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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~S912ZVMAL3F0MLC~~

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S912ZVMAL3F0MLC - NXP USA Inc.

Name: NXP USA Inc. S912ZVMAL3F0MLC
Brand: NXP USA Inc.
SKU: S912ZVMAL3F0MLC
Price: 1.232 USD
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: S912ZVMAL3F0MLC

Manufacturer: NXP Semiconductors

Allelco Part Number: 32D-S912ZVMAL3F0MLC

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,693 pcs available, New & Original

Parts Description: IC MCU 16BIT 32KB FLASH 32LQFP

Package: 32-LQFP (7x7)

Data sheet: S912ZVMAL3F0MLC.pdf

Datasheets
MC9S12ZVMA Family Ref. Manual & Datasheet ~.pdf S12ZVMA Fact Sheet.pdf

PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf

PCN Assembly/Origin
Mult Dev A/T Site 28/Apr/2021.pdf

Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

PCN Design/Specification
S12 MagniV Series DS/Manual Chg 28/Jun/2019.pdf

PCN Other
Safety Manual 24/Jan/2019.pdf

RoHs Status: ROHS3 Compliant

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In stock: 6693

Unit Price: $1.883
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$1.883	$1.88
10+	$1.641	$16.41
30+	$1.489	$44.67
100+	$1.333	$133.30
500+	$1.263	$631.50
1250+	$1.232	$1,540.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

S912ZVMAL3F0MLC Tech Specifications
NXP USA Inc. - S912ZVMAL3F0MLC technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - S912ZVMAL3F0MLC

Product Attribute	Attribute Value
Manufacturer	NXP Semiconductors
Voltage - Supply (Vcc/Vdd)	3.5V ~ 20V
Supplier Device Package	32-LQFP (7x7)
Speed	32MHz
Series	S12 MagniV
RAM Size	2K x 8
Program Memory Type	FLASH
Program Memory Size	32KB (32K x 8)
Peripherals	PWM, WDT
Package / Case	32-LQFP
Package	Tray

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 125°C (TA)
Number of I/O	10
Mounting Type	Surface Mount
EEPROM Size	128 x 8
Data Converters	A/D 4x10b
Core Size	16-Bit
Core Processor	S12Z
Connectivity	LINbus, SCI, SPI
Base Product Number	S912

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

S912ZVMAL3F0MLC (1)

Manufacturer Part Number

S912ZVMAL3F0MLC

Manufacturer

NXP Semiconductors

Introduction

The S912ZVMAL3F0MLC is part of NXP Semiconductors' S12 MagniV series, specifically designed for embedded microcontroller applications. This component integrates advanced control and connectivity features to support automotive and industrial applications.

Product Features and Performance

Core Processor: S12Z (16-Bit)

Speed: 32MHz

Connectivity options include LINbus, SCI, SPI

Peripherals: PWM (Pulse Width Modulation), WDT (Watchdog Timer)

Number of I/O: 10

Program Memory Size: 32KB (FLASH)

EEPROM Size: 128 x 8

RAM Size: 2K x 8

Voltage Supply Range: 3.5V to 20V

Data Converters: A/D 4x10b for analog to digital conversion

Oscillator Type: Internal, facilitating clock generation without external components

Operating Temperature: -40°C to 125°C, ensuring reliability under extreme conditions

Product Advantages

Integrated high-speed 16-bit CPU core optimized for control applications

Wide voltage supply range, making it suitable for automotive environments

Comprehensive set of peripherals enable flexible design options

High temperature endurance ideal for industrial applications

S912ZVMAL3F0MLC (2)

Key Technical Parameters

Core Size: 16-Bit

Speed: 32MHz

Program Memory Size: 32KB

RAM Size: 2K x 8

Voltage Supply Range: 3.5V ~ 20V

Data Converters: 4x10 bit

Operating Temperature: -40°C ~ 125°C

Quality and Safety Features

Rigorous testing for automotive standards compliance

Designed for high reliability and durability in harsh conditions

Compatibility

The S12Z core offers compatibility with a range of development tools and software, facilitating ease of design and implementation.

Application Areas

Automotive systems

Industrial control units

Embedded systems requiring high reliability

Product Lifecycle

Current Product Status: Active

The product is not nearing discontinuation, and replacements or upgrades are available as part of the S12 MagniV series.

Several Key Reasons to Choose This Product

Advanced 16-bit S12Z core optimized for embedded applications

High-integration reduces BOM cost and PCB complexity

Wide voltage range and high temperature resilience ideal for automotive and industrial applications

Supports essential connectivity and peripheral options for flexible design considerations

Active product lifecycle status with NXP's long-term support and upgrade paths

Frequently Asked Questions(FAQ)

How does the S912ZVMAL3F0MLC handle voltage fluctuations in industrial motor control applications where supply stability is not guaranteed?: The S912ZVMAL3F0MLC supports a wide supply range from 3.5V to 20V, enabling reliable operation across fluctuating input conditions typical in automotive and industrial environments. This broad Vcc tolerance allows direct interfacing with unregulated power rails without additional voltage regulation stages, reducing component count and improving system robustness. Combined with internal voltage monitoring and brown-out detection features, the MCU can safely initiate shutdown or reset sequences during under-voltage events, preventing erratic behavior in critical motor control loops.

In what scenarios would the S912ZVMAL3F0MLC be preferred over higher-pin-count microcontrollers like the S12XEP100 for cost-sensitive embedded designs?: The S912ZVMAL3F0MLC is ideal for applications requiring moderate I/O expansion and real-time peripheral integration without the complexity of high-end automotive MCUs. For example, in HVAC systems or smart sensors where only 10 general-purpose I/Os are needed alongside LINbus communication and analog sensing, the S912ZVMAL3F0MLC offers sufficient functionality at a lower BOM cost compared to the S12XEP100. Its compact 32-LQFP package also supports smaller PCB footprints, making it suitable for space-constrained designs where pin count directly correlates with manufacturability and assembly cost.

What are the thermal implications of operating the S912ZVMAL3F0MLC near its maximum junction temperature in enclosed industrial enclosures?: With an operating temperature range of -40°C to 125°C (TA), the S912ZVMAL3F0MLC is rated for harsh environments, but sustained operation near 125°C significantly impacts long-term reliability due to increased electromigration and reduced mean time between failures (MTBF). In sealed enclosures with poor airflow, ambient temperatures may exceed 85°C even if the MCU surface remains cooler than the junction. Engineers should account for this derating by maintaining lower average case temperatures through layout optimization—such as placing the device away from heat sources and using thermal vias—to preserve signal integrity and prevent latch-up in the internal analog modules.

How does the 32KB flash memory of the S912ZVMAL3F0MLC influence firmware update strategies in field-deployed devices?: At 32KB, the flash provides enough space for non-volatile storage of application code, calibration tables, and bootloader routines, but limits the size of over-the-air (OTA) updates unless compression is employed. For instance, a typical motor control algorithm might consume 20–24 KB, leaving minimal headroom for diagnostic logging or parameter storage. Designers must implement delta updates or use external EEPROM (e.g., leveraging the available 128-byte internal EEPROM) to store runtime variables, ensuring that full image flashing isn’t required during maintenance cycles, which reduces downtime and validation overhead.

Can the S912ZVMAL3F0MLC reliably interface with legacy sensor networks using asynchronous serial protocols without requiring external UART transceivers?: Yes, the S912ZVMAL3F0MLC includes two SCI (Serial Communication Interface) peripherals compliant with LINbus standards, allowing direct communication with legacy sensor nodes using standard UART framing at common baud rates up to 1 Mbps. These SCI modules support automatic wake-up from stop mode via LIN headers, making them suitable for low-power sensor aggregation networks. No external transceivers are needed for basic point-to-point LIN communication, though level-shifting components may still be required depending on node voltage levels, especially when interfacing with 5V legacy devices.

What considerations apply when selecting decoupling capacitors for the S912ZVMAL3F0MLC in high-noise switching regulator environments?: Due to its wide supply range and analog front-end sensitivity, the S912ZVMAL3F0MLC demands careful decoupling near each power pin. A combination of 100nF ceramic capacitors placed within 2 mm of the Vdd pins and a 10µF bulk capacitor on the main rail helps suppress high-frequency noise from buck converters and low-frequency ripple from battery-powered operation. Additionally, the internal ADC’s performance degrades above 100mVpp of supply noise, so layout must minimize loop area and avoid routing digital traces beneath analog sections to maintain measurement accuracy in precision sensing applications.

How does the internal oscillator compare to an external crystal in terms of timing accuracy for CAN/LIN network synchronization?: While the S912ZVMAL3F0MLC includes an internal RC oscillator calibrated to ±2% over temperature and voltage, this variation exceeds the ±1% tolerance required for precise bit timing in LIN networks running at 20 kbps or faster. For applications demanding tight synchronization, an external 8 MHz crystal with load capacitors is recommended, providing frequency stability within ±10 ppm. However, if only slow-speed LIN (≤10 kbps) or SCI-based communication is used, the internal oscillator may suffice, reducing component count and board complexity in non-critical control loops.

Is the S912ZVMAL3F0MLC suitable for functional safety applications such as ISO 26262-compliant body electronics?: The S912ZVMAL3F0MLC lacks formal safety certification and does not include built-in mechanisms like lockstep cores, ECC-protected memory, or fault injection detection required for ASIL-rated systems. It is designed for general-purpose embedded control rather than safety-critical functions. While it can be used in non-safety-related body control modules (e.g., window lifts or lighting), any safety-relevant logic must be implemented in software with extensive watchdog supervision, error logging, and periodic self-tests—adding significant development effort without guaranteeing compliance with functional safety standards.

How does the limited RAM size affect interrupt latency in real-time control tasks on the S912ZVMAL3F0MLC?: With only 2K x 8 bytes of RAM, the S912ZVMAL3F0MLC constrains the depth of interrupt service routine (ISR) stacks and data buffering. During nested interrupts—common in PWM-driven motor control—excessive stack usage can lead to overflow if local variables or temporary buffers exceed available memory. Designers must minimize ISR footprint by deferring non-essential processing to background tasks and avoiding dynamic allocation. For instance, a PID controller updating every 50 µs may require only tens of bytes, but adding debug logging or floating-point math could quickly exhaust resources, increasing worst-case latency beyond acceptable thresholds.

What are the trade-offs between using internal vs. external ADCs in conjunction with the S912ZVMAL3F0MLC for battery voltage monitoring?: The S912ZVMAL3F0MLC integrates four 10-bit successive approximation ADCs with programmable gain, sufficient for coarse battery monitoring down to 3.5V with adequate resolution (~3.4 mV/LSB). However, for applications requiring >1% accuracy over temperature or multi-cell batteries (>12V), an external SAR ADC with integrated reference offers superior linearity and noise immunity. Using the internal ADC avoids extra ICs and saves PCB space, but introduces gain drift and offset errors that may necessitate periodic calibration—adding software complexity. Thus, internal ADCs suit simple state monitoring, while external solutions are preferable for precision energy management systems.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. S912ZVMAL3F0MLC

Product Attribute
Part Number	S912ZVMAL3F0VLC	S912ZVMAL3F0MLF	S912ZVMAL3F0WLF	S912ZVMAL3F0VLF
Manufacturer	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.
Connectivity	-	-	-	-
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of I/O	-	-	-	-
Oscillator Type	-	-	-	-
Program Memory Type	-	-	-	-
RAM Size	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Speed	-	-	-	-
Core Size	-	-	-	-
Program Memory Size	-	-	-	-
Data Converters	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Peripherals	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
EEPROM Size	-	-	-	-
Core Processor	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

S912ZVMAL3F0MLC Datasheet PDF

Download S912ZVMAL3F0MLC pdf datasheets and NXP USA Inc. documentation for S912ZVMAL3F0MLC - NXP USA Inc..

Datasheets: MC9S12ZVMA Family Ref. Manual & Datasheet ~.pdf S12ZVMA Fact Sheet.pdf
PCN Packaging: All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
PCN Assembly/Origin: Mult Dev A/T Site 28/Apr/2021.pdf
Environmental Information: NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN Design/Specification: S12 MagniV Series DS/Manual Chg 28/Jun/2019.pdf
PCN Other: Safety Manual 24/Jan/2019.pdf

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Customer Reviews

Evaluation: 10 Articles

Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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