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HomeProductsIntegrated Circuits (ICs)Specialized ICsS9S08DZ60F2CLC
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S9S08DZ60F2CLC - NXP Semiconductors

Manufacturer Part Number
S9S08DZ60F2CLC
Manufacturer
NXP Semiconductors
Allelco Part Number
41D-S9S08DZ60F2CLC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
3,820 pcs available, New & Original
Parts Description
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Data sheet
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Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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In stock: 3820

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Specifications

S9S08DZ60F2CLC Tech Specifications
NXP Semiconductors - S9S08DZ60F2CLC technical specifications, attributes, parameters and parts with similar specifications to NXP Semiconductors - S9S08DZ60F2CLC

Product Attribute Attribute Value
Part Number S9S08DZ60F2CLC
Package -
Description -
Stock Condition Get 3820 pcs available quantity at Allelco
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Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer NXP Semiconductors
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
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Parts Introduction

Manufacturer Part Number

S9S08DZ60F2CLC

Manufacturer

NXP Semiconductors

Introduction

The S9S08DZ60F2CLC is a high-performance, low-power 8-bit embedded microcontroller from NXP Semiconductors. It features a range of advanced peripherals and connectivity options, making it suitable for a variety of industrial and consumer applications.

Product Features and Performance

8-bit S08 core processor

40MHz operating speed

60KB FLASH program memory

2KB EEPROM

4KB RAM

Integrated CAN, I2C, LIN, SCI, and SPI interfaces

10-channel 12-bit ADC

Low-voltage detection (LVD), power-on reset (POR), PWM, and watchdog timer (WDT) peripherals

25 general-purpose I/O pins

Product Advantages

Flexible connectivity options for a wide range of applications

Robust safety and power management features

High-performance 8-bit core with ample memory

Low power consumption for energy-efficient designs

Key Reasons to Choose This Product

Robust and reliable performance for industrial and consumer applications

Extensive peripheral set for flexible system design

Cost-effective solution for 8-bit embedded systems

Long-term availability and support from NXP Semiconductors

Quality and Safety Features

Industrial-grade operating temperature range (-40°C to 85°C)

Rigorous quality and reliability testing

Integrated safety features like LVD and POR

Compatibility

The S9S08DZ60F2CLC is pin-compatible with other S08 series microcontrollers from NXP, allowing for easy design migration and platform flexibility.

Application Areas

Industrial automation and control

Building and home automation

Appliances and consumer electronics

Automotive and transportation systems

Product Lifecycle

The S9S08DZ60F2CLC is an active product in our website's sales team's portfolio. There are no immediate plans for discontinuation. However, as technology evolves, equivalent or alternative models may become available in the future. Customers are advised to check with our website's sales team for the most up-to-date product information and availability.

Frequently Asked Questions(FAQ)

How does the S9S08DZ60F2CLC compare to other S08 series microcontrollers in terms of program memory and peripheral integration for industrial sensor monitoring applications?
The S9S08DZ60F2CLC offers 60KB of on-chip FLASH program memory, which is among the higher capacities within the S08 family, supporting complex firmware routines required for advanced signal processing in industrial environments. Its integrated peripherals—including a 10-channel 12-bit ADC, PWM modules, CAN, LIN, and multiple serial interfaces—enable direct interfacing with sensors and communication networks without requiring external components. While lower-capacity variants like the S9S08DZ32 may suffice for simpler tasks, the DZ60 variant provides sufficient code space for state machines, calibration algorithms, and real-time data logging, making it well-suited for intelligent sensor nodes in automation systems.
What voltage range and operating conditions make the S9S08DZ60F2CLC suitable for automotive or rugged embedded applications?
The S9S08DZ60F2CLC operates across a supply voltage range of 2.7V to 5.5V, allowing compatibility with both low-power battery-operated devices and standard 3.3V or 5V industrial systems. With an operating temperature range from -40°C to 85°C (TA), it meets industrial-grade reliability standards and is suitable for deployment in environments exposed to thermal cycling or elevated ambient temperatures. This combination of wide voltage tolerance and extended temperature performance supports use in automotive body electronics, remote instrumentation, or factory floor control systems where environmental stress is common.
Can the S9S08DZ60F2CLC drive high-current loads directly, and what external circuitry would be needed for relay or motor control?
The S9S08DZ60F2CLC features 25 general-purpose I/O pins, each capable of sourcing or sinking up to 25mA under typical conditions, but absolute maximum ratings limit individual pin current to approximately 25mA at VDD = 5.5V. Therefore, direct driving of relays or motors exceeding this threshold requires external buffering using transistors or MOSFETs. For inductive loads like solenoids, flyback diodes must be added across the load to suppress voltage spikes during switching. In such designs, PWM outputs can be used to modulate power delivery while relying on discrete components for current amplification.
How does the internal oscillator configuration affect system design when using the S9S08DZ60F2CLC?
The S9S08DZ60F2CLC relies on an external crystal oscillator, which provides greater frequency stability and timing accuracy compared to internal RC oscillators found in some lower-cost MCUs. Designing with an external resonator typically demands attention to PCB layout, including proper grounding, short trace lengths, and minimal noise coupling near the oscillator pins. This approach ensures reliable operation at the full 40MHz rated speed and reduces jitter in time-critical applications such as motor control or communication protocols like CANbus, where precise baud rate generation is essential.
What trade-offs exist between using the internal EEPROM versus external storage when implementing data logging with the S9S08DZ60F2CLC?
The S9S08DZ60F2CLC includes 2K x 8 bytes of internal EEPROM, sufficient for storing calibration constants, configuration settings, or small datasets over thousands of write cycles. However, frequent logging of large volumes of data may exhaust the limited endurance and capacity of on-chip EEPROM. In such cases, external serial EEPROMs or FRAM modules offer higher density and better write longevity but require additional pins and protocol overhead (e.g., I2C or SPI). For infrequent updates or non-volatile parameter storage, the built-in EEPROM simplifies BOM cost and board space; for high-volume streaming data, external solutions are preferable despite added complexity.
Is the S9S08DZ60F2CLC compatible with legacy 5V microcontroller development tools and bootloaders?
Yes, the S9S08DZ60F2CLC supports 2.7V to 5.5V operation, making it compatible with standard 5V TTL logic levels and enabling interoperability with legacy 5V-based toolchains and bootloader implementations. Many S08 evaluation boards and debug probes operate at 5V and can interface directly without level shifting. However, developers should verify that all connected peripherals also tolerate 5V input levels, especially when using UART, SPI, or I2C buses, to avoid damaging slave devices not designed for 5V signaling.
How many analog inputs does the S9S08DZ60F2CLC support, and what considerations apply when sampling multiple sensors simultaneously?
The S9S08DZ60F2CLC integrates a 10-channel, 12-bit successive approximation ADC capable of converting analog signals from external sensors into digital values. When sampling multiple channels, software must manage multiplexing carefully due to inherent channel-to-channel and aperture delay variations. For applications requiring synchronized sampling across several sensors—such as thermocouple arrays or precision measurement systems—a single-shot conversion mode with staggered triggers may be necessary. Additionally, input capacitance and source impedance should be minimized to maintain conversion accuracy and reduce settling time between samples.
What packaging and thermal characteristics should be considered when mounting the S9S08DZ60F2CLC in compact enclosures?
The S9S08DZ60F2CLC is available in a 32-pin LQFP package measuring 7x7 mm, offering a balance of pin count and board real estate. As a surface-mount device with a Moisture Sensitivity Level (MSL) of 3, it requires handling per IPC/JEDEC J-STD-033 guidelines, including baking if exposed to moisture beyond 168 hours. Although the LQFP lacks a thermal pad, its exposed leads provide moderate heat dissipation, but sustained high CPU utilization or peripheral activity may necessitate thermal relief vias or airflow management in sealed enclosures to prevent localized heating that could impact long-term reliability.
How does the watchdog timer in the S9S08DZ60F2CLC enhance system robustness in unattended deployments?
The integrated watchdog timer (WDT) monitors software execution by requiring periodic "kicking" via firmware. If the main loop fails to reset the WDT within its timeout window—typically programmable from milliseconds to seconds—the MCU automatically resets, preventing hangs caused by software faults. This feature is critical in battery-powered or remotely deployed devices where manual intervention is impractical. Developers must ensure the WDT service routine executes reliably and is not inadvertently disabled during initialization sequences to preserve fault recovery capability.
Can the S9S08DZ60F2CLC be substituted with the MC9S08DZ60ACLC in existing designs, and what differences should designers verify?
The MC9S08DZ60ACLC is listed as a substitute for the S9S08DZ60F2CLC and shares identical core specifications, including 60KB FLASH, 4K RAM, and the same pinout in a 32-LQFP package. Both parts belong to NXP’s S08 family and operate under similar electrical and timing constraints. However, minor variations in revision codes, manufacturing lots, or internal silicon revisions could affect behavior under extreme conditions. Designers should confirm functional equivalence through controlled testing, particularly regarding ADC linearity, oscillator startup times, or brown-out detection thresholds, before committing to substitution in safety-relevant applications.
What role do the power-on reset (POR) and low-voltage detect (LVD) features play in protecting embedded systems using the S9S08DZ60F2CLC?
The S9S08DZ60F2CLC includes integrated POR circuitry that ensures clean initialization upon power-up, avoiding erratic behavior from undefined register states. The LVD circuit monitors VDD and triggers a reset or interrupt if voltage drops below a configurable threshold (typically 2.7V or 3.0V depending on configuration), preventing corrupted operations during brownout events. Together, these features enhance system reliability by ensuring the microcontroller only executes valid code under stable supply conditions, which is especially valuable in automotive or portable devices subject to voltage transients.
How does the inclusion of CAN and LIN bus support benefit communication architectures based on the S9S08DZ60F2CLC?
Native CAN and LIN physical layer support allows the S9S08DZ60F2CLC to serve as a gateway or node in automotive or industrial networks without requiring external transceivers. This reduces component count, PCB area, and latency in message transmission. CAN enables robust multi-node communication with error detection and arbitration, while LIN provides a low-cost alternative for sensor-actuator networks. Implementing these protocols in hardware accelerators offloads the CPU from bit-banging tasks, preserving bandwidth for application logic and improving real-time responsiveness in distributed control systems.
What clock source options exist for achieving precise timing with the S9S08DZ60F2CLC, and how do they impact system design complexity?
While the S9S08DZ60F2CLC primarily uses an external crystal oscillator, it also supports an internal fast RC oscillator for less stringent timing requirements. Using an external crystal maximizes frequency accuracy and stability, crucial for CANbus synchronization or UART baud rate generation. However, it adds cost, board space, and sensitivity to mechanical shock or humidity. Alternatively, the internal RC can simplify design but exhibits drift over temperature and aging. System architects must balance precision needs against environmental robustness and production yield when selecting the clock strategy.
How much RAM does the S9S08DZ60F2CLC provide, and what factors limit dynamic data handling capabilities?
The S9S08DZ60F2CLC contains 4K x 8 bytes of on-chip SRAM, sufficient for most mid-level embedded applications involving moderate data buffering or stack usage. However, complex algorithms such as FFTs, large lookup tables, or multi-threaded RTOS environments may exceed this limit. Developers must optimize memory usage through static allocation, efficient data structures, and careful management of global and local variables. Exceeding available RAM results in stack overflow or heap corruption, leading to unpredictable behavior, underscoring the importance of profiling memory consumption early in the development cycle.
What precautions should be taken when programming the FLASH memory of the S9S08DZ60F2CLC to ensure data integrity?
Programming FLASH memory requires stable VDD above 2.7V and adherence to timing constraints specified in the datasheet. Abrupt power loss during erase or write operations can corrupt sectors, rendering code unrecoverable. To mitigate risk, systems should include bulk capacitors near the MCU and implement software safeguards such as verifying write completion before proceeding. Additionally, FLASH endurance limits (typically 10k–100k cycles per sector) necessitate wear-leveling strategies for frequently updated data, reserving FLASH regions for firmware updates rather than volatile runtime data storage.

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
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New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
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NXP Semiconductors

S9S08DZ60F2CLC

NXP Semiconductors
41D-S9S08DZ60F2CLC

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