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HomeProductsIntegrated Circuits (ICs)Embedded - CPLDs (Complex Programmable Logic Devices)EPM570T144C3N
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EPM570T144C3N - Intel

Manufacturer Part Number
EPM570T144C3N
Manufacturer
Intel
Allelco Part Number
32D-EPM570T144C3N
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,605 pcs available, New & Original
Parts Description
IC CPLD 440MC 5.4NS 144TQFP
Package
144-TQFP (20x20)
Data sheet
EPM570T144C3N.pdf

PCN Design/Specification

Quartus SW/Web Chgs 23/Sep/2021.pdf
RoHs Status
RoHS Compliant
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In stock: 11605

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Specifications

EPM570T144C3N Tech Specifications
Intel - EPM570T144C3N technical specifications, attributes, parameters and parts with similar specifications to Intel - EPM570T144C3N

Product Attribute Attribute Value
Manufacturer Intel
Voltage Supply - Internal 2.5V, 3.3V
Supplier Device Package 144-TQFP (20x20)
Series MAX® II
Programmable Type In System Programmable
Package / Case 144-LQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Macrocells 440
Number of Logic Elements/Blocks 570
Number of I/O 116
Mounting Type Surface Mount
Delay Time tpd(1) Max 5.4 ns
Base Product Number EPM570

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EPM570T144C3N Image
EPM570T144C3N (1)

Manufacturer Part Number

EPM570T144C3N

Manufacturer

Intel

Introduction

Intel EPM570T144C3N is a CPLD from the MAX II series designed for embedded applications requiring programmable logic.

Product Features and Performance

In-system programmability

570 logic elements and 440 macrocells for complex designs

Support for 116 I/O pins

Fast propagation delay of 5.4 ns maximum

Offers multiple power supply options, including 2.5V and 3.3V

Sturdy surface mount 144-LQFP package

Operating temperature range from 0°C to 85°C

Product Advantages

High integration capability for complex designs

Flexible programming options

Low power consumption for energy-efficient operations

Ideal for rapid prototyping and production

Supported by Intel's advanced development software

Key Technical Parameters

Delay Time tpd(1) Max: 5.4 ns

Voltage Supply Internal: 2.5V, 3.3V

Number of Logic Elements/Blocks: 570

Number of Macrocells: 440

Number of I/O: 116

Operating Temperature Range: 0°C ~ 85°C (TJ)

Quality and Safety Features

Robust construction suitable for industrial applications

Extensive quality control and testing by Intel

Compatibility

Compatible with Intel's development software

Can be used across multiple designs due to its reprogrammable nature

Application Areas

Industrial controls

Automotive systems

Communication devices

Consumer electronics

Medical instruments

Product Lifecycle

Currently active product

Long-term availability supported by Intel

Check for updates on potential discontinuation or replacements

Several Key Reasons to Choose This Product

Made by Intel, a leader in semiconductor technology

Offers a high level of integration reducing the need for additional components

Fast propagation delay ensures high-speed logic operations

Suitable for a wide range of operating environments with its broad temperature range

Versatility through in-system programmability and reconfigurability

Scalable solution with the potential for future design upgrades or modifications

Frequently Asked Questions(FAQ)

How does the propagation delay of the EPM570T144C3N compare to other CPLDs in the MAX II family when driving high-speed digital signals?
The EPM570T144C3N exhibits a maximum propagation delay of 5.4 nanoseconds, which is among the lowest available in the MAX II series and enables reliable operation in time-critical logic paths. This performance is suitable for applications requiring sub-6 ns signal transitions, such as memory interfaces or clock distribution networks. Compared to larger devices in the same family like the EPM7128S, this device offers better timing predictability due to its compact architecture and optimized interconnect structure.
What are the key considerations when selecting the EPM570T144C3N for a mixed-voltage system operating at both 2.5V and 3.3V?
The EPM570T144C3N supports dual supply voltages internally at 2.5V and 3.3V, allowing flexible interfacing between legacy and modern digital systems. When integrating into a mixed-voltage environment, designers must ensure that all I/O banks are configured appropriately using the dedicated voltage select pins. Misconfiguration can lead to latch-up or degraded noise margins. Additionally, power sequencing must be managed carefully to prevent reverse current flow during startup.
Can the EPM570T144C3N be used in place of an FPGA for low-complexity control logic, and what are the trade-offs?
Yes, the EPM570T144C3N can replace small FPGAs in applications with fewer than 600 logic elements and moderate I/O requirements, such as glue logic or state machine implementations. Compared to FPGAs, it consumes less static power, generates less heat, and offers faster startup times—critical for battery-powered or thermally constrained designs. However, it lacks the scalability and advanced routing resources of FPGAs, making it unsuitable for complex algorithms or high fan-out logic trees.
How does the number of macrocells (440) in the EPM570T144C3N influence its suitability for implementing finite state machines (FSMs)?
With 440 macrocells, the EPM570T144C3N provides sufficient granularity to implement moderately complex finite state machines with up to several hundred states, assuming efficient coding practices and minimal combinatorial logic overhead. Each macrocell typically contains a programmable AND array, OR array, and flip-flop, enabling both sequential and combinational logic functions. For FSMs exceeding 20–30 states, careful resource partitioning and shared register usage help maximize utilization without exhausting available macrocells.
What impact does the 144-LQFP package have on thermal management when deploying the EPM570T144C3N in compact PCB layouts?
The 144-pin LQFP package measures 20x20 mm and features exposed pads for improved thermal dissipation, though it remains limited compared to larger BGA variants. In dense systems, junction-to-ambient thermal resistance must be evaluated under worst-case power consumption—typically around 200 mW for typical configurations. Designers should allocate adequate copper area beneath the IC and avoid routing high-current traces near adjacent components to prevent localized heating and reliability risks.
Is it possible to reprogram the EPM570T144C3N multiple times during development, and how does in-system programmability affect production testing?
Yes, the EPM570T144C3N supports in-system programming via JTAG, enabling iterative firmware updates without removing the device from the board. This accelerates debugging and field upgrades but requires robust anti-tamper measures in production environments. During manufacturing test, boundary-scan techniques can verify interconnect integrity and functional correctness across the entire chain of identical units, reducing reliance on external test fixtures.
How does the moisture sensitivity level (MSL 3) of the EPM570T144C3N affect handling procedures in high-volume assembly?
Classified as MSL 3, the EPM570T144C3N requires storage under controlled humidity conditions and must undergo reflow soldering within 168 hours after opening the moisture barrier bag. To comply, manufacturers must use dry packaging materials, monitor warehouse climate, and track time-to-assembly. Failure to adhere increases the risk of popcorning during reflow, potentially damaging internal layers and compromising yield in large-scale deployments.
What role does the base product number EPM570 play in differentiating the EPM570T144C3N from other MAX II variants?
The EPM570 base number identifies a family of CPLDs sharing core architecture, including pin-compatible derivatives with varying densities, speeds, and packages. Specific suffixes denote speed grade (e.g., C3), package type (T144 = TQFP-144), and commercial temperature range. The EPM570T144C3N thus represents a 570 macrocell part in a 144-pin TQFP package with a 5.4 ns max delay—distinguishable from slower variants like the C5 or lower-density models such as EPM570S.
Can the EPM570T144C3N interface directly with LVDS signals, and what precautions are necessary?
While the EPM570T144C3N does not natively support differential signaling, it can drive LVDS-compliant outputs if paired with external emitter followers or line drivers. Direct connection is not recommended due to voltage swing limitations. Instead, designers should use discrete components or dedicated I/O expanders to maintain signal integrity and meet LVDS electrical specifications, especially over long traces.
How does the operating temperature range (0°C to 85°C) limit deployment in industrial automation environments?
Although the EPM570T144C3N operates reliably between 0°C and 85°C, many industrial systems experience transient spikes beyond these bounds due to ambient cooling inefficiencies or localized heat sources. If the application exceeds 85°C continuously, derating curves suggest reduced mean time between failures and potential logic instability. For harsh environments, alternative parts with extended temperature ranges or active cooling strategies should be considered.
What is the significance of the 116 I/O count in the context of peripheral-rich embedded designs?
The 116 general-purpose I/O pins allow the EPM570T144C3N to interface with common peripherals such as UARTs, SPI controllers, I²C buses, and GPIO arrays without requiring external buffers. In microcontroller-less architectures, this enables full protocol implementation in hardware, offloading CPU overhead. However, routing congestion becomes critical in designs exceeding 100 I/Os; careful floorplanning and pin assignment are essential to preserve timing closure and signal quality.
Does the EPM570T144C3N support dynamic partial reconfiguration, and why or why not?
No, the EPM570T144C3N does not support dynamic partial reconfiguration, as it belongs to the MAX II family, which uses non-volatile flash-based technology optimized for instant-on and static logic. Unlike modern FPGAs, it cannot modify portions of logic while running. Full configuration reload occurs upon power-up or reset, simplifying real-time system complexity but limiting adaptability in runtime-modular applications.
How should decoupling capacitors be placed when using the EPM570T144C3N to minimize ground bounce?
Place 0.1 µF ceramic capacitors as close as possible to each VCCIO and VCCA/VCCB pin, with traces kept shorter than 5 mm. The 144-TQFP package has multiple power rails, so separate filtering per bank improves stability. Avoid sharing capacitor rails across unrelated circuits to reduce crosstalk. Simulation tools can model PDN impedance to ensure resonant frequencies remain above 100 MHz, minimizing noise coupling into sensitive logic paths.
What are the implications of the RoHS compliance status for global market entry using the EPM570T144C3N?
As RoHS compliant, the EPM570T144C3N meets EU Directive 2011/65/EU restrictions on hazardous substances, facilitating unrestricted use in consumer, industrial, and medical electronics worldwide. This eliminates lead-free solder compatibility issues and aligns with environmental regulations in North America, Asia, and Europe. Manufacturers benefit from simplified supply chain logistics and reduced certification overhead for end-products.
How does the DiGi-Electronics Programmable flag affect third-party verification workflows involving the EPM570T144C3N?
The “Not Verified” status from DiGi-Electronics indicates that this distributor’s internal validation process has not confirmed full compatibility or performance guarantees for the EPM570T144C3N. While functionally equivalent, engineers should cross-reference official Intel documentation and perform independent timing analysis before committing to designs relying on DiGi’s evaluation reports, especially in safety-critical applications.
Can the EPM570T144C3N be cascaded with another CPLD to extend logic capacity?
Cascading two EPM570T144C3N devices is technically feasible but introduces significant challenges. Inter-device delays accumulate, and synchronization becomes difficult without dedicated handshake logic. Moreover, the MAX II architecture lacks native chaining constructs like those found in older PAL/PLA families. Instead, designers often opt for higher-density alternatives or migrate to FPGA platforms when scalability beyond 600 macrocells is anticipated.
What ECCN classification (3A991D) suggests about export controls affecting sourcing the EPM570T144C3N?
Assigned ECCN 3A991D, the EPM570T144C3N falls under U.S. Commerce Control List category 3 for electronic components, indicating it may require export licenses for transfer to certain countries under specific conditions. Though not classified as a “dual-use” item, compliance teams must still validate end-user and destination to avoid regulatory penalties, particularly in defense or telecommunications sectors.
How does the 5.4 ns propagation delay influence maximum clock frequency selection in synchronous designs using the EPM570T144C3N?
The 5.4 ns tpd implies a theoretical upper frequency bound governed by setup and hold constraints rather than raw gate delay. Assuming typical path lengths and balanced logic, practical maximum frequencies rarely exceed 100–125 MHz even with optimal placement. Engineers must account for routing skew, load capacitance, and clock uncertainty when calculating cycle budgets. Static timing analyzers should be used to validate actual achievable frequencies in the target layout.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPM570T144C3N

Product Attribute EPM570T144C3 EPM570T144C3TT EPM570T144C5N EPM570T144C3RR
Part Number EPM570T144C3 EPM570T144C3TT EPM570T144C5N EPM570T144C3RR
Manufacturer Intel Intel Intel Intel
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Logic Elements/Blocks - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Programmable Type - - - -
Voltage Supply - Internal - - - -
Series - - - -
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Macrocells - - - -
Delay Time tpd(1) Max - - - -

EPM570T144C3N Datasheet PDF

Download EPM570T144C3N pdf datasheets and Intel documentation for EPM570T144C3N - Intel.

Datasheets
Cylindrical Battery Holders.pdf
Errata
MAX II Device Family Errata.pdf
PCN Obsolescence/ EOL
MAX II EOL-Reversal 19/Mar/2021.pdf Mult Dev EOL 4/Dec/2020.pdf
PCN Packaging
Mult Dev Label CHG 24/Jan/2020.pdf Mult Dev Label Chgs 24/Feb/2020.pdf
PCN Design/Specification
Quartus SW/Web Chgs 23/Sep/2021.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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EPM570T144C3N Image

EPM570T144C3N

Intel
32D-EPM570T144C3N

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