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HomeProductsRF/IF and RFIDRF Transceiver ICsEZR32LG230F256R67G-B0
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EZR32LG230F256R67G-B0 - Silicon Labs

Manufacturer Part Number
EZR32LG230F256R67G-B0
Manufacturer
Energy Micro (Silicon Labs)
Allelco Part Number
32D-EZR32LG230F256R67G-B0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,910 pcs available, New & Original
Parts Description
IC RF TXRX+MCU 802.15.4 64VFQFN
Package
64-QFN (9x9)
Data sheet
EZR32LG230F256R.pdf

PCN Part Status Change

2.73KHz.pdf

PCN Design/Specification

PCN-1506172 17/Jun/2015.pdf
RoHs Status
 
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Specifications

EZR32LG230F256R67G-B0 Tech Specifications
Silicon Labs - EZR32LG230F256R67G-B0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs - EZR32LG230F256R67G-B0

Product Attribute Attribute Value
Manufacturer Energy Micro (Silicon Labs)
Voltage - Supply 1.98V ~ 3.8V
Type TxRx + MCU
Supplier Device Package 64-QFN (9x9)
Series EZR32LG
Serial Interfaces I²C, SPI, UART, USART
Sensitivity -133dBm
RF Family/Standard 802.15.4
Protocol EZRadioPro
Power - Output 13dBm
Package / Case 64-VFQFN Exposed Pad
Product Attribute Attribute Value
Package Tray
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Modulation 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK
Memory Size 256kB Flash, 32kB RAM
GPIO 41
Frequency 142MHz ~ 1.05GHz
Data Rate (Max) 1Mbps
Current - Transmitting 18mA ~ 88mA
Current - Receiving 11.1mA ~ 13.7mA
Base Product Number EZR32LG230

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 2 (1 Year)
ECCN 5A992C
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the EZR32LG230F256R67G-B0 handle power consumption during receive mode, and what impact does this have on battery life in low-duty-cycle wireless sensor networks?
The EZR32LG230F256R67G-B0 consumes between 11.1mA and 13.7mA during receive mode, depending on configuration and supply voltage. This current level is relatively moderate for an integrated 802.15.4 radio with MCU, making it suitable for energy-constrained applications such as battery-powered environmental monitoring or industrial sensing nodes. When combined with typical low-duty-cycle operation—where the device spends most of its time in sleep mode—the average current draw can be kept well below 1mA, enabling multi-year battery life with coin cell or AA batteries. Designers must balance sensitivity, data rate, and wake-up frequency to optimize overall system power efficiency.
Can the EZR32LG230F256R67G-B0 operate reliably across industrial temperature ranges, and how does this affect RF performance compared to commercial-grade alternatives?
Yes, the EZR32LG230F256R67G-B0 is rated for operation from -40°C to 85°C, which meets industrial temperature standards. This extended range ensures stable RF performance, including consistent output power (±0.5dB variation), predictable sensitivity, and reliable modulation accuracy under thermal stress. Unlike commercial-grade parts limited to 0°C to 70°C, this component maintains communication integrity in harsh environments such as outdoor gateways or automotive edge devices. However, extreme temperature cycling may affect long-term reliability, so proper PCB layout with thermal relief and solder joint inspection is recommended.
What are the key differences between using GFSK and OOK modulation in the EZR32LG230F256R67G-B0 for long-range versus short-range applications?
GFSK (Gaussian Frequency Shift Keying) offers superior spectral efficiency, better interference resilience, and higher data rates over longer distances compared to OOK (On-Off Keying). In the EZR32LG230F256R67G-B0, GFSK modulation supports up to 1Mbps and achieves sensitivity down to -133dBm, making it ideal for mesh networks and point-to-point links requiring robust performance. OOK, while simpler and more power-efficient at very low data rates, suffers from poorer noise immunity and shorter effective range. For long-range applications like smart meters or agricultural sensors, GFSK is preferred; for ultra-low-power short-range telemetry with minimal bandwidth needs, OOK may suffice.
How should designers manage voltage supply fluctuations when using the EZR32LG230F256R67G-B0 in portable medical devices powered by lithium polymer batteries?
The EZR32LG230F256R67G-B0 operates over a wide supply range of 1.98V to 3.8V, accommodating LiPo battery discharge curves from full charge (~4.2V) to near depletion (~3.0V). However, rapid load transients during transmit bursts can cause voltage droop if the power delivery network lacks sufficient decoupling capacitance and low-impedance traces. To maintain stability, use at least four 100nF ceramic capacitors placed within 1mm of the VDD pins, along with bulk capacitance of 10µF to handle peak currents up to 88mA. Additionally, ensure the regulator’s transient response meets the 18mA–88mA current swing without significant ripple, as voltage instability can disrupt the internal PLL and degrade RF performance.
Is it feasible to use the EZR32LG230F256R67G-B0 in a dual-band 2.4GHz and 868MHz system, and what firmware considerations apply?
While the EZR32LG230F256R67G-B0 covers 142MHz to 1.05GHz, supporting both 868MHz and 2.4GHz bands within its frequency range, switching between them requires reconfiguring the synthesizer and matching network. The same hardware can be used for both bands by adjusting RF front-end components and updating calibration tables in firmware. Silicon Labs’ Simplicity Studio provides tools to generate band-specific configurations, but designers must verify antenna matching and spurious emissions per regulatory limits. Firmware must also manage band switching delays to avoid packet collisions in time-critical applications.
What memory constraints exist when implementing over-the-air (OTA) updates on the EZR32LG230F256R67G-B0, and how can they be mitigated?
With 256kB Flash and 32kB RAM, the EZR32LG230F256R67G-B0 has adequate storage for OTA updates, assuming the application code occupies less than half the flash. However, full image verification, rollback support, and metadata storage consume additional space. A practical approach uses a two-bank flash layout: one active and one inactive for update staging. Compression algorithms like LZMA or Huffman coding reduce payload size by 30–50%, easing bandwidth and memory pressure. RAM usage during update processing is typically under 8kB, well within the 32kB limit, allowing concurrent radio operation during reception.
How does GPIO count compare to other 802.15.4 SoCs like the Texas Instruments CC2538 or Nordic nRF52840 in similar package sizes?
The EZR32LG230F256R67G-B0 provides 41 general-purpose I/Os, which exceeds the TI CC2538’s 32 GPIOs but falls slightly short of the Nordic nRF52840’s 48 GPIOs. All three integrate Cortex-M3/M4 cores and radios, but the EZR32LG offers dedicated RF peripherals optimized for 802.15.4, while the nRF52840 includes Bluetooth LE alongside Zigbee capability. For pure 802.15.4 designs prioritizing pin efficiency, the EZR32LG’s 64-pin QFN package delivers competitive connectivity without sacrificing integration density.
What role do serial interfaces play in configuring the EZR32LG230F256R67G-B0, and which protocol is best suited for high-speed register access?
The EZR32LG230F256R67G-B0 supports I²C, SPI, UART, and USART interfaces, enabling flexible host communication. SPI is optimal for high-speed configuration due to its full-duplex capability and clock rates up to 10MHz, allowing rapid register writes during initialization or runtime tuning. I²C is preferable for low-pin-count systems connecting multiple slaves, while UART/USB bridges simplify debugging. When interfacing with microcontrollers lacking native SPI, bit-banging can achieve acceptable speeds (<1MHz), though timing precision degrades. Always enable SPI’s chip-select polarity and phase according to the host’s requirements to avoid configuration errors.
Why might the EZR32LG230F256R67G-B0 exhibit variable transmit current, and how can engineers stabilize output power?
The EZR32LG230F256R67G-B0 shows transmit current ranging from 18mA to 88mA depending on output power setting, temperature, and supply voltage. Variations arise from internal PA bias changes and external matching network imperfections. To stabilize performance, calibrate output power using built-in DAC-controlled PA settings and measure actual EIRP with an antenna analyzer. Implement closed-loop control via RSSI feedback if supported by firmware. Avoid overdriving the PA into saturation, which increases current draw and distorts modulation. Maintain clean supply rails and minimize trace inductance near RF paths to preserve linearity across all power levels.
How does the Moisture Sensitivity Level (MSL) of 2 for the EZR32LG230F256R67G-B0 influence manufacturing handling, and what precautions apply during reflow soldering?
With an MSL rating of 2, the EZR32LG230F256R67G-B0 must be stored in dry conditions and exposed to ambient humidity for no more than one year before assembly. After opening the moisture barrier pouch, it should be soldered within 168 hours or baked if delayed. Reflow profiles must adhere to JEDEC J-STD-020, with peak temperatures not exceeding 260°C for ≤30 seconds. Exceeding these limits risks delamination or popcorning, especially in the exposed pad design. Use nitrogen reflow when possible to reduce oxidation and improve solder joint quality.
Can the EZR32LG230F256R67G-B0 coexist with Wi-Fi signals in the 2.4GHz band, and what mitigation strategies exist?
Coexistence is challenging due to overlapping frequencies and adjacent channel interference. The EZR32LG230F256R67G-B0’s sensitivity of -133dBm allows operation in congested bands, but Wi-Fi bursts can desenseitize the receiver temporarily. Techniques include adaptive frequency hopping (if supported), antenna polarization separation, spatial filtering, and duty-cycling the radio during Wi-Fi activity. Implement CSMA/CA-like backoff algorithms in firmware to reduce collision probability. Alternatively, relocate the system to sub-GHz bands like 868MHz to avoid Wi-Fi entirely.
What impact does data rate selection have on link budget and range when using the EZR32LG230F256R67G-B0 in rural monitoring applications?
Higher data rates (e.g., 1Mbps) reduce airtime and improve battery life but decrease sensitivity due to narrower receiver bandwidth. At 1Mbps, the EZR32LG230F256R67G-B0 achieves -133dBm sensitivity, enabling ~1km range in open field under ideal conditions. Reducing data rate to 250kbps increases sensitivity to -136dBm, extending range to ~1.5km but doubling transmission time. Designers must model path loss using log-distance models and adjust coding schemes accordingly. Trade-offs between throughput, latency, and range dictate optimal configuration for each deployment scenario.
How does the ECCN classification (5A992C) affect export compliance for products incorporating the EZR32LG230F256R67G-B0?
ECCN 5A992C indicates the EZR32LG230F256R67G-B0 qualifies as a mass-market item of civil purpose technology, generally exempt from strict export controls under U.S. regulations. However, end-use restrictions apply if deployed in military, surveillance, or proliferation-sensitive contexts. Importers may still require licenses depending on destination country and final application. Manufacturers should document intended use and implement technical barriers (e.g., secure boot) to prevent unauthorized modification, aligning with Wassenaar Arrangement guidelines for embedded computing devices.
What are the implications of using the exposed pad on the 64-QFN package of the EZR32LG230F256R67G-B0 for thermal management and signal integrity?
The exposed pad on the EZR32LG230F256R67G-B0 serves as a thermal interface, improving heat dissipation from internal regulators and RF stages. It must be soldered directly to a solid ground plane on the PCB to maximize conduction cooling. Poor attachment creates thermal resistance, leading to junction temperature rise and potential performance drift. From a signal integrity perspective, the pad acts as a distributed ground return path, reducing loop inductance and stabilizing reference potentials for analog and digital circuits. Proper via stitching around the pad further enhances EMI shielding and minimizes ground bounce.
How does the choice of oscillator affect startup time and frequency accuracy in the EZR32LG230F256R67G-B0-based designs?
The EZR32LG230F256R67G-B0 relies on an external crystal for precise clocking, with startup times varying from milliseconds for TCXOs to tens of milliseconds for fundamental-mode crystals. High-stability oscillators (±20ppm or better) ensure accurate channel spacing and synchronization, critical for 802.15.4 networks. Faster startup enables quicker wake-from-sleep cycles, improving energy efficiency. However, ovenized or temperature-compensated crystals increase cost and power. Designers should match load capacitance (typically 12pF–18pF) and minimize trace length to the crystal pads to preserve frequency accuracy and reduce jitter in the PLL.
What considerations apply when cascading multiple EZR32LG230F256R67G-B0 nodes in a star topology versus mesh networking?
In a star topology, all nodes communicate directly with a central coordinator, minimizing routing complexity but increasing path loss for distant nodes. Each EZR32LG230F256R67G-B0 must maintain sufficient link margin, requiring careful antenna placement and power adjustment. In mesh topologies, intermediate nodes relay packets, extending coverage at the cost of increased latency and coordination overhead. The EZR32LG supports 802.15.4 MAC layer features needed for mesh, but firmware must implement neighbor discovery, route maintenance, and congestion avoidance. Star networks are simpler to debug; mesh networks offer redundancy but demand robust error handling.

Parts with Similar Specifications

The three parts on the right have similar specifications to Silicon Labs EZR32LG230F256R67G-B0

Product Attribute EZR32LG230F256R67G-B0R EZR32LG230F256R69G-B0R EZR32LG230F256R68G-B0R EZR32LG230F256R68G-B0
Part Number EZR32LG230F256R67G-B0R EZR32LG230F256R69G-B0R EZR32LG230F256R68G-B0R EZR32LG230F256R68G-B0
Manufacturer Silicon Labs Silicon Labs Silicon Labs Silicon Labs
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply - - - -
Memory Size - - - -
RF Family/Standard - - - -
Protocol - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Current - Transmitting - - - -
Series - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Current - Receiving - - - -
Modulation - - - -
Data Rate (Max) - - - -
Type - - - -
Frequency - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Sensitivity - - - -
Serial Interfaces - - - -
GPIO - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Power - Output - - - -

EZR32LG230F256R67G-B0 Datasheet PDF

Download EZR32LG230F256R67G-B0 pdf datasheets and Silicon Labs documentation for EZR32LG230F256R67G-B0 - Silicon Labs.

Datasheets
EZR32LG Ref Manual.pdf
Errata
EZR32LG Errata.pdf
HTML Datasheet
EZR32 Quick Start Guide.pdf EZR32LG Datashort.pdf EZR32LG230 Datasheet.pdf
PCN Part Status Change
2.73KHz.pdf
PCN Design/Specification
PCN-1506172 17/Jun/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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EZR32LG230F256R67G-B0 Image

EZR32LG230F256R67G-B0

Silicon Labs
32D-EZR32LG230F256R67G-B0

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