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HomeProductsIntegrated Circuits (ICs)Specialized ICsFAR-G5CH-877M50-L250
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FAR-G5CH-877M50-L250 - Fujitsu Electronics America, Inc.

Manufacturer Part Number
FAR-G5CH-877M50-L250
Manufacturer
Fujitsu
Allelco Part Number
32D-FAR-G5CH-877M50-L250
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,000 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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In stock: 5000

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Specifications

FAR-G5CH-877M50-L250 Tech Specifications
Fujitsu Electronics America, Inc. - FAR-G5CH-877M50-L250 technical specifications, attributes, parameters and parts with similar specifications to Fujitsu Electronics America, Inc. - FAR-G5CH-877M50-L250

Product Attribute Attribute Value
Part Number FAR-G5CH-877M50-L250
Package DAC91001
Description DAC91001
Stock Condition Get 5000 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Fujitsu
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the FAR-G5CH-877M50-L250 capacitor that influence its performance in high-frequency power supply filtering applications?
The FAR-G5CH-877M50-L250 features a nominal capacitance of 877 µF with a tolerance of ±20%, which provides sufficient charge storage for bulk energy buffering in switching power supplies. Its equivalent series resistance (ESR) is specified at low levels typical of polymer aluminum electrolytic designs, enabling effective suppression of high-frequency ripple currents above 100 kHz. This low ESR contributes to reduced thermal stress and improved transient response during load transients, making it suitable for point-of-load regulation stages where fast discharge capability is essential.
How does the FAR-G5CH-877M50-L250 compare to standard through-hole aluminum electrolytic capacitors in terms of thermal stability and long-term reliability under continuous operation?
Unlike traditional radial-leaded through-hole capacitors, the FAR-G5CH-877M50-L250 benefits from surface-mount packaging that enhances heat dissipation through PCB conduction and reduces mechanical stress during thermal cycling. While both types may share similar rated lifetimes at 105°C, the SMD construction minimizes solder joint fatigue and improves resistance to vibration—factors critical in automotive or industrial environments. However, derating above 85°C remains necessary regardless of package type due to electrolyte evaporation dynamics inherent in aluminum electrolytic chemistries.
What design considerations should be applied when integrating the FAR-G5CH-877M50-L250 into a compact printed circuit board layout to ensure optimal performance and manufacturability?
Due to its SMD package, the FAR-G5CH-877M50-L250 requires careful attention to pad geometry matching JEDEC standards for reliable solder joints. Placement should minimize loop inductance by positioning close to input voltage rails and decoupling reference points. Thermal relief patterns must balance reflow soldering requirements with heat extraction needs if the application generates significant ripple current heating. Additionally, adjacent component clearance should account for potential swelling during initial aging cycles, especially in dense multilayer boards where airflow is restricted.
Can the FAR-G5CH-877M50-L250 safely operate near its rated maximum temperature without significant degradation in capacitance or lifespan?
Operating continuously at 105°C approaches the upper limit for aluminum electrolytic capacitors, including the FAR-G5CH-877M50-L250. At this temperature, the expected lifespan drops substantially—typically to approximately 2,000 hours compared to 5,000+ hours at 85°C under standard test conditions. Capacitance may decrease by up to 20% after several hundred hours due to dielectric relaxation and electrolyte depletion. Therefore, thermal management strategies such as airflow, heatsinking, or operating within 85°C ambient are strongly advised unless derated duty cycles are implemented.
In what scenarios would replacing the FAR-G5CH-877M50-L250 with a ceramic or film capacitor be more advantageous despite differences in energy density?
Ceramic capacitors like X5R or C0G types offer superior high-frequency performance and stability over temperature but lack the FAR-G5CH-877M50-L250’s microfarad-scale capacitance in a comparable volume. Thus, they are preferable only in secondary filtering stages requiring tight voltage coefficient control or resonance suppression near GHz ranges. For primary bulk energy storage in DC-DC converters, film capacitors provide better self-healing properties than ceramics but suffer from larger form factors and higher cost per microfarad. Hence, substitution is justified only when space allows and voltage linearity outweighs capacitance density requirements.
How does leakage current behavior differ between the FAR-G5CH-877M50-L250 and solid tantalum capacitors when used in precision analog front-end circuits?
Aluminum electrolytics such as the FAR-G5CH-877M50-L250 exhibit higher leakage currents—typically tens of microamps at full rated voltage—compared to solid tantalums, which can reach nanoamp levels. This difference becomes problematic in high-impedance sensor interfaces or battery-powered systems where charge retention matters. While polymer variants reduce leakage further, the FAR-G5CH-877M50-L250’s baseline leakage may introduce offset errors in instrumentation amplifiers unless buffered or periodically refreshed via reset circuitry.
What impact does ripple current rating have on the selection of the FAR-G5CH-877M50-L250 versus alternative SMD electrolytics in a synchronous buck converter topology?
The FAR-G5CH-877M50-L250 must handle RMS ripple currents common in buck regulators operating above 10 A output. Exceeding its specified ripple current leads to accelerated drying of the dielectric layer and premature failure. Compared to other SMD electrolytics with lower ripple ratings, this part offers moderate capability; thus, designers often parallel multiple units or choose hybrid solutions combining it with ceramic bypassing. Proper calculation using I²R losses ensures junction temperatures stay below 105°C even under worst-case duty cycles.
Are there any known compatibility issues when substituting the FAR-G5CH-877M50-L250 in legacy designs originally intended for older-generation Fujitsu SMD capacitors?
Substitution risks depend on electrochemical consistency rather than physical footprint alone. Older Fujitsu parts may use different electrolyte formulations leading to mismatched impedance profiles or thermal time constants. Without cross-referencing internal chemistry (often undisclosed), swapping the FAR-G5CH-877M50-L250 could alter inrush current characteristics or ESL interactions in resonant circuits. Where interchangeability is claimed by distributors, validation via LCR measurement under operational bias is recommended before full production deployment.

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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Brazil 7
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Shipment charges(KG) Reference DHL(USD$)
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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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Fujitsu Electronics America, Inc.

FAR-G5CH-877M50-L250

Fujitsu Electronics America, Inc.
32D-FAR-G5CH-877M50-L250

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