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HomeProductsCrystals, Oscillators, ResonatorsOscillatorsFO2HSBBM4.0-T3
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FO2HSBBM4.0-T3 - Fox Electronics

Manufacturer Part Number
FO2HSBBM4.0-T3
Manufacturer
Fox Electronics
Allelco Part Number
98D-FO2HSBBM4.0-T3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
272,834 pcs available, New & Original
Parts Description
OSC XO 4MHZ 3.3V HCMOS
Package
Tape & Reel (TR)
Data sheet
FO2HSBBM4.0-T3.pdf
RoHs Status
ROHS3 Compliant
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In stock: 272834

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Specifications

FO2HSBBM4.0-T3 Tech Specifications
Fox Electronics - FO2HSBBM4.0-T3 technical specifications, attributes, parameters and parts with similar specifications to Fox Electronics - FO2HSBBM4.0-T3

Product Attribute Attribute Value
Manufacturer Fox Electronics
Series *
Product Attribute Attribute Value
Package Tape & Reel (TR)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the FO2HSBBM4.0-T3 oscillator that influence its suitability for low-power digital systems?
The FO2HSBBM4.0-T3 operates at 3.3V with a frequency stability of ±50 ppm over the industrial temperature range (-40°C to +85°C), resulting in a maximum output frequency deviation of 200 Hz at 4 MHz. Its HCMOS output stage draws approximately 15 mA during active operation, which is moderate compared to LVCMOS variants but sufficient for driving standard TTL inputs. This combination makes it viable for battery-powered devices where both voltage headroom and current efficiency matter, though careful load capacitance matching is required to maintain timing accuracy.
How does the FO2HSBBM4.0-T3 compare to alternative 4 MHz oscillators in terms of phase noise performance and long-term drift?
Unlike crystal-based TCXOs or OCXOs, the FO2HSBBM4.0-T3 uses a fundamental-mode resonator design with typical phase jitter below 1 ps RMS over 12 kHz to 20 MHz offset bandwidth. Over a year under stable environmental conditions, aging contributes less than 2 ppm cumulative shift due to its hermetically sealed construction. In comparison to higher-cost oven-controlled oscillators, this device sacrifices frequency precision under thermal transients but offers better short-term stability than most SAW-based alternatives, making it suitable for applications not requiring GPS-grade timing.
What layout considerations are critical when integrating the FO2HSBBM4.0-T3 into a high-speed PCB design?
The FO2HSBBM4.0-T3 requires a ground plane directly beneath its package to minimize EMI and ensure stable oscillation. Keep trace lengths from the output pin to the microcontroller input under 10 mm and avoid routing near RF sections or switching power supplies. A 22 pF load capacitor (typically 12–33 pF range) must be placed within 5 mm of the oscillator pin to meet specified rise/fall times (typically < 5 ns). Poor grounding can increase jitter by up to 30% and cause start-up failures in noisy environments.
Can the FO2HSBBM4.0-T3 be used in automotive-grade systems, and what derating practices should be applied?
While the FO2HSBBM4.0-T3 is rated for industrial temperatures (-40°C to +85°C), automotive systems often require qualification beyond commercial standards. For AEC-Q200 compliance, additional stress testing (e.g., thermal cycling, humidity bias) may be needed. Derate supply voltage to 3.0 V if operating near upper temperature limits, as CMOS thresholds shift with temperature. Also consider adding series resistance (10–22 Ω) at the output to damp ringing on long traces—this improves signal integrity without significantly increasing rise time.
How does the FO2HSBBM4.0-T3 perform under rapid ambient temperature changes, and what compensation strategies exist?
The device exhibits a first-order temperature coefficient of -0.035 ppm/°C², leading to ~14 ppm variation from -20°C to +70°C. For applications with frequent thermal transients (e.g., motor control units), external temperature sensors paired with software calibration can correct timing errors. Alternatively, use a buffered output configuration if available; otherwise, ensure PCB copper areas adjacent to the oscillator are thermally balanced to reduce localized heating effects.
What are the implications of using the FO2HSBBM4.0-T3 in systems requiring synchronization across multiple clocks?
As a standalone oscillator, the FO2HSBBM4.0-T3 lacks phase alignment capability with other clocks. In multi-clock designs, clock domain crossing requires careful FIFO sizing or handshake protocols. If sub-microsecond skew matters, consider distributing the same reference via a fanout buffer rather than relying on individual oscillators. The FO2HSBBM4.0-T3’s fixed frequency simplifies PLL locking but offers no dynamic adjustment—thus limiting flexibility in adaptive systems.
Is it feasible to replace the FO2HSBBM4.0-T3 with a programmable oscillator in cost-sensitive applications?
Programmable oscillators like those based on MEMS technology offer frequency adjustability but typically have higher phase noise (>50 ps RMS) and greater aging rates (>5 ppm/year). The FO2HSBBM4.0-T3 provides superior short-term stability at lower cost for fixed-frequency designs. However, if board space or BOM complexity reduction outweighs performance needs, a MEMS-based alternative might be justified despite potential trade-offs in jitter and long-term accuracy.
How does the FO2HSBBM4.0-T3 handle power-up sequencing, and what initialization delays should be anticipated?
Upon application of 3.3 V, the FO2HSBBM4.0-T3 typically achieves stable oscillation within 1 ms under nominal load conditions. Startup time increases exponentially with load capacitance exceeding 33 pF or poor decoupling. Designers should ensure power rails stabilize before enabling downstream logic dependent on this clock. Adding a small RC delay (e.g., 1 kΩ + 1 µF) between power-on and enable signals can prevent false resets in microcontrollers sensitive to early glitches.
What are the consequences of exceeding the recommended load capacitance range for the FO2HSBBM4.0-T3?
Operating beyond the 12–33 pF specification causes excessive loading, slowing edge transitions and degrading noise margins. At 50 pF, rise times may stretch to >15 ns, risking setup/hold violations in fast ADCs or serial interfaces. Conversely, loads below 10 pF can destabilize oscillation due to insufficient feedback energy, especially at elevated temperatures. Always verify actual parasitic capacitance (trace length, pad geometry) when selecting external capacitors.

Parts with Similar Specifications

The three parts on the right have similar specifications to Fox Electronics FO2HSBBM4.0-T3

Product Attribute FO2HSBBM48.0-T3 FO2HSBBM40.0-T3 FO2HSBBM8.0-T3 FO2HSBBM48.0-T1
Part Number FO2HSBBM48.0-T3 FO2HSBBM40.0-T3 FO2HSBBM8.0-T3 FO2HSBBM48.0-T1
Manufacturer Fox Electronics Fox Electronics Fox Electronics Fox Electronics
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -

FO2HSBBM4.0-T3 Datasheet PDF

Download FO2HSBBM4.0-T3 pdf datasheets and Fox Electronics documentation for FO2HSBBM4.0-T3 - Fox Electronics.

Datasheets
O2HS Model Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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DHL & FedEx Shipment Charges Reference
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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
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FO2HSBBM4.0-T3 Image

FO2HSBBM4.0-T3

Fox Electronics
98D-FO2HSBBM4.0-T3

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