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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsMC8641DVJ1000NE
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MC8641DVJ1000NE - NXP USA Inc.

Manufacturer Part Number
MC8641DVJ1000NE
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-MC8641DVJ1000NE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,860 pcs available, New & Original
Parts Description
IC MPU E600 DUAL CORE 1023FCCBGA
Package
1023-FCCBGA (33x33)
Data sheet
MC8641DVJ1000NE.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 11860

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Specifications

MC8641DVJ1000NE Tech Specifications
NXP USA Inc. - MC8641DVJ1000NE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MC8641DVJ1000NE

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - I/O 1.8V, 2.5V, 3.3V
USB -
Supplier Device Package 1023-FCCBGA (33x33)
Speed 1.0GHz
Series MPC86xx
Security Features -
SATA -
RAM Controllers DDR, DDR2
Package / Case 1023-BCBGA, FCCBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 105°C (TA)
Number of Cores/Bus Width 2 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100/1000Mbps (4)
Display & Interface Controllers -
Core Processor PowerPC e600
Co-Processors/DSP -
Base Product Number MC8641DVJ1000
Additional Interfaces DUART, HSSI, I²C, RapidIO

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A1
HTSUS 8542.31.0001

Parts Introduction

MC8641DVJ1000NE Image
MC8641DVJ1000NE (1)

Manufacturer Part Number

MC8641DVJ1000NE

Manufacturer

NXP Semiconductors

Introduction

The NXP MC8641DVJ1000NE is a high-performance, low-power embedded microprocessor based on the PowerPC e600 core. It is designed for a wide range of applications, including networking, telecommunications, and industrial control.

Product Features and Performance

2 PowerPC e600 cores with 32-bit architecture

Operating frequency of 1.0GHz

Supports DDR and DDR2 memory controllers

10/100/1000Mbps Ethernet interfaces (4)

Broad temperature range support from 0°C to 105°C

Surface mount package with 1023-BCBGA or 1023-FCCBGA options

Product Advantages

Powerful dual-core performance for demanding applications

Efficient power consumption for low-power and mobile designs

Comprehensive peripheral set for diverse connectivity requirements

Rugged design and wide temperature range for industrial applications

Key Reasons to Choose This Product

Proven PowerPC architecture for reliable and efficient performance

Flexible memory and networking capabilities to meet diverse needs

Robust thermal management for reliable operation in harsh environments

Long-term availability and support from a trusted semiconductor manufacturer

Quality and Safety Features

Rigorous quality control and testing processes

Compliance with industry safety and environmental standards

Compatibility

Compatible with a wide range of PowerPC-based systems and software

Application Areas

Networking and telecommunications equipment

Industrial automation and control systems

Military and aerospace applications

Embedded and IoT devices

Product Lifecycle

Customers are advised to contact our website's sales team for information on equivalent or alternative models that may be available.

Frequently Asked Questions(FAQ)

How does the MC8641DVJ1000NE compare to other MPC86xx series processors in terms of core architecture and clock speed for embedded applications requiring deterministic performance?
The MC8641DVJ1000NE features a dual-core PowerPC e600 core configuration running at 1.0GHz, which is consistent with the high-performance tier within the MPC86xx family. This places it above entry-level variants such as the MC8610DVJ2000NE (single-core, 2.0GHz) in terms of parallel processing capability, while maintaining comparable clock speeds. For systems demanding simultaneous multitasking or real-time workloads across multiple threads, this dual-core design provides inherent scalability. However, the trade-off includes increased power consumption and thermal density, which must be considered in thermal management planning for industrial-grade environments operating near 105°C.
What are the key differences between the MC8641DVJ1000NE and similar 32-bit PowerPC-based microprocessors when evaluating DDR2 memory subsystem performance?
Unlike some contemporaries that support only single-channel DDR or legacy DDR1 interfaces, the MC8641DVJ1000NE integrates dual independent DDR/DDR2 memory controllers. This enables true dual-channel memory access, effectively doubling theoretical bandwidth compared to single-channel implementations. In practice, this translates to approximately 12.8 GB/s peak bandwidth assuming DDR2-800 operation—a significant advantage for data-intensive embedded applications like network appliances or storage controllers. However, achieving full bandwidth requires careful PCB layout and signal integrity optimization due to tight timing constraints on the 1.8V/2.5V I/O rails.
Can the MC8641DVJ1000NE be used in safety-critical embedded systems requiring functional redundancy or error correction?
While the MC8641DVJ1000NE itself does not include built-in ECC memory support or lockstep core operation typically required for ASIL-D compliance, its architecture supports external memory controllers where ECC RAM can be implemented. The absence of on-die ECC means system designers must rely on external memory subsystems with parity or ECC capabilities. This increases board complexity but remains feasible in applications where ISO 26262 or IEC 61508 compliance is necessary. The lack of integrated security features also implies additional software-based isolation mechanisms would be needed for secure boot or cryptographic operations.
How does the 1023-FCCBGA package impact thermal performance and PCB routing complexity when integrating the MC8641DVJ1000NE into a high-reliability industrial controller?
The 1023-ball FCCBGA (33x33 mm) package presents significant challenges for thermal dissipation due to limited surface area and buried vias. Without an exposed thermal pad, heat primarily escapes through conduction via solder joints, necessitating robust PCB copper planes and potentially heat spreaders. Routing density is extremely high, with fine-pitch balls requiring controlled impedance traces and careful layer stack-up to maintain signal integrity across RapidIO, DUART, and four Gigabit Ethernet interfaces. Designers should allocate at least 12 layers with dedicated power and ground planes to manage crosstalk and power delivery noise effectively.
What considerations apply when selecting clock sources and PLL configurations for the MC8641DVJ1000NE to ensure stable operation over the full -40°C to +105°C industrial temperature range?
The MC8641DVJ1000NE relies on an external reference clock input to generate its internal 1.0GHz core frequency. Given the wide operating temperature span, oscillator stability becomes critical; crystal oscillators with ±25 ppm or better tolerance are recommended. Additionally, the internal PLLs require clean, low-jitter inputs to avoid timing violations during worst-case process-voltage-temperature (PVT) corners. Board-level decoupling and isolated clock paths help minimize phase noise from digital switching noise, particularly important given the simultaneous switching outputs (SSOs) from the four integrated Gigabit Ethernet MACs.
How does the MC8641DVJ1000NE support inter-processor communication compared to alternative multi-core architectures?
Unlike ARM-based big.LITTLE designs or Intel Atom clusters that use shared caches and QPI/UPI links, the MC8641DVJ1000NE employs RapidIO as its primary interconnect fabric between cores. This choice favors deterministic latency and message-passing efficiency over raw bandwidth, making it suitable for telecom switching or aerospace systems where predictability trumps peak throughput. Compared to PCIe-based topologies, RapidIO offers lower protocol overhead and direct memory access without host CPU intervention, though it lacks the ecosystem maturity of PCIe for general-purpose peripherals.
What are the implications of using the MC8641DVJ1000NE in a multi-drop network environment with multiple Gigabit Ethernet ports?
With four full-duplex 10/100/1000Mbps Ethernet ports, the MC8641DVJ1000NE enables complex networking topologies such as L2/L3 switches or industrial gateways. However, each port draws significant power—typically 3–5W per port under load—and generates electromagnetic interference (EMI) that must be mitigated through proper shielding and layout techniques. The absence of hardware offload engines (e.g., TCP/IP acceleration) means the CPU bears full protocol stack burden, potentially limiting throughput in high-concurrency scenarios unless paired with external PHYs featuring advanced QoS capabilities.
How does the voltage flexibility of 1.8V, 2.5V, and 3.3V I/O domains affect mixed-signal design integration with the MC8641DVJ1000NE?
The tri-level I/O support allows interfacing with legacy 3.3V peripherals while reducing power in newer sub-2.5V devices, offering a migration path for legacy designs. However, level-shifting circuitry may be required if mixing domains without careful attention to slew rates and termination. The 1.8V core voltage aligns with modern low-power standards, but care must be taken during voltage ramp sequencing to prevent latch-up, especially since the package lacks built-in ESD protection beyond standard HBM ratings.
What are the long-term supply chain risks associated with the MC8641DVJ1000NE and strategies to mitigate obsolescence concerns?
As part of the MPC86xx family from NXP, the MC8641DVJ1000NE may face end-of-life declarations typical for mature embedded SoCs. Mitigation includes qualifying alternative platforms early, securing long-lead inventory, and exploring pin-compatible replacements such as newer e500mc-based devices. However, architectural differences limit true drop-in swaps. Engaging with NXP’s lifecycle advisory service and maintaining alternate vendor qualifications can reduce risk for mission-critical deployments exceeding 7 years.
How does the Moisture Sensitivity Level (MSL) rating of 3 for the MC8641DVJ1000NE influence handling procedures during reflow soldering in mass production?
An MSL3 classification indicates the device tolerates one floor life period before baking is required. With a shelf life of 168 hours (7 days), production schedules must account for timely assembly post-opening to prevent moisture-induced popcorning during reflow. Facilities should implement humidity-controlled storage below 60% RH and adhere to JEDEC J-STD-033 guidelines for bake-out protocols if storage exceeds thresholds, ensuring reliability in high-volume manufacturing environments.
What role does the Base Product Number MC8641DVJ1000 play in component identification versus the full model number MC8641DVJ1000NE?
The base product number MC8641DVJ1000 identifies the silicon revision, stepping, and package variant, enabling cross-referencing across distributors and internal BOM management. The suffix "NE" denotes RoHS3 compliance and specific environmental packaging requirements. Together, they form a complete part identifier used in procurement and quality traceability, whereas dropping either element risks sourcing non-compliant or functionally distinct revisions.
How does the absence of USB, SATA, and onboard graphics impact system architecture choices when deploying the MC8641DVJ1000NE?
The lack of native USB host/device or SATA controllers forces reliance on external bridge chips or expansion modules, increasing bill-of-materials cost and board space. For applications needing mass storage, designers must incorporate USB-to-SATA converters or FPGA-based solutions. Similarly, video output requires discrete GPUs or display controllers, making the MC8641DVJ1000NE ideal for headless servers, routers, or control systems rather than multimedia endpoints.
What design verification steps are essential to validate correct operation of the MC8641DVJ1000NE under worst-case PVT conditions?
Comprehensive validation includes silicon characterization across voltage (±10%), temperature (-40°C to +105°C), and process corners using automated test benches. Key metrics include PLL lock time, DDR eye diagram margins, and RapidIO link training success rates. Boundary scan testing helps verify interconnect continuity, while stress testing under sustained Ethernet traffic ensures thermal throttling doesn’t violate timing budgets. Failure analysis tools like SEM imaging assist in diagnosing physical defects post-failure.
How does the HTSUS code 8542.31.0001 influence import/export regulations for shipments involving the MC8641DVJ1000NE?
Classified under 8542.31.0001, this HTS code designates integrated circuits with central processing capabilities, subjecting them to U.S. Customs duties and potential export controls under ECCN 3A991A1. Importers must file accurate harmonized codes to avoid penalties, while exporters need verified end-use certificates for restricted markets. Misclassification risks delays or confiscation, particularly in jurisdictions with strict semiconductor trade policies.
What alternatives exist if the MC8641DVJ1000NE is discontinued and what are their relative trade-offs?
Potential successors include NXP’s newer Power Architecture e500mc cores or transitioning to ARM Cortex-A series with equivalent performance. However, migrating from PowerPC requires recompiling firmware, rewriting drivers, and validating RTOS compatibility. Performance-wise, modern ARM cores often surpass single-threaded PowerPC throughput while consuming less power, but lack specialized instruction sets for certain DSP tasks. Legacy codebases tightly coupled to PowerPC ABI present significant rework barriers.
How does the operating temperature range of 0°C to 105°C affect application environments where the MC8641DVJ1000NE is deployed?
While adequate for most industrial settings, the upper limit of 105°C excludes automotive-grade (up to +125°C) or aerospace applications without external cooling. Environments with frequent thermal cycling may accelerate solder joint fatigue in the BGA package, necessitating conformal coating and strain relief. Ambient airflow and heatsinking become critical in enclosed chassis designs to prevent sustained operation near maximum junction temperatures.
What debugging resources are available for diagnosing issues in systems using the MC8641DVJ1000NE?
NXP provides JTAG debug interfaces accessible via boundary scan chains, enabling instruction tracing and register inspection. The DUART interface facilitates serial console logging for early bring-up. Hardware probes like the MPC8641DDSK development kit simplify initial validation, while software tools such as CodeWarrior support live memory inspection. For advanced debugging, logic analyzers capturing RapidIO or Ethernet frames aid in protocol-layer troubleshooting.
How does the REACH status "Unaffected" affect material disclosure obligations for the MC8641DVJ1000NE?
"REACH Unaffected" signifies that no substances of very high concern (SVHCs) above 0.1% weight-by-weight are intentionally added during manufacturing. This simplifies compliance documentation for EU-based customers, eliminating the need for SCIP database notifications upon sale. Nevertheless, full material declarations should still be requested from suppliers to confirm absence of restricted substances in packaging or die attach materials.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MC8641DVJ1000NE

Product Attribute MC8641DTVU1000NC MC8641DVU1000GE MC8641DTVU1000GE MC8641DTVU1000GE557
Part Number MC8641DTVU1000NC MC8641DVU1000GE MC8641DTVU1000GE MC8641DTVU1000GE557
Manufacturer NXP USA Inc. Freescale Semiconductor NXP USA Inc. Freescale Semiconductor
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Security Features - - - -
Additional Interfaces - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Cores/Bus Width - - - -
USB - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Display & Interface Controllers - - - -
RAM Controllers - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Co-Processors/DSP - - - -
SATA - - - -
Ethernet - - - -
Graphics Acceleration - - - -
Core Processor - - - -
Voltage - I/O - - - -
Speed - - - -

MC8641DVJ1000NE Datasheet PDF

Download MC8641DVJ1000NE pdf datasheets and NXP USA Inc. documentation for MC8641DVJ1000NE - NXP USA Inc..

Datasheets
Cylindrical Battery Holders.pdf
PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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  • ISO 28000: 2007
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  • GB/T 27922-2011
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  • IPC
  • ESD
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MC8641DVJ1000NE Image

MC8641DVJ1000NE

NXP USA Inc.
32D-MC8641DVJ1000NE

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