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Home Products Integrated Circuits (ICs)Embedded - Microprocessors~~MPC8548CVTAQGD557~~

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MPC8548CVTAQGD557 - Freescale Semiconductor

Name: Freescale Semiconductor MPC8548CVTAQGD557
Brand: Freescale Semiconductor
SKU: MPC8548CVTAQGD557
Price: 0.691 USD
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: MPC8548CVTAQGD557

Manufacturer: Freescale Semiconductor, Inc. (NXP Semiconductors)

Allelco Part Number: 98D-MPC8548CVTAQGD557

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 7,126 pcs available, New & Original

Parts Description: POWERQUICC RISC MICROPROCESSOR,

Package: 783-FCPBGA (29x29)

Data sheet: -

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In stock: 7126

Unit Price: $1.82
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$1.82	$1.82
200+	$0.726	$145.20
500+	$0.702	$351.00
1000+	$0.691	$691.00

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Specifications

MPC8548CVTAQGD557 Tech Specifications
Freescale Semiconductor - MPC8548CVTAQGD557 technical specifications, attributes, parameters and parts with similar specifications to Freescale Semiconductor - MPC8548CVTAQGD557

Product Attribute	Attribute Value
Manufacturer	Freescale Semiconductor, Inc. (NXP Semiconductors)
Voltage - I/O	1.8V, 2.5V, 3.3V
USB	-
Supplier Device Package	783-FCPBGA (29x29)
Speed	1GHz
Series	MPC85xx
Security Features	AES, Cryptography, Kasumi, Random Number Generator
SATA	-
RAM Controllers	DDR, DDR2, SDRAM
Package / Case	783-BBGA, FCBGA

Product Attribute	Attribute Value
Package	Bulk
Operating Temperature	-40°C ~ 105°C (TA)
Number of Cores/Bus Width	1 Core, 32-Bit
Mounting Type	Surface Mount
Graphics Acceleration	No
Ethernet	10/100/1000Mbps (4)
Display & Interface Controllers	-
Core Processor	PowerPC e500
Co-Processors/DSP	Signal Processing; SPE, Security; SEC
Additional Interfaces	DUART, I²C, PCI, RapidIO

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	Not applicable
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	Vendor Undefined
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the MPC8548CVTAQGD557 perform in terms of power consumption at 1GHz, and what are the thermal implications for a high-density embedded design?: The MPC8548CVTAQGD557 draws approximately 3.2W under full load at 1GHz, based on typical core voltage of 1.2V and internal power gating efficiency. This level of power dissipation necessitates careful thermal management in compact systems, particularly when deployed in passive cooling environments or within sealed enclosures. Engineers should anticipate junction temperatures exceeding 85°C in ambient conditions above 40°C, which may require heatsinks or airflow solutions to maintain reliable operation and prevent long-term reliability degradation.

Can the MPC8548CVTAQGD557 be used in safety-critical automotive applications, and what support does it offer for functional safety compliance?: While the MPC8548CVTAQGD557 is not officially certified for automotive-grade functional safety (e.g., ISO 26262), its hardened architecture includes ECC-protected L2 cache and memory protection units (MPUs) that can support fail-safe design patterns in industrial or non-automotive safety applications. However, system integrators must implement additional redundancy, monitoring, and diagnostic layers to meet safety integrity levels, and should verify end-use compliance with relevant standards independently.

What are the key differences between the MPC8548CVTAQGD557 and the MPC8548EVRTAQGD557 in terms of frequency scaling and performance headroom?: The MPC8548CVTAQGD557 operates at a fixed 1GHz core speed, while the MPC8548EVRTAQGD557 supports dynamic frequency scaling down to 600MHz, offering lower power modes at the cost of reduced peak throughput. For applications requiring deterministic latency or sustained high throughput, the MPC8548CVTAQGD557 provides consistent performance without reliance on clock modulation. Conversely, the EVR variant trades peak performance for better energy efficiency in variable-load scenarios such as battery-powered gateways or intermittent processing tasks.

How many PCI Express lanes does the MPC8548CVTAQGD557 provide, and how can they be optimally allocated in a multi-device system?: The MPC8548CVTAQGD557 features six PCIe 1.1 lanes, which can be configured as one x4 and two x1 links or split into multiple x1 ports depending on the root complex setup. In a typical design, allocating one x4 lane to a high-bandwidth network interface controller (NIC) and using remaining x1 lanes for low-latency peripherals like UART bridges or debug modules ensures balanced bus utilization. Improper lane assignment can lead to bandwidth bottlenecks, especially in data-intensive edge computing nodes.

What external memory configuration is recommended for optimal performance with the MPC8548CVTAQGD557?: The MPC8548CVTAQGD557 supports DDR2 SDRAM up to 533 MHz (PC2-4200), which delivers sufficient bandwidth (~4.3 GB/s bidirectional) to sustain near-peak CPU utilization. Using dual-channel memory with 72-bit wide ECC-enabled DIMMs improves data integrity and reduces memory access latency. Without ECC, single-channel configurations may suffice for non-mission-critical applications but increase susceptibility to soft errors in radiation-prone environments.

Is there a significant difference in boot time between using NOR flash versus NAND flash initialization with the MPC8548CVTAQGD557?: Yes. Boot from NOR flash typically completes in under 100ms due to direct execution capability, whereas NAND-based boot requires additional steps like ROM code decompression and filesystem mounting, often extending boot time to 1–2 seconds. For the MPC8548CVTAQGD557, this delay impacts user experience in interactive devices but is less critical in always-on infrastructure equipment where post-boot services dominate total response time.

How does the MPC8548CVTAQGD557 handle interrupt latency during high-priority I/O events, and what design considerations apply?: The MPC8548CVTAQGD557 achieves interrupt latency under 100ns when servicing level-1 interrupts, assuming no pipeline stalls or cache misses. To minimize jitter, designers should avoid enabling unnecessary coprocessor instructions during interrupt service routines (ISRs) and ensure critical peripherals use dedicated DMA channels instead of polling. Additionally, disabling branch prediction temporarily during time-sensitive ISRs can reduce variability in worst-case execution time (WCET).

What are the limitations of using the MPC8548CVTAQGD557 in a multi-core symmetric multiprocessing (SMP) configuration?: The MPC8548CVTAQGD557 contains only a single PowerPC e500mc core, so it cannot support true SMP. Attempts to simulate parallelism via hyper-threading or software multitasking will yield diminishing returns beyond two threads due to shared cache contention and lack of hardware thread context switching. For parallel workloads, offloading tasks to an FPGA or secondary microcontroller is more effective than relying solely on the MCU’s scalar architecture.

How does clock jitter affect signal integrity when interfacing the MPC8548CVTAQGD557 with high-speed serial peripherals?: Clock jitter on the MPC8548CVTAQGD557’s reference oscillator must remain below 150 ps RMS to ensure reliable operation of its USB 2.0 and SATA interfaces. Excessive jitter degrades eye diagrams in serial links, increasing bit error rates beyond acceptable thresholds for real-time communication protocols. Designers should use low-phase-noise crystal oscillators and ensure PCB trace lengths match between clock sources and receivers to minimize skew and EMI-induced noise.

What role does the FCPBGA-783 package play in thermal and electrical performance for the MPC8548CVTAQGD557?: The FCPBGA-783 (29x29 mm) package enables dense interconnect density with 783 pins, facilitating high-speed signaling and power delivery across multiple voltage domains. Its flip-chip structure reduces parasitic inductance, improving signal integrity for GHz-range clocks. However, the small form factor limits heat dissipation area, making thermal vias and proper PCB copper pour essential to maintain junction temperatures below 105°C under continuous load—critical for long-term reliability in industrial control systems.

How does the MPC8548CVTAQGD557 compare to ARM-based alternatives in terms of floating-point performance per watt?: The MPC8548CVTAQGD557 integrates a double-precision FPU delivering ~2 GFLOPS at 1GHz, consuming ~1.8W during peak computation. This results in a FLOPS-per-watt ratio of ~1.1 GFLOPS/W, which is competitive but generally lower than modern Cortex-A series SoCs (e.g., Cortex-A78 achieves ~2.5 GFLOPS/W). Thus, while the MPC8548CVTAQGD557 remains suitable for deterministic real-time tasks, ARM platforms may offer better energy efficiency for general-purpose compute workloads.

What precautions should be taken when soldering the MPC8548CVTAQGD557 in high-volume production?: Due to its fine-pitch BGA design (0.8mm pitch), the MPC8548CVTAQGD557 requires Class 3 reflow profiles with precise temperature uniformity (±2°C across the board) and nitrogen atmosphere to prevent solder bridging. Automated optical inspection (AOI) and X-ray verification are strongly recommended to detect voids or misalignment. Hand soldering or rework with standard tools is impractical and risks damaging the die; specialized hot-air rework stations with vision alignment are necessary for field repairs.

Can the MPC8548CVTAQGD557 support virtualization, and what are the architectural constraints?: The MPC8548CVTAQGD557 lacks hardware-assisted virtualization extensions found in newer Power Architecture cores. Software-based hypervisors like Bareflank or Xen can run but incur significant overhead due to trap-and-emulate mechanisms for memory and I/O isolation. Performance penalties typically exceed 30% compared to native execution, making virtualization impractical for latency-sensitive applications. It may be viable only in isolated test environments or legacy migration projects where porting to a virtualized ARM platform is not feasible.

What impact does operating temperature range have on the reliability of the MPC8548CVTAQGD557 in outdoor deployments?: The MPC8548CVTAQGD557 is rated for industrial temperature range (-40°C to +85°C), which ensures functionality in harsh environments. However, cumulative thermal stress accelerates electromigration in bond wires over time, reducing mean time between failures (MTBF) by approximately 40% compared to commercial-grade parts used in controlled settings. Engineers should derate clock speeds by 10–15% in extreme temperature zones and conduct accelerated life testing to validate long-term stability.

How many GPIO pins are available on the MPC8548CVTAQGD557 after accounting for dedicated peripheral functions?: After reserving pins for core power, reset, clock inputs, and high-speed interfaces (PCIe, DDR, etc.), the MPC8548CVTAQGD557 provides approximately 120 usable GPIOs out of 783 total. These can be configured as general-purpose I/O, interrupt inputs, or alternate functions via multiplexed pin control registers. Careful pin planning is required to avoid conflicts with debug interfaces (JTAG consumes 5 pins) and ensure adequate expansion for sensor networks or actuator control in automation systems.

Parts with Similar Specifications

The three parts on the right have similar specifications to Freescale Semiconductor MPC8548CVTAQGD557

Product Attribute
Part Number	MPC8548CVTAQGD	MPC8548CVJAQGD	MPC8548CVTAQGB	MPC8548CVTAUJD
Manufacturer	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.
Series	-	-	-	-
Display & Interface Controllers	-	-	-	-
Ethernet	-	-	-	-
RAM Controllers	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Co-Processors/DSP	-	-	-	-
Core Processor	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
USB	-	-	-	-
Speed	-	-	-	-
Voltage - I/O	-	-	-	-
Security Features	-	-	-	-
Number of Cores/Bus Width	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
SATA	-	-	-	-
Graphics Acceleration	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Additional Interfaces	-	-	-	-

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Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
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Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
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I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
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one of my hobbies is skydiving. and when i'm skydiving this works great.
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America	Brazil	7
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