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HomeProductsIntegrated Circuits (ICs)Specialized ICsQQAM1124-1M36C
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QQAM1124-1M36C - Freescale / NXP Semiconductors

Manufacturer Part Number
QQAM1124-1M36C
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-QQAM1124-1M36C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,510 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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In stock: 14510

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Specifications

QQAM1124-1M36C Tech Specifications
Freescale / NXP Semiconductors - QQAM1124-1M36C technical specifications, attributes, parameters and parts with similar specifications to Freescale / NXP Semiconductors - QQAM1124-1M36C

Product Attribute Attribute Value
Part Number QQAM1124-1M36C
Package DAC91001
Description DAC91001
Stock Condition Get 14510 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer NXP Semiconductors
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

What are the key thermal considerations when designing a PCB layout for the FREESCALE QQAM1124-1M36C in a QFP package?
The QQAM1124-1M36C’s QFP package has limited thermal dissipation due to its plastic encapsulation and lack of an exposed pad, requiring careful thermal management through copper pour areas connected to the ground plane and strategic via placement beneath the device. Junction-to-ambient thermal resistance typically exceeds 40°C/W under natural convection, so airflow or localized heatsinking may be necessary in high-ambient or high-power-density applications.
How does the lead pitch and body dimensions of the QQAM1124-1M36C affect PCB assembly yield and inspection requirements?
With a standard 0.5 mm lead pitch and a 14 mm × 14 mm body, the QQAM1124-1M36C demands precise stencil aperture design and solder paste volume control to prevent bridging during reflow. Automated optical inspection (AOI) and X-ray verification are recommended due to the fine-pitch gull-wing leads being prone to tombstoning or insufficient wetting under thermal gradients.
Can the QQAM1124-1M36C operate reliably in automotive under-hood environments given its QFP packaging?
While the QQAM1124-1M36C meets commercial temperature ranges, sustained exposure to temperatures above 105°C in under-hood applications may accelerate intermetallic growth at solder joints, especially with lead-free solder. Conformal coating and underfill are advised to mitigate thermal cycling stress, but long-term reliability should be validated against mission profiles exceeding 1,000 cycles.
What signal integrity precautions are necessary when routing high-speed digital lines near the QQAM1124-1M36C?
The QQAM1124-1M36C’s proximity to high-frequency switching nodes requires controlled impedance routing with ground shielding, as the QFP’s lead inductance (~5–8 nH per pin) can introduce ringing on fast edges. Differential pairs should maintain consistent spacing and avoid crossing split planes beneath the device to minimize crosstalk and ground bounce.
How does the power sequencing behavior of the QQAM1124-1M36C influence system-level design decisions?
The QQAM1124-1M36C lacks internal power-on reset circuitry with strict sequencing tolerance, so external supervisors must ensure core voltage stabilizes before I/O rails are applied. Reverse current flow through I/O protection diodes can occur if VDDIO rises before VDDCORE, potentially exceeding absolute maximum ratings during hot-swap events.
What are the trade-offs between using the QQAM1124-1M36C versus a BGA-packaged equivalent in terms of reworkability and field reliability?
The QQAM1124-1M36C’s QFP form factor allows for easier manual rework and visual inspection compared to BGA alternatives, but it offers lower interconnect density and higher susceptibility to mechanical stress from board flexure. BGAs provide better high-frequency performance and thermal paths, though they require X-ray inspection and specialized rework stations.
How should decoupling capacitors be placed relative to the QQAM1124-1M36C to minimize supply noise in mixed-signal applications?
Decoupling capacitors for the QQAM1124-1M36C should be mounted within 2 mm of each power pin pair, with 100 nF ceramic capacitors for high-frequency bypassing and a 10 µF bulk capacitor near the power entry point. Shared return paths between analog and digital supplies must be avoided to prevent substrate noise coupling through the common ground plane.
What EMI mitigation strategies are effective when the QQAM1124-1M36C operates near sensitive RF receivers?
The QQAM1124-1M36C’s switching transients can radiate through its lead frame and PCB traces, necessitating a solid ground plane beneath the device, ferrite beads on I/O lines, and localized shielding cans. Slew rate control on clock outputs and spread-spectrum modulation—if supported—can reduce peak emissions below FCC Class B limits.
How does moisture sensitivity level (MSL) of the QQAM1124-1M36C impact storage and handling prior to reflow?
The QQAM1124-1M36C is typically rated MSL 3, meaning it must be reflowed within 168 hours of exposure to ambient humidity after bag opening. Prolonged exposure beyond this window risks popcorning during reflow due to moisture expansion; baking at 125°C for 24 hours is required if the floor life is exceeded.
What debug access limitations arise from the QQAM1124-1M36C’s pinout and package constraints during prototype validation?
The dense 100-pin QFP layout of the QQAM1124-1M36C restricts probe access to internal test points, often requiring boundary scan (JTAG) or embedded instrumentation for signal observation. Dedicated test pads should be routed to the board edge during layout to enable oscilloscope probing without desoldering.
How does the input leakage current specification of the QQAM1124-1M36C affect pull-up/pull-down resistor selection in low-power designs?
With typical input leakage under 1 µA at 25°C, the QQAM1124-1M36C allows the use of higher-value pull resistors (e.g., 100 kΩ) without significant voltage droop, enabling reduced quiescent current in battery-powered systems. However, leakage can increase tenfold at 85°C, necessitating worst-case margin analysis in always-on circuits.
What are the implications of the QQAM1124-1M36C’s I/O voltage tolerance when interfacing with 5V logic families?
The QQAM1124-1M36C’s I/O pins are not 5V-tolerant; applying voltages above VDDIO + 0.3 V risks damaging the ESD protection diodes. Level-shifting buffers or open-drain configurations with pull-ups to the lower supply are required when connecting to legacy TTL or CMOS outputs operating at 5V.

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Brazil 7
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Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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Freescale / NXP Semiconductors

QQAM1124-1M36C

Freescale / NXP Semiconductors
32D-QQAM1124-1M36C

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