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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EP4CGX22CF19C7N~~

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EP4CGX22CF19C7N - Intel

Name: Intel EP4CGX22CF19C7N
Brand: Intel
SKU: EP4CGX22CF19C7N
Price: 10.84 USD
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: EP4CGX22CF19C7N

Manufacturer: Intel

Allelco Part Number: 32D-EP4CGX22CF19C7N

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 16,512 pcs available, New & Original

Parts Description: IC FPGA 150 I/O 324FBGA

Package: 324-FBGA (19x19)

Data sheet: EP4CGX22CF19C7N.pdf

Datasheets
Cyclone IV Device Datasheet.pdf Cyclone IV Device Handbook.pdf Virtual JTAG Megafuntion Guide.pdf

Errata
2.73KHz.pdf

RoHs Status: RoHS Compliant

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In stock: 16512

Unit Price: $29.58
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$29.58	$29.58
200+	$11.45	$2,290.00
500+	$11.04	$5,520.00
1000+	$10.84	$10,840.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

EP4CGX22CF19C7N Tech Specifications
Intel - EP4CGX22CF19C7N technical specifications, attributes, parameters and parts with similar specifications to Intel - EP4CGX22CF19C7N

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	1.16V ~ 1.24V
Total RAM Bits	774144
Supplier Device Package	324-FBGA (19x19)
Series	Cyclone® IV GX
Package / Case	324-LBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	21280
Number of LABs/CLBs	1330
Number of I/O	150
Mounting Type	Surface Mount
Base Product Number	EP4CGX22

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

EP4CGX22CF19C7N (1)

Manufacturer Part Number

EP4CGX22CF19C7N

Manufacturer

Intel

Introduction

Cyclone IV GX FPGA for high-volume, cost-sensitive applications

Product Features and Performance

1330 logic array blocks

21280 logic elements/cells

774144 total RAM bits

150 general-purpose I/O pins

16V to 1.24V core voltage supply

Surface mount 324-LBGA package

Operating temperature range from 0°C to 85°C

Product Advantages

Low power consumption

High integration for reduced board space

Advanced interface capabilities

Key Technical Parameters

Logic Array Blocks/CLBs: 1330

Logic Elements/Cells: 21280

Total RAM Bits: 774144

Number of I/O: 150

Voltage Supply: 1.16V ~ 1.24V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Compliance with international standards

Rigorous testing and validation

Compatibility

Compatible with various design software

Standard surface mount technology

Application Areas

Consumer electronics

Industrial automation

Communication infrastructure

Automotive applications

Product Lifecycle

Currently active product

Not nearing discontinuation

Future replacements or upgrades available

Several Key Reasons to Choose This Product

Intel's reliability and support

Low cost for high-volume applications

Balance of power and performance for diverse applications

Extensive documentation and developer resources

Long-term availability and lifecycle support

Frequently Asked Questions(FAQ)

What are the key power and thermal design considerations when implementing EP4CGX22CF19C7N in a high-density digital system, and how does its 324-FBGA package influence board-level reliability?: The EP4CGX22CF19C7N operates at a core voltage of 1.16V to 1.24V, which necessitates careful power delivery network (PDN) design to minimize IR drop and noise coupling. Given its 774,144 total RAM bits and 21,280 logic elements, dynamic power consumption can reach several watts under full utilization, requiring adequate decoupling capacitance and thermal vias beneath the 324-FBGA package. The 19x19 mm footprint increases junction-to-ambient thermal resistance compared to smaller packages, making heat spreading through PCB layers or heatsinks essential for sustained operation within the 0°C to 85°C junction temperature range.

How should signal integrity be addressed when routing high-speed interfaces on a PCB populated with EP4CGX22CF19C7N, particularly given its 150 I/O configuration and surface-mount mounting type?: With 150 general-purpose I/O pins, the EP4CGX22CF19C7N supports various high-speed protocols such as LVDS, LVPECL, and SERDES at up to 622 Mbps per channel. Controlled impedance routing, proper termination, and length matching are critical to maintain timing margins. The surface-mount FBGA layout demands strict adherence to layer stack-up symmetry and via stub minimization to preserve signal quality across the entire pinout.

In what scenarios would choosing EP4CGX22CF19C7N over a higher-density FPGA like EP4CE115F29C7N make sense from a cost and performance trade-off perspective?: Selecting EP4CGX22CF19C7N may be justified when design requirements do not exceed 21,280 logic elements or 774,144 RAM bits, as it avoids over-provisioning resources and associated licensing overhead. Its Cyclone IV GX architecture offers sufficient DSP blocks and transceivers for moderate bandwidth applications, while consuming less power than larger FPGAs, resulting in lower system-level BOM cost and simplified thermal management.

What impact does the Moisture Sensitivity Level 3 (MSL 3) designation have on manufacturing and handling procedures for boards using EP4CGX22CF19C7N?: As an MSL 3 component, EP4CGX22CF19C7N must be stored in dry packaging and handled under controlled humidity conditions prior to soldering. After removal from moisture-barrier bags, it has a maximum floor life of 168 hours at 30°C/60% RH before baking is required, preventing popcorning during reflow. This requirement influences inventory logistics and production scheduling to avoid yield loss due to delamination.

How does the base product number EP4CGX22 inform compatibility and migration paths for existing designs using earlier variants like EP4CGX75CF19C7N?: The EP4CGX22 shares architectural lineage with higher-density EP4CGX75 models but with reduced logic capacity, enabling scalable design reuse. While pin-compatible in many cases, engineers must verify that resource utilization—especially Block RAM and DSP slices—fits within the 22’s constraints without exceeding available LABs (1,330) or logic cells (21,280). Migration typically involves synthesis optimization and constraint relaxation rather than major RTL changes.

What are the implications of operating EP4CGX22CF19C7N near its maximum junction temperature of 85°C in industrial control environments?: Continuous operation close to 85°C reduces the margin for transient thermal events and accelerates electromigration in aluminum interconnects. In such cases, derating strategies—such as reducing clock speeds, lowering switching activity, or improving airflow—are necessary to extend device lifetime. Monitoring die temperature via built-in sensors or external thermistors can enable adaptive throttling in safety-critical systems.

Can EP4CGX22CF19C7N support PCIe Gen2 or similar high-speed serial protocols reliably, and what design precautions are needed?: Yes, EP4CGX22CF19C7N includes hardened transceivers capable of supporting PCIe Gen2 (5 GT/s), provided proper reference clock integrity and equalization settings are implemented in the transceiver PHY. Designers must ensure compliance with eye diagram masks, maintain consistent trace lengths between transmitter and receiver, and validate signal integrity with pre-layout simulation tools due to the sensitivity of gigabit-class signaling.

How does the absence of verified status in the Digi-Electronics program affect procurement risk assessment for EP4CGX22CF19C7N?: An unverified distributor listing introduces uncertainty regarding authenticity and supply continuity. Without formal verification, there is elevated risk of counterfeit parts, potentially leading to early failure or non-compliance with reliability standards. Engineers should prioritize authorized channels or implement incoming inspection protocols such as X-ray or electrical test to mitigate these risks.

What role do the 1330 LABs play in determining timing closure complexity for complex state machines implemented in EP4CGX22CF19C7N?: Each Logic Array Block (LAB) contains multiple Adaptive Logic Modules (ALMs), and efficient mapping of combinatorial logic into LABs minimizes routing congestion. For designs exceeding 15–20% LAB utilization, placement-driven optimization becomes crucial. Poor LAB distribution can increase fan-out delays and complicate timing closure, especially when targeting tight clock constraints typical in synchronous systems.

Are there any known limitations in using EP4CGX22CF19C7N for cryptographic acceleration compared to dedicated security FPGAs?: While EP4CGX22CF19C7N can implement AES or SHA engines in soft IP, it lacks hardware acceleration blocks found in Stratix or Arria families, resulting in higher latency and resource overhead. Its suitability depends on throughput requirements; for example, real-time encryption at 1 Gbps may require significant portion of logic cells, limiting availability for other functions.

How should ESD protection be integrated when interfacing EP4CGX22CF19C7N with external connectors or long cables?: Although the FPGA itself provides some ESD protection diodes, external signals often require additional transient voltage suppression (TVS) devices at connector entry points. Clamping voltages below the absolute maximum ratings of individual I/O banks prevent latch-up or gate oxide breakdown, particularly important given the narrow 1.16–1.24V supply window.

What considerations apply when cascading multiple EP4CGX22CF19C7N devices in a multi-FPGA system?: Inter-device communication via user-defined I/O requires careful synchronization across clock domains and signal skew management. Since each device consumes significant power and generates heat, shared power rails must be robustly decoupled, and thermal gradients avoided. Daisy-chaining configurations may also impose routing challenges due to limited high-speed I/O availability.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP4CGX22CF19C7N

Product Attribute
Part Number	EP4CGX22CF19C6N	EP4CGX22CF19C7	EP4CGX22CF19C8N	EP4CGX22CF19I7N
Manufacturer	Intel	Intel	Intel	Intel
Number of Logic Elements/Cells	-	-	-	-
Total RAM Bits	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - Supply	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of I/O	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

EP4CGX22CF19C7N Datasheet PDF

Download EP4CGX22CF19C7N pdf datasheets and Intel documentation for EP4CGX22CF19C7N - Intel.

Datasheets: Cyclone IV Device Datasheet.pdf Cyclone IV Device Handbook.pdf Virtual JTAG Megafuntion Guide.pdf
Errata: 2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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