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HomeProductsCrystals, Oscillators, ResonatorsOscillatorsSG-8101CG 27.3067M-TBGPA0
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SG-8101CG 27.3067M-TBGPA0 - EPSON

Manufacturer Part Number
SG-8101CG 27.3067M-TBGPA0
Manufacturer
Epson
Allelco Part Number
98D-SG-8101CG 27.3067M-TBGPA0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
48,745 pcs available, New & Original
Parts Description
SG-8101CG 27.3067M-TBGPA0: OSC M
Package
4-SMD, No Lead
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 48745
  • Unit Price: $2.08
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.08 $2.08
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

SG-8101CG 27.3067M-TBGPA0 Tech Specifications
EPSON - SG-8101CG 27.3067M-TBGPA0 technical specifications, attributes, parameters and parts with similar specifications to EPSON - SG-8101CG 27.3067M-TBGPA0

Product Attribute Attribute Value
Manufacturer Epson
Voltage - Supply 1.8V ~ 3.3V
Type XO (Standard)
Spread Spectrum Bandwidth -
Size / Dimension 0.276" L x 0.197" W (7.00mm x 5.00mm)
Series SG-8101
Ratings -
Package / Case 4-SMD, No Lead
Package Tape & Reel (TR)
Output CMOS
Operating Temperature -40°C ~ 85°C
Product Attribute Attribute Value
Mounting Type Surface Mount
Height - Seated (Max) 0.055" (1.40mm)
Function Enable/Disable
Frequency Stability ±15ppm
Frequency 27.3067 MHz
Current - Supply (Max) 6.8mA (Typ)
Current - Supply (Disable) (Max) 3.5mA
Base Resonator Crystal
Base Product Number SG-8101
Absolute Pull Range (APR) -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.60.0080

Frequently Asked Questions(FAQ)

What is the typical supply current consumption of the SG-8101CG 27.3067M-TBGPA0 when operating in active mode, and how does this impact power-sensitive embedded designs?
The SG-8101CG 27.3067M-TBGPA0 consumes a maximum of 6.8 mA under typical operating conditions at its nominal supply voltage within the 1.8V to 3.3V range. This level of current draw is moderate for a CMOS output oscillator at 27.3067 MHz and may be acceptable in low-power systems that can tolerate slightly higher quiescent current. Designers should consider duty cycling or enabling features like shutdown mode during idle periods to minimize overall energy consumption in battery-powered applications.
How does the frequency stability of ±15 ppm across temperature affect system timing accuracy for the SG-8101CG 27.3067M-TBGPA0 in industrial control environments?
Over the full operating temperature range from -40°C to 85°C, the SG-8101CG 27.3067M-TBGPA0 maintains a frequency stability of ±15 ppm, resulting in a maximum drift of approximately ±4.1 MHz peak-to-peak from the nominal 27.3067 MHz center frequency. In precision timing applications such as motor control or data acquisition systems, this level of variation could introduce phase errors or timing skews if not compensated. Engineers should assess whether additional calibration, external synchronization, or tighter thermal management is required to meet subsystem timing budgets.
Can the enable/disable function of the SG-8101CG 27.3067M-TBGPA0 be used to reduce standby power without introducing significant startup delay?
Yes, the SG-8101CG 27.3067M-TBGPA0 supports an enable/disable pin that allows the oscillator to be shut down, reducing supply current from up to 6.8 mA (active) to a maximum of 3.5 mA (disabled). While this reduces dynamic power, the device still draws some leakage current even when disabled. Additionally, reactivation requires a stabilization period typical for CMOS oscillators, which may add several milliseconds before stable output is achieved—important to model in low-jitter or real-time systems where wake-up latency matters.
How does the physical size and mounting style of the SG-8101CG 27.3067M-TBGPA0 influence PCB layout decisions compared to larger packaged oscillators?
With dimensions of 2.50 mm x 2.00 mm and a surface-mount, leadless package, the SG-8101CG 27.3067M-TBGPA0 occupies minimal board space, making it suitable for compact form-factor designs such as IoT nodes or wearable devices. However, its small size increases sensitivity to trace impedance, ground plane proximity, and mechanical stress during assembly. Layout engineers must ensure adequate decoupling capacitance close to the VDD pin and maintain consistent reference planes to preserve frequency stability and EMI performance.
In what scenarios would the SG-8101CG 27.3067M-TBGPA0 be preferred over a TCXO with superior temperature compensation?
The SG-8101CG 27.3067M-TBGPA0 offers a cost-effective solution for applications where extreme temperature precision (±15 ppm) is sufficient and environmental variations are mild. It may be chosen over a TCXO when power budget, board area, or BOM cost constraints outweigh the need for tighter stability. For example, consumer electronics with passive thermal regulation or non-critical timing roles like UART baud rate generation might justify using the SG-8101CG 27.3067M-TBGPA0 instead of a higher-performance alternative.
What considerations apply when selecting bypass capacitors for the SG-8101CG 27.3067M-TBGPA0 to ensure reliable operation near its voltage limits?
Given the SG-8101CG 27.3067M-TBGPA0 operates across 1.8V to 3.3V, designers should use a 0.1 µF ceramic capacitor placed as close as possible to the VDD and GND pins to filter high-frequency noise and stabilize the supply. At lower voltages like 1.8V, transient dips due to switching loads can more easily disrupt oscillator operation. A low-ESR capacitor rated for the system voltage and capable of handling ripple currents is essential to prevent spurious frequency shifts or unlocking events.
How does the Moisture Sensitivity Level (MSL) rating of 1 for the SG-8101CG 27.3067M-TBGPA0 simplify manufacturing flow compared to higher MSL components?
Classified as MSL 1, the SG-8101CG 27.3067M-TBGPA0 has unlimited shelf life and no special dry-packing requirements prior to reflow soldering. This eliminates the need for baking before use or humidity monitoring during storage, streamlining procurement logistics and reducing handling steps in high-volume production. Manufacturers can process it immediately upon opening the tape-and-reel packaging without risk of moisture-induced defects during assembly.
Why might the SG-8101CG 27.3067M-TBGPA0 be selected despite not featuring spread spectrum modulation?
The absence of spread spectrum bandwidth specification indicates the SG-8101CG 27.3067M-TBGPA0 lacks intentional clock modulation to reduce electromagnetic interference (EMI). As a result, it may generate stronger narrowband emissions at 27.3067 MHz, requiring careful PCB routing and filtering in sensitive RF environments. However, in systems without strict EMI regulations or co-located radios, the simplicity and cost savings of this design make it attractive for general-purpose timing needs where spectral purity is less critical than footprint and power efficiency.
How does the base product number SG-8101 relate to the specific variant SG-8101CG 27.3067M-TBGPA0, and what implications exist for future part selection?
The SG-8101CG 27.3067M-TBGPA0 belongs to the SG-8101 series, indicating shared core architecture, pin compatibility, and similar electrical characteristics across variants. This allows designers to standardize oscillator types on a board while accommodating different frequencies. When evaluating alternatives, maintaining series alignment ensures drop-in replacement feasibility during design changes or obsolescence planning, though frequency-specific tuning and minor parameter deviations must still be verified against updated datasheets.
What role does the crystal-based resonator play in determining the long-term reliability of the SG-8101CG 27.3067M-TBGPA0 in continuous-operation systems?
As a crystal-based XO, the SG-8101CG 27.3067M-TBGPA0 relies on mechanical resonance of a quartz crystal for frequency generation, which contributes to long-term stability and low aging rates compared to RC or SAW alternatives. Under steady load and controlled temperature, crystals exhibit minimal drift over years of operation. This makes the SG-8101CG 27.3067M-TBGPA0 suitable for applications requiring sustained accuracy without periodic recalibration, provided environmental stresses remain within specified limits.
How does the enable/disable functionality interact with power sequencing in microcontroller-based systems using the SG-8101CG 27.3067M-TBGPA0?
The enable pin of the SG-8101CG 27.3067M-TBGPA0 allows software-controlled start/stop of oscillation, but improper sequencing—such as enabling the oscillator after core logic—can cause glitches or reset anomalies. Conversely, disabling the oscillator before core shutdown may save power but risks losing timing reference prematurely. Designers should synchronize enable signals with CPU initialization code and avoid rapid toggling, which can lead to unstable startup transients and increased disable-state leakage current.
What are the implications of the RoHS3 compliance status for the SG-8101CG 27.3067M-TBGPA0 in global regulatory submissions?
RoHS3 compliance confirms the SG-8101CG 27.3067M-TBGPA0 meets European Union restrictions on hazardous substances including lead, mercury, cadmium, and certain phthalates. This simplifies export documentation and supports market access across EEA countries. Since the component contains no restricted materials above threshold levels, manufacturers do not require additional certification beyond standard declaration of conformity, accelerating time-to-market for new products targeting regulated industries.
How does the choice between 1.8V and 3.3V operation affect interfacing the SG-8101CG 27.3067M-TBGPA0 with legacy digital peripherals?
The SG-8101CG 27.3067M-TBGPA0 supports both 1.8V and 3.3V supplies, offering flexibility across mixed-voltage systems. Operating at 3.3V improves noise margin and drive strength for CMOS outputs, benefiting communication lines over longer traces. However, interfacing with older 5V logic requires level-shifting circuitry unless the receiving device tolerates 3.3V inputs directly. Designers must verify input thresholds of downstream components to avoid undefined states or signal degradation when bridging voltage domains.
What precautions should be taken during reflow soldering to avoid damaging the SG-8101CG 27.3067M-TBGPA0 due to thermal stress?
Although rated for industrial temperatures up to 85°C, the SG-8101CG 27.3067M-TBGPA0 is subject to internal crystal stress during rapid heating. Standard lead-free reflow profiles with peak temperatures around 245°C and dwell times under 30 seconds are generally safe, but localized hot spots or excessive soak time can degrade performance. Using proper solder paste, minimizing pad exposure, and ensuring even thermal distribution help preserve frequency accuracy post-assembly.
How does the lack of explicit Absolute Pull Range (APR) data for the SG-8101CG 27.3067M-TBGPA0 influence tuning or customization efforts in custom oscillator development?
The absence of APR specifications means the SG-8101CG 27.3067M-TBGPA0 likely uses a fixed-load oscillator topology optimized for standard 12pF loads, limiting fine-tuning capability through external capacitors. Unlike VCXOs or digitally tunable designs, this device offers little adjustment latitude for frequency trimming. Therefore, precise matching to target applications demands careful selection of load capacitance on the PCB to align with the internal design assumptions embedded in the crystal-cut and package parasitics.
In what ways does the 4-SMD, no-lead package of the SG-8101CG 27.3067M-TBGPA0 support automated assembly processes?
The small outline, leadless configuration enables high-speed pick-and-place machine handling and consistent solder joint formation during reflow. Compatibility with tape-and-reel packaging further integrates the SG-8101CG 27.3067M-TBGPA0 into automated SMT workflows, reducing manual labor and improving placement accuracy. Its compact footprint also facilitates dense routing in multilayer PCBs, supporting miniaturized system designs common in modern embedded platforms.

Parts with Similar Specifications

The three parts on the right have similar specifications to EPSON SG-8101CG 27.3067M-TBGPA0

Product Attribute SG-8101CG 27.3067M-TBGSA0 SG-8101CG 27.3067M-TCHPA0 SG-8101CG 27.3000M-TBGPA0 SG-8101CG 27.3972M-TBGPA0
Part Number SG-8101CG 27.3067M-TBGSA0 SG-8101CG 27.3067M-TCHPA0 SG-8101CG 27.3000M-TBGPA0 SG-8101CG 27.3972M-TBGPA0
Manufacturer EPSON EPSON EPSON EPSON
Ratings - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Frequency - - - -
Current - Supply (Disable) (Max) - - - -
Base Resonator - - - -
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Function - - - -
Size / Dimension - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Spread Spectrum Bandwidth - - - -
Frequency Stability - - - -
Output - - - -
Absolute Pull Range (APR) - - - -
Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Height - Seated (Max) - - - -
Current - Supply (Max) - - - -

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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EPSON

SG-8101CG 27.3067M-TBGPA0

EPSON
98D-SG-8101CG 27.3067M-TBGPA0

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