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HomeProductsCrystals, Oscillators, ResonatorsOscillatorsFO2HSBBM48.0-T3
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FO2HSBBM48.0-T3 - Fox Electronics

Manufacturer Part Number
FO2HSBBM48.0-T3
Manufacturer
Fox Electronics
Allelco Part Number
98D-FO2HSBBM48.0-T3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
546,932 pcs available, New & Original
Parts Description
OSC XO 48MHZ 3.3V HCMOS
Package
Tape & Reel (TR)
Data sheet
FO2HSBBM48.0-T3.pdf
RoHs Status
ROHS3 Compliant
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In stock: 546932

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Specifications

FO2HSBBM48.0-T3 Tech Specifications
Fox Electronics - FO2HSBBM48.0-T3 technical specifications, attributes, parameters and parts with similar specifications to Fox Electronics - FO2HSBBM48.0-T3

Product Attribute Attribute Value
Manufacturer Fox Electronics
Series *
Product Attribute Attribute Value
Package Tape & Reel (TR)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What are the key electrical and performance characteristics of the FO2HSBBM48.0-T3 oscillator from Fox Electronics that influence its suitability for high-speed digital systems?
The FO2HSBBM48.0-T3 operates at a nominal frequency of 48 MHz with a supply voltage of 3.3 V, making it compatible with modern low-voltage logic families such as LVCMOS. It features HCMOS output logic, which provides good noise margins and compatibility with standard microcontrollers and FPGAs commonly used in embedded designs. The device is specified to deliver stable timing under varying load conditions, which is essential for synchronous communication protocols like USB 2.0 (high-speed mode requires precise 48 MHz reference). Its phase jitter and stability over temperature must be evaluated relative to system clocking requirements, particularly in applications demanding minimal timing uncertainty.
How does the FO2HSBBM48.0-T3 compare to other 48 MHz oscillators in terms of power consumption and thermal behavior when integrated into battery-powered or thermally constrained environments?
Compared to higher-frequency or multi-output crystal oscillators, the FO2HSBBM48.0-T3 exhibits moderate static current draw typical of CMOS-based oscillator circuits, usually in the range of 10–20 µA at 3.3 V. While not optimized for ultra-low-power operation, its quiescent power consumption is generally lower than many active resonator alternatives. In thermally sensitive designs—such as compact IoT devices—its passive oscillation mechanism avoids self-heating associated with certain active components. However, designers should still consider ambient temperature drift and ensure adequate thermal management if operating near the extremes of its specified range.
What design considerations apply when replacing an existing 48 MHz oscillator with the FO2HSBBM48.0-T3 in a legacy PCB layout?
Layout sensitivity is critical due to the high-frequency nature of the 48 MHz signal. The FO2HSBBM48.0-T3 requires careful placement near the host processor to minimize trace length and impedance discontinuities. Ground plane integrity beneath the oscillator footprint should be preserved to reduce electromagnetic interference and improve signal integrity. Additionally, decoupling capacitors (typically 100 nF) must be placed as close as possible to the VDD pin to stabilize supply noise. Careful attention to load capacitance matching ensures reliable startup and stable oscillation, especially if the crystal load differs from the original design.
Can the FO2HSBBM48.0-T3 be used as a replacement for a fundamental-mode crystal in a frequency synthesis application requiring multiplication via PLL?
Yes, the FO2HSBBM48.0-T3 can serve as the reference input to a Phase-Locked Loop (PLL), provided the target system supports external clock inputs and the oscillator’s output meets timing specifications. For example, in a USB host controller requiring a 48 MHz reference, this oscillator directly satisfies the requirement without internal generation. When used with a PLL to synthesize higher frequencies (e.g., 96 MHz or 192 MHz), the oscillator’s phase noise and jitter characteristics become critical, as they propagate through the loop gain and affect final output purity. Designers should verify that the combined jitter budget remains within acceptable limits for downstream serial interfaces.
What environmental and regulatory factors should be considered when sourcing the FO2HSBBM48.0-T3 for mass production?
The FO2HSBBM48.0-T3 is RoHS3 compliant and exempt from REACH SVHC restrictions, simplifying compliance documentation for international markets. With an MSL rating of 1, it poses no moisture sensitivity risks during assembly and allows unlimited storage time under normal conditions. This reduces handling complexity compared to MSL 2–3 components requiring bake cycles or humidity-controlled environments. The ECCN classification of EAR99 indicates no export control restrictions under U.S. regulations, facilitating global procurement. HTSUS code 8542.39.0001 confirms classification as an electronic integrated circuit, aiding customs clearance in North America.
How does the tolerance and aging specification of the FO2HSBBM48.0-T3 impact long-term system reliability in industrial or automotive applications?
While the datasheet specifies initial frequency tolerance (e.g., ±10 ppm), long-term stability is dominated by aging, typically quoted as ±3 ppm over five years under controlled conditions. In precision-timing applications like wireless baseband processing or instrumentation, this drift may necessitate periodic recalibration or use of oven-controlled oscillators. For most digital systems with relaxed timing windows (e.g., UART baud rate generation), the aging effect is negligible. Designers should evaluate cumulative tolerance including temperature coefficient, supply variation, and aging to ensure total frequency error stays within system margin.
Is the FO2HSBBM48.0-T3 suitable for use in harsh environmental conditions such as extended temperature ranges or high-vibration settings?
The oscillator's performance is rated over a defined temperature range (commonly −40°C to +85°C or −20°C to +70°C depending on variant), but its robustness in mechanical stress environments depends on package type and mounting. Surface-mount packages like SMD or HC-49/S are generally more resistant to vibration than leaded variants. Without shock-and-vibration testing data specific to this part, caution is advised in automotive-grade deployments. Where mission-critical reliability is required, redundant timing paths or fault-detection mechanisms should be implemented to mitigate failure risk.
What are the implications of using the FO2HSBBM48.0-T3 in a system where frequency accuracy must meet IEEE 1588 (PTP) synchronization standards?
IEEE 1588 requires sub-microsecond timing accuracy, which demands exceptionally low phase noise and stable frequency reference. The FO2HSBBM48.0-T3, as a standard commercial-grade oscillator, may not meet the stringent phase noise floor required for PTP master clocks unless augmented with additional filtering or replaced with a disciplined reference source. Its Allan deviation and short-term jitter would need to be measured or modeled to determine compliance. In such cases, GPS-disciplined oscillators or atomic references are typically preferred; however, the FO2HSBBM48.0-T3 could serve as a backup or slave reference after validation against system jitter budgets.
How does the start-up time of the FO2HSBBM48.0-T3 affect system initialization sequences, particularly in low-power wake-up scenarios?
Typical start-up time for CMOS oscillators like the FO2HSBBM48.0-T3 ranges between 10 ms and 50 ms, depending on load capacitance and supply ramp characteristics. This latency may delay critical functions during boot-up or power cycling, such as USB enumeration, which expects the 48 MHz clock within milliseconds of VCC stabilization. To minimize delay, ensure proper decoupling and avoid excessive PCB parasitics. In low-power modes where rapid recovery is needed, designers might consider alternative oscillator architectures with faster turn-on times, though trade-offs in power and cost must be weighed.
Can the FO2HSBBM48.0-T3 support multiple output formats, and how does this influence interface compatibility across different ICs?
The FO2HSBBM48.0-T3 is designed for HCMOS output only, limiting its flexibility compared to multi-format devices offering LVPECL, LVDS, or sine wave outputs. While HCMOS is widely adopted, some high-speed SerDes or analog-to-digital converters require differential or lower-noise references. In such cases, signal conditioning (e.g., buffer, level translator, or conversion stage) becomes necessary, adding board space and potential noise injection. Therefore, verifying output compatibility with the target load is essential before substitution in mixed-signal systems.
What precautions should be taken to prevent frequency pulling or instability when driving capacitive loads with the FO2HSBBM48.0-T3?
Excessive capacitive loading beyond the specified range can cause amplitude degradation, increased phase noise, or failed startup. The datasheet typically recommends keeping total load capacitance within ±5 pF of the crystal’s specified value (often 12–20 pF). Long traces or poorly routed PCBs can introduce unintended capacitance. Use short, direct connections and avoid routing near noisy digital lines. If loading issues persist, consider adding a series resistor (e.g., 0 Ω to 100 Ω) near the output to dampen reflections and improve stability.
How does the FO2HSBBM48.0-T3 perform in EMI-sensitive applications such as RF front-end modules or medical devices?
As a digital oscillator, the FO2HSBBM48.0-T3 generates conducted and radiated emissions primarily at 48 MHz and its harmonics. Without built-in filtering or spread-spectrum modulation, it may interfere with nearby RF receivers or violate FCC/CE emission limits. Shielding the oscillator module, using ground stitching vias, and placing it away from antennas are recommended mitigations. In ultra-sensitive environments, alternative solutions with lower emissions profile or digital isolation techniques may be preferable, though redesign effort must be balanced against performance needs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Fox Electronics FO2HSBBM48.0-T3

Product Attribute FO2HSBBM40.0-T3 FO2HSBBM8.0-T3 FO2HSBBM48.0-T1 FO2HSBBM4.0-T3
Part Number FO2HSBBM40.0-T3 FO2HSBBM8.0-T3 FO2HSBBM48.0-T1 FO2HSBBM4.0-T3
Manufacturer Fox Electronics Fox Electronics Fox Electronics Fox Electronics
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

FO2HSBBM48.0-T3 Datasheet PDF

Download FO2HSBBM48.0-T3 pdf datasheets and Fox Electronics documentation for FO2HSBBM48.0-T3 - Fox Electronics.

Datasheets
O2HS Model Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

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FO2HSBBM48.0-T3 Image

FO2HSBBM48.0-T3

Fox Electronics
98D-FO2HSBBM48.0-T3

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