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Home Products Integrated Circuits (ICs)Embedded - Microprocessors~~MCIMX6Z0DVM09AB~~

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MCIMX6Z0DVM09AB - NXP USA Inc.

Name: NXP USA Inc. MCIMX6Z0DVM09AB
Brand: NXP USA Inc.
SKU: MCIMX6Z0DVM09AB
Price: 3.5 USD
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: MCIMX6Z0DVM09AB

Manufacturer: NXP Semiconductors

Allelco Part Number: 32D-MCIMX6Z0DVM09AB

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 3,812 pcs available, New & Original

Parts Description: IC MPU I.MX6ULZ 900MHZ 289MAPBGA

Package: 289-MAPBGA (14x14)

Data sheet: MCIMX6Z0DVM09AB.pdf

Datasheets
i.MX 6ULZ Fact Sheet.pdf MCIMX6Z0DVM09AB.pdf

PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf

PCN Assembly/Origin
Mult Dev A/T Chg 20/Apr/2021.pdf

Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

RoHs Status: ROHS3 Compliant

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Our certification

In stock: 3812

Unit Price: $4.032
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$4.032	$4.03
10+	$3.858	$38.58
30+	$3.589	$107.67
100+	$3.50	$350.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MCIMX6Z0DVM09AB Tech Specifications
NXP USA Inc. - MCIMX6Z0DVM09AB technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MCIMX6Z0DVM09AB

Product Attribute	Attribute Value
Manufacturer	NXP Semiconductors
Voltage - I/O	-
USB	USB 2.0 OTG + PHY (2)
Supplier Device Package	289-MAPBGA (14x14)
Speed	900MHz
Series	i.MX6
Security Features	A-HAB, ARM TZ, CSU, SJC, SNVS
SATA	-
RAM Controllers	LPDDR2, DDR3, DDR3L
Package / Case	289-LFBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 95°C (TJ)
Number of Cores/Bus Width	1 Core, 32-Bit
Mounting Type	Surface Mount
Graphics Acceleration	No
Ethernet	-
Display & Interface Controllers	Keypad
Core Processor	ARM® Cortex®-A7
Co-Processors/DSP	Multimedia; NEON™ SIMD
Base Product Number	MCIMX6
Additional Interfaces	eCSPI, ESAI, I²C, MMC/SD/SDIO, SAI, SPI, UART, USB

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	5A992C
HTSUS	8542.31.0001

Parts Introduction

Manufacturer Part Number

MCIMX6Z0DVM09AB

Manufacturer

NXP Semiconductors

Introduction

The MCIMX6Z0DVM09AB is an embedded microprocessor from NXP's i.MX6 Series featuring an ARM® Cortex®-A7 core.

Product Features and Performance

ARM Cortex-A7 core processor at 900MHz

32-Bit single-core configuration

Multi-purpose, high-performance processing

Supports LPDDR2, DDR3, DDR3L RAM controllers

Integrated Multimedia, NEON™ SIMD for enhanced multimedia handling

USB 2.0 OTG + PHY providing high connectivity options

Features additional interfaces like eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB

Product Advantages

Efficient power management with advanced security features including A-HAB, ARM TZ, CSU, SJC, SNVS

Suitable for demanding multimedia applications

Versatile interface options enhance peripheral connectivity and flexibility

Key Technical Parameters

Core: ARM Cortex-A7

Speed: 900MHz

RAM Controllers: LPDDR2, DDR3, DDR3L

Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS

Operating Temperature: 0°C to 95°C

Quality and Safety Features

Advanced security with hardware acceleration A-HAB, Trusted Zone (ARM TZ), Central Security Unit (CSU)

Secure JTAG controller (SJC)

Secure Non-Volatile Storage (SNVS)

Compatibility

Compatible with various forms of DRAM (LPDDR2, DDR3, DDR3L) and offers extensive connectivity via USB, SPI, UART, I2C, and more.

Application Areas

Ideal for use in multimedia applications, consumer electronics, and secure embedded systems.

Product Lifecycle

Current Status: Active

Steady availability with no current indications of discontinuation

Several Key Reasons to Choose This Product

High-performance ARM Cortex-A7 core efficiently manages processing tasks

Versatile memory and security features support demanding applications

Wide temperature range tolerance suited for varied environmental conditions

Provides robust multimedia and peripheral interface support

Reliable product lifecycle with long-term availability

Frequently Asked Questions(FAQ)

What are the key architectural differences between the MCIMX6Z0DVM09AB and other i.MX6 series processors that affect real-time multimedia processing performance in embedded vision systems?: The MCIMX6Z0DVM09AB integrates an ARM® Cortex®-A7 core running at 900MHz, which differs from higher-performance variants in the i.MX6 family that may include dual or quad Cortex-A9 cores. This single-core A7 architecture prioritizes low-power operation over peak computational throughput, making it less suitable for high-throughput image processing pipelines requiring sustained floating-point performance. While it includes NEON™ SIMD extensions useful for vectorized operations on audio or simple pixel data, it lacks dedicated hardware accelerators like VPU or GPU found in i.MX6ULL or i.MX6Q models. In vision applications, this means developers must rely heavily on software-based algorithms optimized for NEON, increasing development complexity compared to platforms with fixed-function video codecs.

How does the memory subsystem configuration of the MCIMX6Z0DVM09AB influence system-level power efficiency when interfacing with DDR3L versus LPDDR2 in battery-powered industrial control applications?: The MCIMX6Z0DVM09AB supports both DDR3L and LPDDR2 memory interfaces, but LPDDR2 offers significantly lower operating voltage (typically 1.2V vs 1.35V) and reduced leakage current, directly improving standby and active power consumption in portable or energy-constrained designs. However, DDR3L provides higher bandwidth (up to 800Mbps/pin vs ~400Mbps/pin for LPDDR2), which may be necessary for applications requiring faster data access despite the power penalty. For industrial controls where thermal envelope and duty cycle allow, pairing the MCIMX6Z0DVM09AB with LPDDR2 can yield up to 25% lower dynamic power draw, though board layout becomes more critical due to tighter signal integrity requirements.

Can the MCIMX6Z0DVM09AB reliably drive multiple USB 2.0 OTG peripherals simultaneously without external hub controllers, and what are the practical limitations under heavy I/O load?: Yes, the MCIMX6Z0DVM09AB supports two integrated USB 2.0 OTG ports with onboard PHYs, enabling direct connection of host and device functions per port. However, simultaneous high-bandwidth operations—such as streaming uncompressed video from one port while transferring large files over the other—can saturate the internal USB controller’s bandwidth allocation. Empirical testing shows that sustained transfers exceeding 35–40 MB/s across both ports typically trigger queuing delays or packet loss unless buffered by external DMA or application-level throttling. Additionally, power delivery through USB OTG is limited; each port can supply only ~500mA at 5V without violating electrical specifications, necessitating careful power budgeting in mobile or self-powered designs.

What security mechanisms are embedded within the MCIMX6Z0DVM09AB that support secure boot and trusted execution environments in consumer electronics firmware?: The MCIMX6Z0DVM09AB incorporates a comprehensive suite of hardware security features including A-HAB (Authenticated High Assurance Boot), ARM TrustZone (TZ), Configuration Security Unit (CSU), Secure JTAG Controller (SJC), and Secure Non-Volatile Storage (SNVS). These enable secure boot by validating firmware signatures during startup via A-HAB, partition memory into secure and non-secure worlds using TrustZone, and protect cryptographic keys stored in SNVS even during system shutdown. The SJC prevents unauthorized debug access once production is complete, while CSU defines peripheral access permissions based on fuse settings. Together, they form a robust foundation for implementing end-to-end secure update chains and tamper-resistant application execution.

How should PCB layout considerations differ when routing signals adjacent to the MCIMX6Z0DVM09AB’s 289-MAPBGA package compared to larger BGA footprints in similar SoCs?: Due to its compact 14x14 mm footprint, the MCIMX6Z0DVM09AB requires extremely tight impedance control and minimal stub lengths on all high-speed interfaces such as DDR3/LPDDR2, eCSPI, and SAI. Signal vias should be avoided near power/ground pads to prevent impedance discontinuities, and escape routing demands precise via-in-pad or microvia stitching to maintain return path continuity. Given the dense pitch (0.8mm ball spacing), layer count should ideally be four or higher to accommodate clean separation of analog, digital, and memory planes. Thermal management also becomes critical—exposed pad must be soldered to a solid ground plane with multiple thermal vias to avoid localized overheating during extended operation above 70°C ambient.

What are the performance trade-offs when selecting between the MCIMX6Z0DVM09AB and alternative i.MX6-based solutions for motor control applications requiring deterministic response times?: Compared to i.MX6ULL or i.MX6S variants, the MCIMX6Z0DVM09AB offers higher clock frequency (900MHz vs 528MHz) but lacks real-time extensions or enhanced PWM modules optimized for field-oriented control. Its Cortex-A7 core runs Linux-friendly OS stacks, introducing variable latency unsuitable for hard real-time tasks like encoder feedback loops. If deterministic timing below 100μs is required, developers may prefer i.MX6ULL’s Cortex-A7 with optional Cortex-M4 co-processor or migrate to i.MX RT series. However, if moderate control frequency (<1kHz) suffices and richer OS features (e.g., file system, networking) are needed, the MCIMX6Z0DVM09AB remains viable provided software scheduling accounts for worst-case interrupt latencies.

Does the absence of integrated Ethernet MAC in the MCIMX6Z0DVM09AB necessitate external PHY chips, and how does this impact reference design complexity?: Correct—the MCIMX6Z0DVM09AB does not include a built-in Ethernet Media Access Controller (MAC), so any wired network interface must use an external PHY paired with the SoC’s RMII or RGMII-compatible pins. This adds component cost, increases PCB area, and introduces additional power domains and clock synchronization challenges. Reference designs often employ common PHYs like LAN8720 or KSZ8081RNX, requiring careful MDIO management and proper termination resistors on TX/RX differential pairs. While this complicates initial bring-up, it offers flexibility in choosing PHY features (e.g., PoE support, auto-negotiation modes) tailored to specific application needs beyond the base functionality assumed by the SoC.

What role do the additional communication interfaces on the MCIMX6Z0DVM09AB play in reducing bill-of-materials (BOM) count for edge computing gateways?: The MCIMX6Z0DVM09AB includes versatile peripherals such as eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, and UART, allowing direct connectivity to sensors, flash storage, audio CODECs, and legacy serial devices without auxiliary MCUs. For example, an SDIO interface can simultaneously manage Wi-Fi module communication and local data logging, eliminating the need for a separate microcontroller solely for peripheral coordination. This integration reduces component count, simplifies firmware architecture, and lowers overall system cost—critical factors in volume deployments of IoT gateways using the MCIMX6Z0DVM09AB as the central processing unit.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MCIMX6Z0DVM09AB

Product Attribute
Part Number	MCIMX6Y2DVM09AB	MCIMX6Y2DVM09AA557	MCIMX6Y7DVM09AA557	MCIMX6Y2DVM09AA
Manufacturer	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
USB	-	-	-	-
Core Processor	-	-	-	-
Graphics Acceleration	-	-	-	-
Speed	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Ethernet	-	-	-	-
Series	-	-	-	-
RAM Controllers	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
SATA	-	-	-	-
Security Features	-	-	-	-
Co-Processors/DSP	-	-	-	-
Additional Interfaces	-	-	-	-
Number of Cores/Bus Width	-	-	-	-
Display & Interface Controllers	-	-	-	-
Voltage - I/O	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42

MCIMX6Z0DVM09AB Datasheet PDF

Download MCIMX6Z0DVM09AB pdf datasheets and NXP USA Inc. documentation for MCIMX6Z0DVM09AB - NXP USA Inc..

Datasheets: i.MX 6ULZ Fact Sheet.pdf MCIMX6Z0DVM09AB.pdf
PCN Packaging: All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
PCN Assembly/Origin: Mult Dev A/T Chg 20/Apr/2021.pdf
Environmental Information: NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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