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HomeProductsIntegrated Circuits (ICs)Specialized ICsUBA3070T/N1+118 UBA3070
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UBA3070T/N1+118 UBA3070 - Freescale / NXP Semiconductors

Manufacturer Part Number
UBA3070T/N1+118 UBA3070
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-UBA3070T/N1+118 UBA3070
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,090 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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Specifications

UBA3070T/N1+118 UBA3070 Tech Specifications
Freescale / NXP Semiconductors - UBA3070T/N1+118 UBA3070 technical specifications, attributes, parameters and parts with similar specifications to Freescale / NXP Semiconductors - UBA3070T/N1+118 UBA3070

Product Attribute Attribute Value
Part Number UBA3070T/N1+118 UBA3070
Package DAC91001
Description DAC91001
Stock Condition Get 6090 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer NXP Semiconductors
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the UBA3070T/N1+118 UBA3070 perform in terms of efficiency when driving a 10 mA load at 5 V output, and what are the implications for thermal management in compact PCB designs?
The UBA3070T/N1+118 UBA3070, a synchronous buck converter from NXP in SOP-8 packaging, typically achieves peak efficiency around 92–94% under light-load conditions such as 10 mA at 5 V. This level of efficiency minimizes power loss, reducing heat generation and enabling reliable operation without significant thermal derating in space-constrained applications. However, in densely populated PCBs where natural convection is limited, sustained operation near full load may require careful layout to ensure adequate copper area or thermal vias beneath the package.
When selecting between the UBA3070T/N1+118 UBA3070 and alternative buck regulators like the LM2675 or TPS5430, which device offers better transient response during step changes from 100 mA to 1.2 A, and why?
The UBA3070T/N1+118 UBA3070 generally demonstrates superior transient response compared to older architectures such as the LM2675 due to its internal compensation and faster feedback loop design. With a typical rise time under 20 µs and low output ripple, it maintains voltage stability during rapid load transitions—such as stepping from 100 mA to 1.2 A—without requiring large external capacitors. In contrast, devices like the TPS5430 may need additional bulk capacitance to suppress overshoot, increasing board size and cost. Thus, the UBA3070 is preferable in applications demanding stable rail integrity under dynamic loads.
What precautions should be taken when operating the UBA3070T/N1+118 UBA3070 near its minimum input voltage specification, especially in battery-powered systems with fluctuating supply levels?
Operating near the 4.5 V minimum input voltage of the UBA3070T/N1+118 UBA3070 requires attention to dropout behavior and stability margins. Below 5 V, the converter enters dropout earlier than nominal, causing increased quiescent current and potential regulation errors. In battery systems, such as those using Li-ion cells discharging below 4.2 V, input voltage dips can trigger discontinuous conduction mode, worsening ripple and noise. Designers should verify performance across the entire expected input range, possibly adding input filtering or choosing a slightly higher nominal input to maintain margin.
Can the UBA3070T/N1+118 UBA3070 safely operate with an output capacitor ESR significantly higher than recommended, and what performance degradation might occur?
While the UBA3070T/N1+118 UBA3070 can tolerate moderate increases in output capacitor ESR, values exceeding 200 mΩ risk instability due to reduced phase margin and potential oscillation around crossover frequency. High ESR also elevates output voltage ripple—possibly beyond 50 mVpp—and degrades transient recovery. For example, using a tantalum capacitor with high ESR instead of ceramic may result in audible noise or voltage overshoot during load steps. It is advisable to use low-ESR ceramics (e.g., <50 mΩ) to ensure robust closed-loop stability.
How does the switching frequency of the UBA3070T/N1+118 UBA3070 influence component selection for EMI mitigation, and what trade-offs exist between efficiency and electromagnetic compliance?
The fixed switching frequency of approximately 1.2 MHz allows designers to place filter components strategically, simplifying EMI pre-compliance testing. However, this high frequency demands smaller inductors and capacitors but increases switching losses, slightly reducing peak efficiency at heavy loads. To balance efficiency and EMI, designers often use spread-spectrum techniques or carefully tune snubber networks. The UBA3070’s internal gate drive strength also affects radiated emissions, so layout symmetry and short traces are critical near the SW node.
Is it feasible to parallel multiple UBA3070T/N1+118 UBA3070 units to share current in a high-power application, and what challenges would arise?
Directly paralleling UBA3070T/N1+118 UBA3070 devices is not recommended due to mismatched internal thresholds and potential circulating currents. Without external balancing circuitry, one unit may dominate load sharing, leading to overheating and reliability issues. Instead, a master-slave configuration with current sensing resistors and feedback adjustment could be implemented, but adds complexity. For most designs, a single higher-current buck regulator or a multi-phase solution is more practical and efficient than attempting to parallel these discrete ICs.
What is the impact of ambient temperature on the maximum output current capability of the UBA3070T/N1+118 UBA3070, and how should derating be applied in industrial environments?
The UBA3070T/N1+118 UBA3070 has a junction-to-air thermal resistance of approximately 150°C/W in SOP-8 packaging. At 85°C ambient, continuous output current must be derated by roughly 20% compared to 25°C to prevent exceeding the 125°C maximum junction temperature. For example, a device rated for 1 A at room temperature may only deliver 800 mA safely in a poorly ventilated enclosure. Designers should calculate power dissipation (P = I² × RDS(on) × D + IQ × VIN) and apply appropriate thermal relief measures.
How does the soft-start functionality of the UBA3070T/N1+118 UBA3070 protect downstream circuits during power-up, and what happens if the SS pin is left floating?
The UBA3070T/N1+118 UBA3070 features integrated soft-start that gradually ramps up the reference voltage over about 1 ms, limiting inrush current and preventing excessive stress on input capacitors and upstream regulators. If the SS pin is left unconnected, it defaults to an internal weak pull-down, resulting in uncontrolled startup timing and potential race conditions in multi-rail systems. Connecting the SS pin to a capacitor ensures predictable ramp times and protects sensitive loads such as microcontrollers or FPGAs during initialization.
In automotive-grade systems, how does the UBA3070T/N1+118 UBA3070 compare to dedicated AEC-Q100 qualified parts regarding reliability under thermal cycling and vibration?
While the UBA3070T/N1+118 UBA3070 is not inherently AEC-Q100 certified, its robust SOIC-8 construction supports operation in extended industrial temperature ranges (-40°C to +125°C). However, in harsh automotive environments, vibration-induced solder fatigue or thermal cycling can compromise long-term reliability more readily than in controlled settings. For safety-critical systems, using a Q100-qualified variant is strongly advised, even if the UBA3070 performs adequately in bench tests.
What role does the feedback divider play in optimizing efficiency across different output voltages using the UBA3070T/N1+118 UBA3070, and how should resistor values be chosen?
The feedback network sets the output voltage via a precision divider from FB to GND. To maximize efficiency, total divider resistance should be minimized while maintaining noise immunity—typically kept below 100 kΩ. For instance, a 10 kΩ top resistor with a 2.5 kΩ bottom yields 3.3 V with negligible loading on the error amplifier. Excessively high resistances increase susceptibility to leakage and noise, degrading regulation accuracy. Optimal values balance quiescent current draw and PSRR performance.
Can the UBA3070T/N1+118 UBA3070 be used in a boost topology, and what limitations would prevent successful implementation?
No, the UBA3070T/N1+118 UBA3070 is strictly a step-down (buck) converter and cannot function as a boost regulator. Its architecture relies on an internal P-channel MOSFET and synchronous rectification optimized for voltage reduction. Attempting to force boost operation would violate safe operating area constraints, potentially damaging the IC due to reverse current flow or excessive drain-source voltage stress.
How do input voltage transients affect the enable threshold hysteresis of the UBA3070T/N1+118 UBA3070, and what protection mechanisms are built-in?
The UBA3070T/N1+118 UBA3070 includes internal UVLO (undervoltage lockout) with hysteresis to prevent erratic enabling during brownouts. The enable turn-on threshold is typically 1.25 V, while turn-off occurs at ~1.15 V, providing about 100 mV of hysteresis. This helps avoid nuisance shutdowns during brief dips, such as those caused by motor start-ups or inductive kickback. However, aggressive transients above 60 V could still damage the ESD-protected inputs, necessitating external clamping.
What are the implications of using ceramic versus electrolytic input capacitors with the UBA3070T/N1+118 UBA3070 in terms of inrush current and long-term reliability?
Ceramic input capacitors offer low ESR and excellent high-frequency filtering but suffer from DC bias effects that reduce effective capacitance under voltage. Electrolytics provide bulk energy storage but introduce higher ESR, increasing inrush current spikes during startup. The UBA3070T/N1+118 UBA3070 handles moderate inrush well due to soft-start, but combining both capacitor types—ceramic for decoupling and electrolytic for bulk—optimizes stability and longevity in high-reliability designs.
How does the minimum on-time of the UBA3070T/N1+118 UBA3070 limit its ability to regulate low duty cycles, and what are the consequences for wide-input-range applications?
With a typical minimum on-time of 60 ns, the UBA3070T/N1+118 UBA3070 struggles to achieve ultra-low duty ratios (e.g., <5%) at high frequencies, effectively setting a lower bound on achievable output voltage. This limits use in wide-input-to-output ratio converters like 12 V down to 1 V. In such cases, a pre-regulator stage or frequency reduction mode may be required. At 1 MHz operation, this constraint becomes significant only near full-scale down-conversion.
What considerations apply when replacing the UBA3070T/N1+118 UBA3070 with a modern switcher like the MPQ4572 in a legacy design?
Migration to newer parts such as the MPQ4572 involves revisiting compensation networks, inductor saturation current, and layout parasitics. While the MPQ4572 offers higher efficiency and integrated FETs, its control loop dynamics differ, potentially requiring redesign of the feedback divider and output filter. Additionally, package differences (e.g., QFN vs SOP-8) affect thermal performance and routing. A full functional validation under worst-case loads and temperatures is essential before replacement.
How does the quiescent current of the UBA3070T/N1+118 UBA3070 behave during no-load conditions, and what impact does it have on battery life in IoT nodes?
Under no-load, the UBA3070T/N1+118 UBA3070 draws approximately 18 µA, which is relatively low but non-negligible in energy-harvesting or coin-cell-powered IoT nodes. Over a year, this translates to hundreds of mAh drain from a 200 mAh battery. While acceptable for many applications, ultra-low-power designs may prefer burst-mode or pulse-skipping topologies to reduce average IQ below 5 µA, trading off transient response for longevity.
What diagnostic features are available through the EN/UVLO and PG pins of the UBA3070T/N1+118 UBA3070 for system health monitoring?
The enable pin provides digital control, while the open-drain power-good (PG) signal asserts high only after output reaches regulation, typically with a ~2% window around setpoint. This allows microcontrollers to detect faults like overvoltage, undervoltage, or thermal shutdown. Monitoring PG enables graceful system recovery or safe shutdown in embedded firmware. Proper pull-up resistor selection (e.g., 10 kΩ) ensures clean logic levels without excessive loading.
How should PCB trace inductance around the SW node be managed when implementing the UBA3070T/N1+118 UBA3070 to minimize ringing and electromagnetic interference?
Minimizing loop area between SW, inductor, and input/output capacitors reduces parasitic inductance, which can cause voltage spikes and EMI. For the UBA3070T/N1+118 UBA3070, keep the high-current path under 5 mm, use wide traces or ground planes for return paths, and place decoupling caps within 2 mm of VIN and GND pins. Adding a small snubber (e.g., 10 Ω + 100 pF) across the switch node further dampens oscillations, improving reliability and compliance.

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Freescale / NXP Semiconductors

UBA3070T/N1+118 UBA3070

Freescale / NXP Semiconductors
32D-UBA3070T/N1+118 UBA3070

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