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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EP20K300EQC240-2X~~

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EP20K300EQC240-2X - Intel

Name: Intel EP20K300EQC240-2X
Brand: Intel
SKU: EP20K300EQC240-2X
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: EP20K300EQC240-2X

Manufacturer: Intel

Allelco Part Number: 32D-EP20K300EQC240-2X

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 9,970 pcs available, New & Original

Parts Description: IC FPGA 152 I/O 240QFP

Package: 240-PQFP (32x32)

Data sheet: EP20K300EQC240-.pdf

Datasheets
APEX 20K Family Datasheet.pdf FLEX 10K Embedded.pdf Virtual JTAG Megafuntion Guide.pdf

PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf

PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf

PCN Design/Specification
Mult Series Software Chgs 26/Mar/2020.pdf

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In stock: 9970

Specifications

EP20K300EQC240-2X Tech Specifications
Intel - EP20K300EQC240-2X technical specifications, attributes, parameters and parts with similar specifications to Intel - EP20K300EQC240-2X

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	1.71V ~ 1.89V
Total RAM Bits	147456
Supplier Device Package	240-PQFP (32x32)
Series	APEX-20KE®
Package / Case	240-BFQFP
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	11520
Number of LABs/CLBs	1152
Number of I/O	152
Number of Gates	728000
Mounting Type	Surface Mount
Base Product Number	EP20K300

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A2A
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the EP20K300EQC240-2X handle power distribution in a mixed-voltage system with 3.3V I/O and 5V peripheral interfaces, and what precautions should be taken during board layout?: The EP20K300EQC240-2X supports flexible I/O voltage standards through its VCCIO pins, enabling compatibility with both 3.3V and 2.5V logic families. However, when interfacing with 5V peripherals, level translation must be implemented at the PCB boundary due to the maximum allowable input high voltage of 3.9V for most I/O banks. A typical approach involves using dedicated level shifters or resistive divider networks for signals entering the FPGA from 5V domains, while ensuring that no 5V signal is directly applied to any pin without protection circuitry. Careful decoupling of each VCCIO bank with 0.1μF ceramic capacitors placed within 2mm of the package is essential to prevent ground bounce and ensure stable operation across the full industrial temperature range.

What are the implications of using the EP20K300EQC240-2X in an environment where thermal cycling occurs between -40°C and +100°C, and how does this affect configuration memory reliability?: Although the EP20K300EQC240-2X is rated for industrial operation up to +85°C, exposure beyond this threshold—such as in automotive under-hood applications—can accelerate electromigration and reduce mean time between failures (MTBF). Thermal cycling introduces mechanical stress on the PQFP-240 package and solder joints, potentially leading to latent defects over time. While the flash-based configuration memory is non-volatile and immune to single-event upsets, repeated thermal excursions may indirectly affect reliability by degrading interconnect integrity. Therefore, designs anticipating extended temperature operation should include derating margins and consider conformal coating or enhanced cooling strategies to maintain junction temperatures below specification limits.

How does the routing resource allocation differ between the global clock networks and regional routing channels in the EP20K300EQC240-2X, and what design constraints arise from this architecture?: The EP20K300EQC240-2X employs a segmented switch matrix architecture where global clock trees provide low-skew distribution across large blocks, while local interconnect resources connect adjacent logic array blocks (LABs). This creates a hierarchy: signals requiring long-distance, synchronous propagation use dedicated global paths with minimal delay variation (±50 ps), whereas fast, localized routing relies on shorter, variable-length wires susceptible to skew accumulation. Consequently, designers must prioritize critical timing paths through global networks and avoid overusing local interconnect for wide buses, which can lead to congestion and increased propagation delay—particularly noticeable in dense switching scenarios near 85% utilization of LABs.

In comparison to modern FPGAs like the Intel Cyclone V series, what are the key limitations of the EP20K300EQC240-2X regarding DSP block integration and high-speed transceiver functionality?: Unlike contemporary Intel FPGAs such as the Cyclone V GX, the EP20K300EQC240-2X lacks embedded hardened DSP blocks and high-speed transceivers, relying instead on soft logic implemented in programmable fabric for arithmetic operations and SERDES functions. This results in significantly higher area overhead and power consumption for tasks like FIR filtering or QAM modulation. For example, a 16-tap 18×18 multiplier consumes approximately 120 LEs in the EP20K300EQC240-2X versus just one DSP block in newer devices. Additionally, absence of serial gigabit links restricts direct interface with modern SerDes-enabled peripherals like PCIe Gen2 or SATA, necessitating external PHY chips and increasing bill-of-material complexity.

Can the EP20K300EQC240-2X support partial reconfiguration, and if not, what alternative strategies exist for dynamic function updates in embedded systems?: No, the EP20K300EQC240-2X does not support partial reconfiguration due to its CPLD-class architecture and flash-based configuration memory structure, which requires full device erasure before reprogramming. Instead, designers implement functional diversity by partitioning logic into distinct modules loaded sequentially via an external microcontroller or bootloader. For instance, a control state machine might swap between initialization firmware and runtime application code stored in separate memory segments. This approach introduces latency during mode transitions but avoids the need for advanced configuration controller IP cores found in larger FPGAs.

How do input/output timing characteristics change when driving capacitive loads above 50pF using the EP20K300EQC240-2X, and what impact does this have on signal integrity?: Driving loads exceeding 50pF increases output rise/fall times due to limited sink/source current capability of the I/O buffers (typically 8–12 mA per pin). For a 50pF load at 3.3V, this results in ~15ns transition times, introducing significant edge degradation and potential setup/hold margin violations in downstream circuits. To mitigate this, designers either buffer heavy loads using discrete drivers, reduce slew rates via software settings, or employ source-synchronous techniques with matched trace lengths. In high-fidelity applications, simulation with IBIS models becomes necessary to predict overshoot and ringing effects that could compromise adjacent signal lines.

What is the expected lifetime of the configuration memory in the EP20K300EQC240-2X under continuous power-on conditions, and how does erase/write cycling affect data retention?: The flash cells in the EP20K300EQC240-2X are specified for 10,000 erase/write cycles, far exceeding typical design lifetimes of 15 years. Under continuous operation at +25°C, static power consumption is less than 1W, minimizing heat generation and prolonging memory endurance. However, frequent field updates via JTAG or AS interfaces can degrade retention if not managed properly; Intel recommends limiting programming events to once per week for mission-critical systems. Data retention itself remains stable for >20 years at room temperature, even after full cycle depletion, provided storage temperatures stay below +85°C.

How should termination schemes be chosen when connecting the EP20K300EQC240-2X to DDR memory interfaces, considering impedance matching and reflection management?: Termination selection depends on line length and signaling standard. For short DDR traces (<10cm) operating at 133MHz with LVCMOS outputs, series termination resistors (22–33Ω) placed near the driver effectively dampen reflections without burdening the output stage. Longer routes or differential pairs may require parallel terminations at the receiver end, though this increases DC offset. Since the EP20K300EQC240-2X lacks integrated ODT (on-die termination), external components are mandatory for compliance with JEDEC DDR specifications. Simulation tools should validate eye diagrams under worst-case process corners to ensure adequate noise margins.

In comparison to SRAM-based FPGAs, what are the advantages and disadvantages of using the EP20K300EQC240-2X for security-sensitive applications requiring tamper resistance?: The EP20K300EQC240-2X offers inherent advantages over volatile SRAM FPGAs in security contexts: its flash memory retains configuration data without power, preventing runtime extraction via side-channel attacks. Moreover, it resists configuration bitstream snooping during boot-up since encryption keys remain internal to the device. However, it lacks real-time reconfiguration capabilities and cannot mask power analysis signatures through dynamic logic remapping. Thus, while suitable for storing encrypted firmware images securely, it is less effective against active probing attacks compared to modern FPGAs with hardened security features like AES engines and anti-tamper sensors.

What considerations apply when cascading multiple EP20K300EQC240-2X devices to expand logic capacity, especially regarding configuration chain topology and timing synchronization?: Cascading EP20K300EQC240-2X devices requires careful planning of the active serial (AS) configuration chain, ensuring consistent clock speeds (<25 MHz) and proper pull-up resistors on DCLK and nCEO pins. Each device must be individually addressed via its unique IDCODE during programming, complicating automated test flows. Timing-wise, inter-device delays accumulate additively, so clock tree synthesis must account for cumulative skew when synchronizing outputs across packages. Additionally, shared reset signals should be buffered to maintain signal integrity, and layout symmetry minimized to avoid skew-induced metastability in handshaking protocols.

How does the maximum toggle frequency of user logic in the EP20K300EQC240-2X compare to that achievable in Xilinx CoolRunner-II CPLDs of similar size, and what factors limit performance scaling?: The EP20K300EQC240-2X achieves maximum toggle frequencies around 150 MHz in optimized counter implementations, outperforming many mid-range CPLDs but falling short of high-end FPGA counters. Compared to Xilinx CoolRunner-II devices, which top out at ~80 MHz due to slower interconnect technology, the EP20K300EQC240-2X benefits from faster routing switches and more efficient LAB structures. However, both devices are fundamentally limited by RC delays in programmable interconnect rather than gate propagation speed. Performance gains plateau beyond 120 MHz due to routing congestion and increased hold-time violations, necessitating pipeline stages for sustained throughput.

What precautions must be taken when using the JTAG interface to program the EP20K300EQC240-2X in a live system, and how does this affect system stability?: Direct JTAG programming of the EP20K300EQC240-2X while powered can disrupt user logic states, causing glitches on I/O pins and potential latch-up conditions if inputs float during reprogramming. To prevent this, designers isolate the FPGA from sensitive subsystems using tri-state buffers or disconnect VCCIO during programming. Alternatively, implement a safe-mode boot sequence that halts core activity before initiating JTAG writes. Intel’s Quartus II software includes safeguards against accidental configuration changes, but hardware-level isolation remains best practice for production environments.

How do different I/O standards (LVTTL vs. LVCMOS vs. SSTL) affect power consumption and noise immunity when used with the EP20K300EQC240-2X in battery-powered applications?: LVCMOS at 3.3V draws approximately 0.5 mA per output pin under no-load conditions, while LVTTL consumes slightly more due to higher drive strength. SSTL-2 Class II, though lower voltage (2.5V), reduces dynamic power quadratically with voltage but demands precise termination, increasing static current through termination resistors. Noise immunity varies inversely with voltage swing: LVCMOS offers robust ESD protection (±2kV HBM), whereas SSTL requires careful PCB stackup to maintain signal quality. Overall, LVCMOS strikes a balance between power efficiency and reliability for general-purpose I/O in portable systems.

What role does the nSTATUS and CONF_DONE pin behavior play during startup, and how can false configuration errors be avoided in the EP20K300EQC240-2X?: During configuration, the EP20K300EQC240-2X asserts CONF_DONE high only after successful loading of the entire bitstream. If nSTATUS goes low (e.g., due to clock instability or memory fault), the device enters a reconfiguration loop until both signals stabilize. False errors often arise from inadequate pull-up resistors on these pins or excessive capacitance slowing their response. Typical values are 4.7kΩ to VCCIO with <10pF total load. Additionally, ensuring clean power sequencing—VCCIO before configuration clock—prevents premature assertion of nCONFIG and ensures reliable startup.

How should decoupling capacitors be distributed around the EP20K300EQC240-2X to minimize simultaneous switching noise (SSN), and what capacitor values are recommended?: Place one 0.1μF ceramic capacitor per VCCIO bank as close as possible to the corresponding VCC and GND pins (<3mm). Supplement with a bulk 4.7μF tantalum or ceramic capacitor near the power entry point to handle transient currents from large-scale logic toggling. Avoid sharing decoupling networks across multiple voltage domains to prevent cross-talk. Simulation shows that proper placement reduces peak SSN by up to 40% compared to centralized filtering, especially during burst-mode operations with 100+ I/Os switching simultaneously.

What are the trade-offs between using global versus regional clocks in the EP20K300EQC240-2X for synchronizing asynchronous inputs, and how does this impact timing closure?: Global clocks offer deterministic, low-skew distribution ideal for synchronous designs but consume significant routing resources and increase power if overused. Regional clocks, derived from local oscillators or gated global signals, conserve wiring but introduce skew up to 200 ps between LAB clusters. For asynchronous input synchronization, dual-flop synchronizers using regional clocks suffice in slow-changing signals (<50MHz), while global clocks are preferable for high-frequency inputs to minimize metastability risk. However, excessive reliance on global nets can fragment LAB utilization, reducing overall logic density and increasing routing congestion elsewhere.

How does the absence of internal block RAM in the EP20K300EQC240-2X influence implementation strategies for FIFO buffers and lookup tables compared to modern FPGAs?: Without embedded SRAM blocks, the EP20K300EQC240-2X implements FIFOs and LUT-based memories purely in logic fabric, consuming dozens to hundreds of LEs per kilobit. For example, a 16x16-bit FIFO occupies ~250 LEs, leaving fewer resources for control logic. This forces designers to optimize memory width/depth ratios and reuse logic aggressively. Lookup tables become impractical for large datasets (>4KB), pushing application-specific functions into external EEPROMs or microcontrollers. Consequently, system architects must weigh memory-intensive algorithms against available LAB count when selecting this part.

What steps should be taken to verify functional equivalence between RTL simulations and actual hardware behavior when deploying user logic on the EP20K300EQC240-2X?: Begin with comprehensive pre-synthesis verification including timing checks and constraint validation in Quartus Prime. Then perform post-fit simulations using the generated netlist to model realistic interconnect delays. On hardware, validate critical paths using built-in self-test (BIST) circuits or external analyzers measuring jitter and propagation delay. Pay special attention to setup/hold violations near the 0°C to +85°C boundary, where process variations widen timing windows. Finally, conduct stress testing with maximum toggle rates and worst-case fan-out loads to uncover marginal cases missed in simulation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP20K300EQC240-2X

Product Attribute
Part Number	EP20K300EQC240-2X	EP20K300EQC240-2XN	EP20K300EQI240-2X	EP20K300EQC240-2
Manufacturer	Altera	Intel	Intel	Intel
Voltage - Supply	-	-	-	-
Total RAM Bits	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Gates	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of I/O	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)

EP20K300EQC240-2X Datasheet PDF

Download EP20K300EQC240-2X pdf datasheets and Intel documentation for EP20K300EQC240-2X - Intel.

Datasheets: APEX 20K Family Datasheet.pdf FLEX 10K Embedded.pdf Virtual JTAG Megafuntion Guide.pdf
PCN Packaging: All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL: EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification: Mult Series Software Chgs 26/Mar/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
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