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HomeProductsIntegrated Circuits (ICs)Interface - I/O ExpandersPCA9555DB,112
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PCA9555DB,112 - NXP USA Inc.

Manufacturer Part Number
PCA9555DB,112
Manufacturer
NXP Semiconductors
Allelco Part Number
98D-PCA9555DB,112
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,478 pcs available, New & Original
Parts Description
IC XPNDR 400KHZ I2C SMBUS 24SSOP
Package
24-SSOP
Data sheet
PCA9555DB,112.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Specifications

PCA9555DB,112 Tech Specifications
NXP USA Inc. - PCA9555DB,112 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - PCA9555DB,112

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - Supply 2.3V ~ 5.5V
Supplier Device Package 24-SSOP
Series -
Package / Case 24-SSOP (0.209', 5.30mm Width)
Package Tube
Output Type Push-Pull
Operating Temperature -40°C ~ 85°C
Product Attribute Attribute Value
Number of I/O 16
Mounting Type Surface Mount
Interrupt Output Yes
Interface I²C, SMBus
Features POR
Current - Output Source/Sink 10mA, 25mA
Clock Frequency 400 kHz
Base Product Number PCA95

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the PCA9555DB,112 handle voltage level translation in mixed-voltage systems, and what are the practical implications for interfacing with 3.3V microcontrollers and 5V legacy peripherals?
The PCA9555DB,112 operates across a wide supply voltage range of 2.3V to 5.5V, enabling direct compatibility with both 3.3V and 5V logic systems without requiring external level-shifting circuitry. This broad operating range allows the device to interface seamlessly between different voltage domains, such as a 3.3V microcontroller and a 5V industrial sensor bus. The open-drain I/O structure combined with internal clamping diodes supports bidirectional voltage translation, provided that the higher-voltage side is not driven beyond VDD + 0.5V. In practical design scenarios, this eliminates the need for discrete MOSFETs or dedicated translators, reducing board space and component count. However, designers must ensure that input signals from higher-voltage rails do not exceed the absolute maximum ratings when the PCA9555DB,112 is powered at lower voltages.
What are the key differences between the PCA9555DB,112 and the PCA9535DB in terms of output configuration and interrupt handling, particularly when used in real-time control applications?
While both the PCA9555DB,112 and PCA9535DB are I²C/SMBus I/O expanders from NXP, the PCA9555DB,112 features push-pull outputs instead of the open-drain configuration typical of the PCA9535DB. This enables the PCA9555DB,112 to actively drive high or low states without pull-up resistors, improving signal integrity and response time in applications like LED driving or relay control. Additionally, the PCA9555DB,112 includes an active-low interrupt output (INT), whereas the PCA9535DB relies on configurable GPIO inputs for status indication. In real-time control loops, this means the PCA9555DB,112 can generate precise interrupts based on input state changes, enabling faster event-driven responses compared to polling-based architectures required with the PCA9535DB.
Can the PCA9555DB,112 reliably source or sink 25mA per pin under continuous operation at elevated ambient temperatures, and how should thermal considerations influence layout decisions?
Yes, the PCA9555DB,112 is specified to source or sink up to 25mA per I/O pin, but this capability assumes proper thermal management. At full load and ambient temperatures approaching 85°C, the junction temperature may rise significantly due to power dissipation, potentially triggering internal thermal shutdown mechanisms to protect the device. Each mA of current through a pin dissipates approximately 0.2W–0.3W depending on supply voltage and switching frequency. Therefore, in designs requiring sustained high-current loads (e.g., driving multiple LEDs or relays), it’s essential to minimize trace resistance, use adequate copper area, and consider spacing between adjacent pins to improve heat dissipation. Layout practices should avoid clustering high-current paths and ensure sufficient clearance to prevent localized heating.
Is it safe to hot-swap a PCA9555DB,112 into a powered system, and what precautions are necessary to prevent latch-up or damage during insertion or removal?
Hot-swapping the PCA9555DB,112 is not officially supported and poses risks of transient current surges, especially if input lines float or are pulled high by external circuits before the device powers up. To mitigate these risks, designers should implement series resistors (typically 100Ω–1kΩ) on each I/O line to limit inrush current, and consider using TVS diodes for ESD protection. Additionally, ensuring that the supply voltage ramps up gradually during hot-plug events helps avoid excessive stress on internal ESD structures. Although the device has an internal Power-On Reset (POR) feature that resets the register state on startup, this does not protect against physical or electrical damage during mishandling.
How does the 400 kHz clock frequency of the PCA9555DB,112 impact bus performance in multi-master environments, and what cable length limitations should be considered for reliable communication?
The PCA9555DB,112 supports standard-mode I²C at up to 400 kHz, which limits practical cable lengths to approximately 1 meter over unshielded twisted pair due to signal attenuation and capacitance effects. In multi-master systems, the 400 kHz limitation reduces arbitration contention windows, potentially increasing latency during bus access conflicts. For longer distances or higher data throughput, alternative protocols like SPI or CAN may be more appropriate. When using the PCA9555DB,112 on extended buses, termination resistors and pull-up values near 2.2 kΩ at 3.3V supply are recommended to maintain rise times within I²C specifications. Exceeding these guidelines risks corrupted data frames and missed interrupts.
What role does the internal POR feature play in system initialization, and how does it affect recovery after a brownout event in embedded designs using the PCA9555DB,112?
The internal Power-On Reset (POR) circuitry ensures that all registers default to zero upon initial power-up or voltage restoration after a brownout condition. This guarantees predictable startup behavior, preventing undefined states that could lead to erratic GPIO outputs during system boot. After a brownout, the PCA9555DB,112 will automatically reset its configuration registers, requiring software to reconfigure direction and output settings upon microcontroller wake-up. While this simplifies firmware development, it also introduces a brief period of incorrect pin states until reinitialization completes—typically within tens of milliseconds. Designers should account for this delay in safety-critical systems where immediate control response is required.
How does the Moisture Sensitivity Level (MSL) rating of 1 for the PCA9555DB,112 influence storage and handling procedures prior to reflow soldering?
With an MSL rating of 1, the PCA9555DB,112 is classified as non-hygroscopic and requires no special dry packaging or baking before reflow. It can be stored indefinitely at ambient conditions without risk of moisture-induced delamination or popcorning during thermal exposure. This simplifies inventory management and assembly workflows, particularly in high-volume production environments where long shelf-life and flexible handling are advantageous. Nonetheless, standard anti-static precautions should still be followed during manual handling to preserve long-term reliability.
Are there any known substitutes for the PCA9555DB,112 that offer similar functionality with enhanced features, such as higher drive strength or integrated pull-ups?
Several substitute devices exist, including the TCA9555DBR and MAX7312AAG+T, which provide comparable I²C expander functionality. The TCA9555DBR, also from Texas Instruments, mirrors the PCA9555DB,112’s push-pull outputs and 400 kHz support but integrates weak internal pull-ups on the I²C bus, simplifying PCB design. The MAX7312AAG+T from Maxim offers slightly lower output current (20mA) but includes selectable slew-rate control and better EMI performance. While these alternatives reduce external component count in some cases, they may lack equivalent thermal margins or require careful review of package compatibility. Substitution should be validated through functional testing under worst-case operating conditions.
What is the significance of the HTSUS code 8542.39.0001 for the PCA9555DB,112 in international trade, and how might it affect import duties in certain markets?
The HTSUS classification 8542.39.0001 designates the PCA9555DB,112 as a "Electronic Integrated Circuits" item falling under semiconductor-specific tariff codes, typically applied in U.S. customs regulations. This categorization generally results in lower duty rates compared to generic electronic components, often zero or minimal tariffs depending on bilateral trade agreements. Accurate classification aids in cost forecasting and regulatory compliance during global distribution. Misclassification could lead to delayed shipments or financial penalties, so importers should verify harmonized tariff schedules in target jurisdictions to avoid discrepancies.
How does the choice of pull-up resistor value affect signal integrity on the I²C bus when using the PCA9555DB,112 across varying supply voltages?
The optimal pull-up resistor value depends inversely on the bus capacitance and desired rise time, following the formula t_rise ≈ 0.8473 × R_pullup × C_bus. For a 3.3V system with a 400 kHz clock and 200 pF total capacitance (including the PCA9555DB,112’s input capacitance), a 2.2 kΩ resistor yields a rise time of ~1.4 µs, comfortably within I²C specifications. At 5V operation, higher resistance values (e.g., 4.7 kΩ) may be acceptable due to increased noise margin, but must not exceed limits imposed by maximum allowable rise time (≤ 300 ns for standard mode). Using excessively large resistors increases susceptibility to electromagnetic interference, while small values waste power and overload the PCA9555DB,112’s bus drivers.
Can the PCA9555DB,112 support simultaneous reading and writing operations without bus collisions, and what protocol-level safeguards ensure data coherence?
The PCA9555DB,112 itself does not manage bus arbitration; instead, it relies on the I²C master controller to coordinate read/write sequences. However, the device supports fast context switching via its shadow registers, allowing the master to read input states independently of recent output writes. To prevent race conditions, firmware should follow strict transaction ordering: write new output values, then optionally read back status using the input port register. Since the PCA9555DB,112 latches input changes only at the rising edge of the SCL clock, brief glitches may be missed unless debouncing is implemented externally. Proper timing discipline and avoidance of nested accesses minimize collision risks in multi-threaded systems.
What environmental and regulatory certifications make the PCA9555DB,112 suitable for automotive or industrial applications beyond its stated -40°C to 85°C operating range?
Although the PCA9555DB,112 is not specifically qualified to AEC-Q100 standards, its ROHS3 compliance and REACH unaffected status confirm adherence to EU environmental directives, making it permissible in many regulated industrial designs. Its wide operating temperature range covers most commercial and light-industrial environments, but fails to meet stringent automotive requirements for thermal cycling or humidity resistance. For mission-critical applications, additional qualification testing—such as HAST or thermal shock validation—should be performed to ensure long-term reliability beyond datasheet guarantees.
How does the interrupt output (INT) function behave when multiple input pins change simultaneously, and what is the minimum pulse width guaranteed for external detection?
The INT output on the PCA9555DB,112 asserts low whenever any enabled input pin transitions to a logic high state, regardless of whether other pins also change. The interrupt remains active until the master reads the input port register, clearing all pending flags simultaneously. According to NXP’s characterization data, the minimum active duration of INT is typically 200 ns under nominal conditions, which exceeds the setup time for most microcontrollers. This ensures reliable capture even with fast edge rates, though firmware must poll the register promptly to avoid missing subsequent events in rapid-fire scenarios.
What are the consequences of exceeding the maximum supply current specification during peak load transients, and how can decoupling capacitors mitigate instability?
Transient current spikes—such as those caused by simultaneous high-side switching of multiple GPIOs—can briefly exceed the PCA9555DB,112’s internal regulation capacity, leading to supply droop or oscillation if not properly decoupled. A 100 nF ceramic capacitor placed within 5 mm of the VDD pin provides sufficient local energy storage to suppress sub-microsecond transients. Additionally, a bulk 10 µF tantalum or polymer capacitor at the board’s power entry point stabilizes slower variations. Without adequate bypassing, voltage sag below 2.3V may cause unintended resets or corruption of configuration registers, compromising system robustness.
Does the PCA9555DB,112 support partial address decoding or banked register access, and how does this influence scalability in large I²C networks?
The PCA9555DB,112 uses a fixed 7-bit I²C address (typically 0x40–0x47 depending on ADDR pin configuration), offering no banked or segmented addressing scheme. This limits the number of devices on a single bus to eight without address conflicts. In scalable systems requiring dozens of I/O expanders, designers must either use multiple I²C buses with dedicated masters or adopt alternative architectures like serial-to-parallel shift registers with chip-select lines. While the lack of advanced addressing complicates large-scale deployments, it simplifies protocol implementation and reduces firmware complexity for moderate node counts.
How does the package type (24-SSOP) affect routing density and thermal performance in compact PCBs, and what land pattern recommendations should be followed?
The 24-lead SSOP package (5.30 mm width) occupies relatively little board area but presents routing challenges due to narrow pitch (0.65 mm). High-speed signals like SDA/SCL should be routed with matched lengths (< 10 mm difference) and kept away from noisy traces. Thermal vias under the exposed pad—if present—can enhance heat dissipation, though the PCA9555DB,112 lacks an ePad in this variant. Recommended solder paste volume and reflow profiles must align with JEDEC J-STD-020 to avoid tombstoning or insufficient wetting. Automated optical inspection (AOI) helps detect bridging between closely spaced pads.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. PCA9555DB,112

Product Attribute PCA9555BS,118 PCA9555DBQR PCA9555DB PCA9555DBR
Part Number PCA9555BS,118 PCA9555DBQR PCA9555DB PCA9555DBR
Manufacturer NXP USA Inc. Texas Instruments Texas Instruments Texas Instruments
Output Type - Current - Unbuffered Voltage - Buffered -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Clock Frequency - - - -
Number of I/O - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Interrupt Output - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Interface - - - -
Voltage - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Current - Output Source/Sink - - - -
Features - - - Simultaneous Sampling
Series - - - -

PCA9555DB,112 Datasheet PDF

Download PCA9555DB,112 pdf datasheets and NXP USA Inc. documentation for PCA9555DB,112 - NXP USA Inc..

Datasheets
Cylindrical Battery Holders.pdf
PCN Obsolescence/ EOL
Mult Devices 27/Jul/2017.pdf PCA95 EOL 16/Mar/2021.pdf
PCN Packaging
2.73KHz.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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PCA9555DB,112 Image

PCA9555DB,112

NXP USA Inc.
98D-PCA9555DB,112

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