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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EPF10K70RC240-3N~~

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EPF10K70RC240-3N - Intel

Name: Intel EPF10K70RC240-3N
Brand: Intel
SKU: EPF10K70RC240-3N
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: EPF10K70RC240-3N

Manufacturer: Intel

Allelco Part Number: 32D-EPF10K70RC240-3N

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,060 pcs available, New & Original

Parts Description: IC FPGA 189 I/O 240RQFP

Package: 240-RQFP (32x32)

Data sheet: EPF10K70RC240-3.pdf

Datasheets
FLEX 10K.pdf

PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf

PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf

PCN Design/Specification
Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf

PCN Other
Software Disc 06/Nov/2020.pdf

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In stock: 4060

Specifications

EPF10K70RC240-3N Tech Specifications
Intel - EPF10K70RC240-3N technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF10K70RC240-3N

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	4.75V ~ 5.25V
Total RAM Bits	18432
Supplier Device Package	240-RQFP (32x32)
Series	FLEX-10K®
Package / Case	240-BFQFP Exposed Pad
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 70°C (TA)
Number of Logic Elements/Cells	3744
Number of LABs/CLBs	468
Number of I/O	189
Number of Gates	118000
Mounting Type	Surface Mount
Base Product Number	EPF10K70

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A2A
HTSUS	8542.39.0001

Parts Introduction

EPF10K70RC240-3N (1)

Manufacturer Part Number

EPF10K70RC240-3N

Manufacturer

Intel

Introduction

The EPF10K70RC240-3N is an FPGA from Intel's FLEX-10K series.

Product Features and Performance

High-density programmable logic

468 Logic Array Blocks (LABs)

3744 Logic Elements/Cells

18432 Total RAM bits

Support for 189 I/O pins

Embedded array for implementing complex logic functions

Product Advantages

Sufficient logic resources for intermediate complexity projects

Flexible for various applications due to numerous I/Os

Supports system-level integration

Key Technical Parameters

Embedded FPGAs (Field Programmable Gate Array)

118000 Number of Gates

Voltage Supply Range: 4.75V to 5.25V

Operating Temperature Range: 0°C to 70°C

Quality and Safety Features

Surface mount technology for secure PCB attachment

Tested for operation across specified temperature range for reliability

Compatibility

Compatibility with 240-RQFP (32x32) Supplier Device Package

Interoperability with other components in the same voltage supply range

Application Areas

Industrial control systems

Communications infrastructure

Complex digital signal processing

Product Lifecycle

Obsolete

Check with Intel for potential replacements or upgrades

Several Key Reasons to Choose This Product

Produced by Intel, a trusted name in semiconductor manufacturing

Designed for performance and flexibility to meet diverse requirements

Wide operating temperature range suitable for various environments

Substantial logic resources for robust digital system design

With the FLEX-10K series legacy, offers mature and tested technology for reliable operation

Frequently Asked Questions(FAQ)

How does the EPF10K70RC240-3N compare to other FLEX-10K series FPGAs in terms of logic capacity and I/O availability for a 189-pin design?: The EPF10K70RC240-3N offers 3,744 logic elements across 468 LABs, supporting approximately 118,000 equivalent gates, with exactly 189 user-configurable I/O pins. Among FLEX-10K devices, it represents a mid-to-high density option within the family, balancing moderate gate count with high I/O flexibility. Lower-density variants such as the EPF10K10 or EPF10K30 provide fewer logic resources but may offer reduced power consumption or smaller footprints. For applications requiring full utilization of the 240-RQFP package’s pin count without external expansion, the EPF10K70RC240-3N provides sufficient logic fabric to map complex state machines and moderate parallel data paths directly on-chip.

What operating conditions require special attention when integrating the EPF10K70RC240-3N into a system?: The EPF10K70RC240-3N has a specified operating temperature range of 0°C to 70°C, which limits its use to industrial or controlled ambient environments. Systems deployed in automotive, outdoor, or high-heat environments may exceed this threshold, necessitating thermal management such as airflow control, heatsinking, or enclosure cooling. Additionally, while the part supports standard 5V CMOS-compatible I/O voltages, careful attention must be paid to signal integrity due to limited slew-rate control compared to modern LVCMOS standards. This can impact EMI performance in high-speed interfaces unless termination schemes are implemented.

Can the EPF10K70RC240-3N be used in safety-critical systems requiring certification?: The EPF10K70RC240-3N does not carry any formal safety or functional qualification (such as ISO 26262 or IEC 61508) from Intel, and its architecture predates modern hardened memory and error-detection features found in newer FPGA families. While it can support non-certified control logic through redundant coding and watchdog timers, deploying it in safety-critical infrastructure—especially where failure modes could endanger personnel or equipment—requires extensive validation beyond typical datasheet specifications. Designers should evaluate whether alternative components with certified architectures or higher fault tolerance better meet reliability mandates.

What impact does the Moisture Sensitivity Level (MSL) of 3 have on storage and handling of the EPF10K70RC240-3N?: With an MSL rating of 3, the EPF10K70RC240-3N must be stored in moisture-barrier packaging below 60°C and 60% relative humidity, and must not remain unopened beyond 168 hours after opening. If exceeded, the part must undergo reflow bake prior to soldering to prevent delamination or popcorning during thermal cycling. In high-volume manufacturing, this imposes scheduling constraints and increases logistics complexity compared to lower-MSL parts. For prototype builds, improper handling—such as leaving the component exposed overnight in humid labs—can compromise long-term reliability even if visual inspection appears normal.

How much RAM is available on-chip in the EPF10K70RC240-3N, and how should it be allocated for common data buffering tasks?: The EPF10K70RC240-3N contains 18,432 bits of embedded RAM, organized as distributed block RAM across the LAB structure. This equates to roughly 2.3 kilobytes, sufficient for small lookup tables, FIFO buffers up to about 64 bits wide by 292 deep, or multiple narrow counters. For streaming applications like UART packet buffering or simple FIR filters, this resource allows modest depth without external SRAM. However, large frame buffers or deep pipelines will require off-chip memory, increasing interface complexity and latency. Designers should reserve at least 20–30% of available RAM for configuration shadowing or test logic to avoid runtime reconfiguration conflicts.

Is the EPF10K70RC240-3N suitable for implementing synchronous communication protocols like SPI or I²C with tight timing requirements?: Yes, the EPF10K70RC240-3N can implement standard synchronous protocols such as SPI and I²C using its general-purpose I/O and programmable routing. However, unlike modern FPGA families with dedicated SERDES or clock management tiles, timing closure relies solely on internal routing delays and user-defined constraints. At 5V operation, propagation delays become significant above 1 MHz, limiting reliable speeds to under 500 kHz unless layout optimization is performed. For robust multi-device systems, adding external pull-ups and ensuring matched trace lengths improves signal quality, but the absence of differential I/O further restricts noise immunity in electrically noisy environments.

How does power consumption scale with configuration complexity on the EPF10K70RC240-3N?: Power draw correlates strongly with dynamic switching activity rather than static leakage, which is relatively low for this CMOS process node. Typical quiescent current ranges from 50 mA to 120 mA at 5V supply, depending on I/O loading and internal toggle rates. A fully utilized design with frequent register transitions and bidirectional bus traffic may approach 150 mA. Designers can reduce consumption by minimizing unused LAB enablement, disabling global clocks to idle regions, and using tri-state outputs instead of constant toggling. Note that the 0°C–70°C operating range implies no derating for extended ambient exposure; sustained high-load operation near 70°C may accelerate aging despite nominal compliance.

Should the exposed pad on the 240-RQFP package be connected to ground or left floating for the EPF10K70RC240-3N?: The exposed thermal pad on the EPF10K70RC240-3N should typically be tied to the main ground plane to improve heat dissipation and stabilize reference potential. However, since this device lacks internal ESD diodes to VCC on the pad, direct connection to the positive supply rail risks latch-up if voltage transients exceed absolute maximum ratings. Best practice is to connect the pad only to system GND via a star point or local bypass network, avoiding daisy-chained connections that could introduce ground loops. In high-vibration environments, mechanical stress relief through proper solder fillet geometry around the pad also enhances long-term solder joint integrity.

What tools and IP are required to develop a functional design targeting the EPF10K70RC240-3N?: Development requires Intel's legacy Quartus II software (versions up to 13.x are most compatible), along with the MAX+PLUS II compiler for earlier workflows. No third-party synthesis or place-and-route tools are officially supported, limiting integration into automated CI/CD pipelines. Core IP libraries include basic serializers/deserializers, PLL emulation blocks, and legacy PCI interface modules, but advanced DSP functions like multiply-accumulate chains must be implemented manually using LUT-based arithmetic. Timing analysis must rely on static timing reports rather than predictive models due to lack of updated process corners, making sign-off more conservative than contemporary designs.

How does the gate count of the EPF10K70RC240-3N influence partitioning decisions in mixed-signal systems?: At 118,000 equivalent gates, the EPF10K70RC240-3N can host substantial combinational logic, finite-state machines, and moderate datapaths, but not complex algorithms requiring hundreds of thousands of gates. In mixed-signal contexts—such as ADC/DAC interfacing—it often handles protocol translation (e.g., parallel-to-SPI) and digital filtering, while analog frontends operate independently. Over-partitioning logic onto the FPGA increases crosstalk susceptibility due to shared substrate noise, especially near analog circuits. Careful physical placement and guard rings around sensitive blocks mitigate this, but exceeding 60–70% logic utilization reduces margin for future revisions and complicates timing convergence.

Can the EPF10K70RC240-3N support hot-swapping or live insertion in a powered backplane application?: Hot-swapping is possible only under strict conditions: all I/O must be configured as inputs during initial power-on, and output drivers disabled until stable power and configuration complete. Without built-in hot-swap controllers or slew-rate-limited outputs, inrush currents during insertion can disrupt neighboring cards or corrupt shared buses. The 5V supply tolerance (±5%) accommodates minor rail droop, but simultaneous activation of multiple outputs without series resistance risks overcurrent damage. Most importantly, configuration via EPCS or JTAG must finish before enabling logic, requiring firmware coordination. Thus, while technically feasible, hot-plug robustness demands external circuitry like polyfuses and clamp diodes.

Why might someone choose the EPF10K70RC240-3N over a CPLD for glue logic implementation?: The EPF10K70RC240-3N offers significantly greater logic density and RAM resources compared to comparable CPLDs, allowing it to replace both glue logic and small controller functions in one device. For example, a CPLD might handle address decoding and reset sequencing, while the FPGA manages UART parsing and status reporting—all within the same package. This reduces board real estate, simplifies PCB layer stackup, and enables unified debugging. However, the trade-off is longer compile times, less predictable timing, and higher power consumption. The choice hinges on whether system complexity justifies FPGA overhead versus CPLD simplicity.

What precautions apply when cascading multiple EPF10K70RC240-3N devices in a multi-FPGA system?: Cascading introduces challenges in clock distribution, configuration synchronization, and inter-device communication bandwidth. Since the EPF10K70RC240-3N lacks dedicated high-speed links or time-stamp units, point-to-point protocols like custom handshaking over GPIO dominate, resulting in low throughput (<10 Mbps effective). Clock skew between devices must be kept under 5 ns to avoid metastability in handshake lines, demanding matched trace lengths and low-jitter sources. Configuration must occur sequentially unless external master flash supports daisy-chaining, which adds pin count. Thermal coupling in dense layouts further complicates reliability, as one device’s self-heating affects neighbors.

How does the voltage tolerance of the EPF10K70RC240-3N affect compatibility with 3.3V microcontroller interfaces?: The EPF10K70RC240-3N accepts 5V-tolerant inputs on most I/O banks, meaning 3.3V signals from microcontrollers can drive these pins directly without level shifters. However, driving 5V levels into a 3.3V MCU violates absolute maximum ratings and risks permanent damage. Therefore, bidirectional lines must use open-drain topologies with external pull-ups set to 3.3V, or employ dedicated transceiver ICs. Unused FPGA outputs should default to high-impedance to prevent contention. This asymmetry means designers cannot assume full 5V/3.3V interoperability without additional buffering, increasing bill-of-materials cost.

What role does the Base Product Number EPF10K70 play in selecting alternative parts?: The EPF10K70 denotes a specific instantiation within the FLEX-10K family sharing core architecture, pinout, and package compatibility. When seeking alternatives, matching the base number ensures drop-in replacement for basic functionality, though speed grades (-1, -2, -3) differ in propagation delay and power. For instance, the EPF10K70RC240-3N operates at 166.7 MHz typical, while the -2 grade runs faster but consumes more power. Suppliers may offer functionally equivalent EPF10K70 variants with enhanced I/O standards or extended temperature ranges, but always verify package, pinout, and configuration method alignment before substituting.

Are there any known limitations in routing congestion for designs exceeding 50% LAB utilization on the EPF10K70RC240-3N?: Routing congestion escalates nonlinearly beyond 50% utilization due to increased interconnect demand and limited metal layers (typically 4–5 for this process). Designs pushing past 60% often experience hold-time violations or failed timing closure unless aggressive floorplanning is applied, such as grouping related logic clusters and assigning dedicated routing channels. Global signals like clocks and resets consume disproportionate resources, further constraining local nets. In such cases, incremental compilation or manual assignment of critical paths yields better results than letting the toolchain optimize blindly. Prototyping on actual hardware remains essential, as simulation underestimates real-world coupling effects.

How should configuration memory security be handled for the EPF10K70RC240-3N in unattended deployments?: The EPF10K70RC240-3N uses volatile configuration memory accessed via external flash (EPCS) or JTAG. Without built-in AES encryption or bitstream authentication, malicious actors could extract or modify the design by reading flash contents or probing JTAG during debug. To mitigate, store configuration flash externally and disable JTAG post-deployment using fuses or configuration pins. Obfuscation techniques like scrambling or partial reconfiguration add marginal protection but are easily reversed. For high-security applications, consider migrating to non-volatile FPGA families with integrated security engines, as the FLEX-10K architecture offers minimal anti-tamper safeguards.

What is the significance of the HTSUS code 8542.39.0001 for procurement and import considerations involving the EPF10K70RC240-3N?: The Harmonized Tariff Schedule of the United States (HTSUS) classification 8542.39.0001 identifies the EPF10K70RC240-3N as an active semiconductor device (excluding processors), subject to specific duty rates under U.S. trade policy. Importers must declare this code to customs authorities, and recent regulatory shifts (e.g., export controls on advanced semiconductors) may trigger additional scrutiny or licensing requirements, even for older technologies. While the ECCN 3A001A2A suggests controlled status, enforcement varies. Procurement teams should verify current classifications with legal counsel, especially when sourcing from secondary markets or gray-channel suppliers lacking documentation trails.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF10K70RC240-3N

Product Attribute
Part Number	EPF10K70RC240-3	EPF10K70RC240-2N	EPF10K70RC240-3GZ	EPF10K70RC240-4N
Manufacturer	Intel	Intel	Intel	Intel
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Total RAM Bits	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Gates	-	-	-	-
Number of I/O	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of Logic Elements/Cells	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of LABs/CLBs	-	-	-	-
Voltage - Supply	-	-	-	-

EPF10K70RC240-3N Datasheet PDF

Download EPF10K70RC240-3N pdf datasheets and Intel documentation for EPF10K70RC240-3N - Intel.

Datasheets: FLEX 10K.pdf
PCN Packaging: All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL: EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification: Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf
PCN Other: Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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