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HomeProductsIntegrated Circuits (ICs)Interface - Drivers, Receivers, TransceiversFIN1027AM
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FIN1027AM - Fairchild Semiconductor

Manufacturer Part Number
FIN1027AM
Manufacturer
Fairchild (onsemi)
Allelco Part Number
98D-FIN1027AM
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
33,585 pcs available, New & Original
Parts Description
IC DRIVER 2/0 8SOIC
Package
8-SOIC
Data sheet
-
RoHs Status
ROHS3 Compliant
Our certification
In stock: 33585
  • Unit Price: $0.71
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.71 $0.71
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

FIN1027AM Tech Specifications
Fairchild Semiconductor - FIN1027AM technical specifications, attributes, parameters and parts with similar specifications to Fairchild Semiconductor - FIN1027AM

Product Attribute Attribute Value
Manufacturer Fairchild (onsemi)
Voltage - Supply 3V ~ 3.6V
Type Driver
Supplier Device Package 8-SOIC
Series -
Protocol LVDS
Package / Case 8-SOIC (0.154", 3.90mm Width)
Product Attribute Attribute Value
Package Tube
Operating Temperature -40°C ~ 85°C
Number of Drivers/Receivers 2/0
Mounting Type Surface Mount
Duplex -
Data Rate 600Mbps

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What are the key electrical specifications of the FIN1027AM driver for LVDS signaling, and how do they influence high-speed interface design choices?
The FIN1027AM supports a data rate of up to 600 Mbps per channel, which is suitable for mid-bandwidth serial links in embedded systems. It operates within a supply voltage range of 3 V to 3.6 V, making it compatible with low-voltage digital logic environments. These parameters suggest that designs using this device must ensure stable power delivery and signal integrity at frequencies approaching 300 MHz (for a two-channel system), requiring careful attention to trace length matching and termination strategies.
How does the FIN1027AM compare to the DS90LV027ATM/NOPB substitute in terms of performance and application suitability?
While both the FIN1027AM and DS90LV027ATM/NOPB serve as dual-channel LVDS drivers, the FIN1027AM is manufactured by onsemi and offers a slightly wider operating temperature range (-40°C to +85°C), which enhances reliability in industrial or extended-environment applications. The DS90LV027ATM/NOPB may have different packaging or availability characteristics, but the core functionality overlaps significantly. Designers should evaluate supply chain stability and long-term support when substituting between these parts.
What layout considerations are critical when integrating the FIN1027AM into a printed circuit board for optimal signal integrity?
Due to its 600 Mbps data rate, the FIN1027AM requires controlled impedance routing, typically 100 Ω differential pairs, with minimal skew between channels. The 8-SOIC package introduces lead inductance and parasitic capacitance that can affect rise/fall times; therefore, short, direct traces and proper ground return paths are essential. Decoupling capacitors near the supply pins should be placed within 5 mm to minimize loop inductance and suppress high-frequency noise.
Can the FIN1027AM be used in automotive applications given its operating temperature range and packaging type?
The FIN1027AM operates from -40°C to +85°C, which exceeds standard commercial-grade requirements but falls short of most automotive AEC-Q100 qualifications. While it may function reliably in non-automotive harsh environments, it is not certified for automotive use. Engineers seeking automotive compliance should verify functional safety standards and consider alternative devices with appropriate certifications.
What impact does the FIN1027AM’s 3.3 V nominal supply voltage have on interfacing with legacy 5 V CMOS logic?
The FIN1027AM uses a 3.3 V supply and likely has input thresholds compatible with 3.3 V logic, but it is not guaranteed to tolerate 5 V input levels. Direct connection to 5 V CMOS outputs could exceed absolute maximum ratings and cause damage. Level-shifting circuitry or a 3.3 V-powered system must be implemented before using this device, especially if interfacing with older digital subsystems.
How many differential output pairs does the FIN1027AM provide, and what implications does this have for parallel data transmission?
The FIN1027AM includes two independent LVDS driver channels, providing two differential output pairs. This enables simultaneous transmission of up to two full-duplex streams or one bidirectional stream with separate transmit and receive lines. In system design, this allows efficient use of PCB space and reduces the number of required connectors compared to single-channel solutions, though bandwidth is shared across channels.
Is the FIN1027AM suitable for point-to-point versus multi-drop LVDS topologies?
The FIN1027AM is optimized for point-to-point LVDS connections due to its high data rate and lack of built-in receiver functionality. Multi-drop configurations require receivers at each node and careful impedance management to avoid reflections; however, the absence of integrated termination means external resistors must be added manually, increasing design complexity. Thus, point-to-point signaling aligns better with this component’s capabilities.
What role does the Moisture Sensitivity Level (MSL) 1 classification play in the manufacturing and handling of the FIN1027AM?
With an MSL rating of 1, the FIN1027AM is not sensitive to moisture absorption during normal storage and handling. This allows unlimited floor life without dry storage or baking prior to assembly, simplifying production workflows and reducing costs associated with humidity-controlled environments. It also facilitates just-in-time inventory practices common in modern electronics manufacturing.
How does the FIN1027AM’s base product number (FIN1027) relate to other variants in the series, and what benefits might a designer gain from exploring related models?
The FIN1027AM shares a base product number with other FIN1027 family members, suggesting potential differences in packaging, speed grade, or pinout while maintaining core functionality. Exploring these variants can offer flexibility in thermal performance, footprint size, or availability. However, since no detailed variant list is provided, engineers should consult onsemi documentation to confirm compatibility before migration.
What are the typical applications where the FIN1027AM would outperform discrete LVDS driver implementations?
Integrated solutions like the FIN1027AM reduce board space and component count compared to discrete transistor-based LVDS drivers. Its monolithic design ensures matched propagation delays and consistent output impedance, improving signal integrity in applications such as camera serial links, display interfaces, and industrial sensor networks. At 600 Mbps, it strikes a balance between cost and performance that makes it attractive over custom analog designs.
Does the FIN1027AM support hot-plugging or fault tolerance in LVDS backplane environments?
Standard LVDS drivers like the FIN1027AM do not include hot-plug protection or fault detection features. Connecting the device while powered could result in excessive current flow or damage due to ESD events or mismatched voltages. In systems requiring hot insertion capability, additional protection circuits—such as TVS diodes or isolation buffers—must be incorporated externally.
How does the FIN1027AM handle electromagnetic interference (EMI) in high-speed serial links?
As an LVDS driver, the FIN1027AM inherently generates lower EMI than single-ended signaling due to differential mode operation and reduced common-mode radiation. However, at 600 Mbps edge rates, radiated emissions can still exceed regulatory limits without proper layout. Use of ground planes, shielding, and minimized loop areas in the PCB are necessary to meet CISPR or FCC requirements in end equipment.
What testing methodology is recommended to validate FIN1027AM performance in a prototype environment?
Functional testing should include eye diagram analysis at 300–600 Mbps to assess jitter, noise margin, and signal quality. Bit error rate (BER) measurements under varying cable lengths and temperatures provide insight into real-world robustness. Additionally, power supply ripple injection tests help identify sensitivity to voltage fluctuations, ensuring reliable operation across all expected operating conditions.
Can the FIN1027AM be cascaded with other LVDS transceivers to extend reach or increase throughput?
Cascading is possible if downstream devices include LVDS receivers capable of accepting the FIN1027AM’s output levels. However, cumulative jitter, attenuation over distance, and timing skew degrade link margins. For longer reaches, repeaters or equalization may be needed. Increasing throughput beyond two channels typically requires multiple FIN1027AM instances or higher-speed alternatives, as the device itself does not scale internally.
What documentation and compliance information is available for the FIN1027AM to support regulatory submissions?
The FIN1027AM carries ECCN EAR99 and HTSUS 8542.39.0001 classifications, indicating it is subject to U.S. export controls but generally unrestricted under trade regulations. REACH status confirms it contains no restricted substances. Designers should retain onsemi datasheets, application notes, and test reports for certification dossiers, particularly in medical or telecom equipment requiring formal validation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Fairchild Semiconductor FIN1027AM

Product Attribute FIN1027AMX FIN1027AM FIN1027MX FIN1027MX
Part Number FIN1027AMX FIN1027AM FIN1027MX FIN1027MX
Manufacturer onsemi onsemi Fairchild Semiconductor onsemi
Number of Drivers/Receivers - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Duplex - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Data Rate - - - -
Series - - - -
Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Protocol - - - -

Customer Reviews

Evaluation: 10 Articles

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
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FIN1027AM Image

FIN1027AM

Fairchild Semiconductor
98D-FIN1027AM

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