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HomeProductsCrystals, Oscillators, ResonatorsOscillatorsFO2HSBBP25.0-T3
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FO2HSBBP25.0-T3 - Fox Electronics

Manufacturer Part Number
FO2HSBBP25.0-T3
Manufacturer
Fox Electronics
Allelco Part Number
98D-FO2HSBBP25.0-T3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
117,258 pcs available, New & Original
Parts Description
OSC XO 25MHZ 3.3V HCMOS
Package
Tape & Reel (TR)
Data sheet
FO2HSBBP25.0-T3.pdf
RoHs Status
ROHS3 Compliant
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In stock: 117258

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Specifications

FO2HSBBP25.0-T3 Tech Specifications
Fox Electronics - FO2HSBBP25.0-T3 technical specifications, attributes, parameters and parts with similar specifications to Fox Electronics - FO2HSBBP25.0-T3

Product Attribute Attribute Value
Manufacturer Fox Electronics
Series *
Product Attribute Attribute Value
Package Tape & Reel (TR)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

What is the typical load capacitance requirement for the FO2HSBBP25.0-T3 oscillator when driving a standard CMOS logic gate, and how does this affect PCB layout?
The FO2HSBBP25.0-T3 operates with a nominal 3.3V supply and delivers a 25 MHz output using HCMOS technology, which typically requires a load capacitance of 15–22 pF to maintain stable oscillation. This value must be matched with external capacitors connected to the output pin relative to ground, depending on the driven load’s input capacitance. Mismatched or poorly selected load capacitors can lead to frequency drift, increased phase noise, or startup failure. Therefore, careful consideration of trace parasitics and component placement is essential to achieve reliable operation in high-speed digital systems.
How does the FO2HSBBP25.0-T3 compare to a crystal-based timing solution in terms of long-term stability and environmental sensitivity for industrial applications?
Unlike crystals, which are susceptible to mechanical stress and exhibit higher frequency variation over temperature and aging, the FO2HSBBP25.0-T3 integrates a precision-crystal resonator within its feedback network, achieving ±20 ppm stability across −40°C to +85°C. This makes it significantly more robust than many fundamental-mode crystals in harsh environments. However, crystal oscillators (XO) generally offer superior short-term jitter performance due to lower active drive levels. For applications requiring tight holdover during power interruptions, a voltage-controlled oscillator (VCXO) or oven-controlled crystal oscillator (OCXO) would still outperform both, but the FO2HSBBP25.0-T3 strikes a favorable balance between cost, size, and reliability for embedded control systems.
Can the FO2HSBBP25.0-T3 drive multiple CMOS loads without buffering, and what is the maximum fanout under typical operating conditions?
The FO2HSBBP25.0-T3 has an HCMOS output stage rated for standard 3.3V logic compatibility with moderate capacitive loading. While it can directly drive one or two low-power CMOS inputs, attempting to fan out to four or more gates increases rise/fall times and risks signal integrity issues at 25 MHz. Each additional load adds parasitic capacitance that degrades edge rates and may cause excessive current draw, potentially leading to supply droop or instability. For designs requiring multiple destinations, an external buffer such as a 74LVC1G04 should be used instead of relying solely on the oscillator’s output.
What precautions should be taken during PCB assembly to avoid damaging the FO2HSBBP25.0-T3, given its RoHS compliance and MSL rating?
Although the FO2HSBBP25.0-T3 is classified as MSL 1 (unlimited shelf life with no dry pack required), it contains internal quartz elements sensitive to electrostatic discharge (ESD). During reflow soldering, peak temperatures above 260°C for extended durations may degrade internal bonding or alter frequency characteristics. Adhering to the manufacturer’s recommended thermal profile—typically max 245°C for 10 seconds—is critical. Additionally, handling with ESD-safe tools and grounding practices minimizes risk, especially since the device lacks external protection diodes unlike some IC-based oscillators.
In a system where multiple clocks must be synchronized, can the FO2HSBBP25.0-T3 be cascaded or phase-locked to another clock source?
The FO2HSBBP25.0-T3 does not feature a synchronization input or phase-locking capability, so it cannot be actively locked to an external reference like a PLL-controlled VCO. It generates a fixed-frequency signal independent of other sources. If sub-harmonic or derived timing is needed, downstream logic such as counters or FIFOs must be employed. Attempting to feed its output back into another timing element without isolation risks creating unstable feedback loops. Thus, for multi-clock domains, separate oscillator references or a dedicated clock distribution IC are preferable approaches.
How does temperature-induced frequency drift manifest in the FO2HSBBP25.0-T3 compared to a TCXO, and what design implications does this have?
Over the −40°C to +85°C range, the FO2HSBBP25.0-T3 exhibits approximately ±20 ppm variation, resulting in a total spread of about 5 kHz around 25 MHz. This is acceptable for most microcontroller and FPGA applications but insufficient for precision communication protocols like Ethernet or USB where tighter tolerances apply. A temperature-compensated crystal oscillator (TCXO) could reduce this drift to ±1 ppm or better by dynamically adjusting the resonant load based on ambient temperature. Therefore, choosing between these components depends on whether system-level calibration, protocol compliance, or cost constraints dominate the design priorities.
Is it permissible to operate the FO2HSBBP25.0-T3 outside its specified frequency tolerance window for diagnostic or testing purposes?
While temporary operation outside the ±20 ppm specification may appear functional during debugging, sustained deviation indicates potential issues such as incorrect load capacitance, power supply ripple, or marginal margining in the feedback loop. Operating beyond rated limits compromises interoperability with synchronous digital components that expect consistent clock edges. Furthermore, undocumented behavior may mask latent reliability risks under field conditions. Designers should treat any out-of-spec performance as a symptom requiring corrective action rather than a valid operating mode.
What role does decoupling play in stabilizing the FO2HSBBP25.0-T3, and what values and placement are recommended?
The FO2HSBBP25.0-T3 requires a 0.1 µF ceramic capacitor placed within 2 mm of the VDD pin to suppress high-frequency supply noise that could modulate the oscillation amplitude or induce phase jitter. A second bulk capacitor of 1–10 µF near the power entry point helps stabilize the overall supply rail. Without proper decoupling, transient currents from nearby switching loads can couple into the oscillator circuit, degrading short-term stability and increasing EMI emissions. These measures are particularly important in noisy environments or systems with shared power planes.
How does the FO2HSBBP25.0-T3 handle start-up time compared to an RC oscillator, and what considerations apply for battery-powered devices?
The FO2HSBBP25.0-T3 typically achieves full oscillation within 10 ms after power-up under normal conditions, thanks to its internal bias circuitry and optimized feedback gain. This is significantly slower than some RC oscillators but far more predictable than ring oscillators whose start-up depends heavily on process variations. In low-power modes where wake-up latency matters, designers might delay enabling peripherals until the clock stabilizes. Alternatively, using a faster-startup oscillator with lower accuracy may be traded off against system responsiveness and power consumption profiles.
Can the FO2HSBBP25.0-T3 replace a MEMS-based oscillator in space-constrained applications, and what trade-offs exist?
The FO2HSBBP25.0-T3 offers a compact surface-mount package suitable for dense PCBs, comparable in footprint to many MEMS devices. However, MEMS oscillators often provide superior shock/vibration resistance and longer operational lifetimes due to absence of moving parts. While the FO2HSBBP25.0-T3 performs well in moderate mechanical environments, aggressive vibration or drop tests may reveal frequency shifts unaccounted for in datasheet specifications. Thus, selection hinges on whether board real estate outweighs robustness requirements in the target deployment scenario.

Parts with Similar Specifications

The three parts on the right have similar specifications to Fox Electronics FO2HSBBP25.0-T3

Product Attribute FO2HSBBP25.0-BULK FO2HSBBM50.0-T3 FO2HSBBP16.0-T3 FO2HSBBP16.0-T1
Part Number FO2HSBBP25.0-BULK FO2HSBBM50.0-T3 FO2HSBBP16.0-T3 FO2HSBBP16.0-T1
Manufacturer Fox Electronics Fox Electronics Fox Electronics Fox Electronics
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

FO2HSBBP25.0-T3 Datasheet PDF

Download FO2HSBBP25.0-T3 pdf datasheets and Fox Electronics documentation for FO2HSBBP25.0-T3 - Fox Electronics.

Datasheets
O2HS Model Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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FO2HSBBP25.0-T3 Image

FO2HSBBP25.0-T3

Fox Electronics
98D-FO2HSBBP25.0-T3

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