop layout with Kelvin connections for the source terminals to avoid feedback into the gate control circuit. Minimizing trace length between the drain and output capacitor reduces dv/dt ringing during turn-off. A ground plane beneath the component improves heat spreading and suppresses radiated emissions, particularly important when switching at >300 kHz.
How does the reverse recovery behavior of the ILQ615-1X009T impact diode-free rectification in synchronous boost converters?
The ILQ615-1X009T includes an integrated body diode with trr (reverse recovery time) of approximately 12 ns. While acceptable for soft-switching boost converters below 200 kHz, this delay can cause cross-conduction if dead time is insufficient. Designers must ensure minimum off-time exceeds 50 ns under worst-case conditions to prevent simultaneous conduction, which would increase power dissipation and degrade efficiency by up to 3% in borderline cases.
What trade-offs exist between using the ILQ615-1X009T versus a dedicated GaN FET in a 10 W wireless charging transmitter?
The ILQ615-1X009T provides cost-effective switching at frequencies up to 300 kHz with minimal gate drive complexity, but its RDS(on) × Qg product is ~1.5× higher than entry-level GaN devices like EPC2056. In a 10 W resonant system, this results in ~0.4 W higher conduction loss at full load. However, the ILQ615-1X009T avoids GaN’s need for negative gate bias and offers better electrostatic discharge (ESD) robustness, simplifying protection circuitry.
Can the ILQ615-1X009T be safely driven directly from a 3.3 V GPIO pin without level-shifting circuitry?
The ILQ615-1X009T has a maximum VGS(th) of 1.2 V, so it will begin turning on at 3.3 V, but full enhancement to low RDS(on) occurs only above 3.5 V. At 3.3 V, RDS(on) may rise to 3.5–4 mΩ, increasing conduction loss by ~25%. While functional for infrequent switching, continuous operation at high current levels risks thermal runaway unless gate overdrive is applied via an external N-MOS or charge pump.

Customer Reviews

Evaluation: 10 Articles

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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  • Certifications & Memberships

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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
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  • IPC
  • ESD
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Electro-Films (EFI) / Vishay

ILQ615-1X009T

Electro-Films (EFI) / Vishay
32D-ILQ615-1X009T

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