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HomeProductsIntegrated Circuits (ICs)Specialized ICsPC28F640P30B85
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PC28F640P30B85 - Intel

Manufacturer Part Number
PC28F640P30B85
Manufacturer
Intel
Allelco Part Number
32D-PC28F640P30B85
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
12,530 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
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Our certification
In stock: 12530

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Specifications

PC28F640P30B85 Tech Specifications
Intel - PC28F640P30B85 technical specifications, attributes, parameters and parts with similar specifications to Intel - PC28F640P30B85

Product Attribute Attribute Value
Part Number PC28F640P30B85
Package DAC91001
Description DAC91001
Stock Condition Get 12530 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Intel
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the PC28F640P30B85 compare to other NOR Flash memory devices in terms of access speed and power efficiency for embedded systems requiring low-latency code execution?
The PC28F640P30B85 from Micron offers a typical page program time of 1.8 µs and a maximum clock frequency of 50 MHz, enabling fast read operations with reduced latency compared to older NOR Flash generations. Its deep power-down mode reduces standby current to less than 1 µA, making it more suitable for battery-powered or energy-constrained applications than devices without advanced sleep states. While some newer SPI-based alternatives may offer higher bandwidth, the parallel interface of this BGA-packaged device provides deterministic timing critical for real-time boot code execution.
What are the key considerations when integrating the PC28F640P30B85 into a system using an ARM Cortex-M microcontroller, particularly regarding signal integrity and timing closure?
When interfacing the PC28F640P30B85 with an ARM Cortex-M series processor, designers must account for the asynchronous parallel interface requiring careful setup and hold times relative to the WE# and CE# strobes. The 10 ns address-to-data delay necessitates PCB trace length matching within ±2 mm to maintain reliable operation at 50 MHz. Additionally, termination resistors should be evaluated near the BGA footprint due to the 32-bit data bus width, which increases susceptibility to reflections on long routing paths.
Can the PC28F640P30B85 support XIP (eXecute In Place) functionality in industrial control applications, and what are the performance implications?
Yes, the PC28F640P30B85 supports XIP operation directly from its NOR Flash array without code decompression or external DRAM buffering. This allows direct execution of application firmware from flash, reducing system complexity and memory footprint. However, sustained random read performance is limited by the 1.2 MBps effective throughput under worst-case page boundary crossings, which may impact performance in highly fragmented instruction streams common in RTOS-based designs.
What environmental and operational stress factors should be considered when deploying the PC28F640P30B85 in automotive or industrial temperature-grade systems?
The PC28F640P30B85 is specified for commercial temperature operation (-40°C to +85°C), but its endurance rating of 10,000 program/erase cycles and retention period of up to 20 years at elevated temperatures must align with application lifetime requirements. In high-vibration environments, the BGA packaging provides better mechanical robustness than TSOP variants, though solder joint reliability under thermal cycling should be validated through accelerated life testing per JEDEC standards.
How does the block architecture of the PC28F640P30B85 influence wear leveling strategies in non-volatile storage systems that span multiple memory devices?
With a uniform block size of 64 KB and total capacity of 8 Mbytes, the PC28F640P30B85 presents fixed erase granularity that limits fine-grained wear leveling flexibility. Designers implementing logging or file systems must allocate logical-to-physical mapping tables in separate memory regions or use higher-level controllers to distribute write cycles across multiple blocks. This contrasts favorably with NAND-based solutions but requires additional software overhead compared to fully managed serial flash interfaces.
What are the implications of using the PC28F640P30B85 in systems requiring secure boot capabilities, especially regarding protection mechanisms against side-channel attacks?
While the PC28F640P30B85 includes basic status register protection and sector locking features, it lacks hardware cryptographic acceleration or tamper detection circuits essential for secure boot implementations. Therefore, any cryptographic verification must occur off-chip, introducing potential attack vectors during authentication phases. For high-security applications, pairing this device with a dedicated security co-processor is recommended to isolate sensitive operations from general-purpose I/O traffic.
How does the power-up sequence for the PC28F640P30B85 affect initialization routines in safety-critical embedded systems?
The PC28F640P30B85 requires stable VCC within 100 ms after power-on before issuing the internal reset pulse, after which the device enters read mode only if CE# is asserted low. Failure to respect this timing can result in undefined state machine behavior during startup. Safety-certified designs should incorporate power-good monitoring circuits and delay bootloader execution until the device reliably responds to identification commands per JEDEC JESD21-C guidelines.
What layout recommendations minimize coupling noise between the PC28F640P30B85 and adjacent analog components in mixed-signal PCBs?
Given the 32-bit bidirectional data bus and control lines (WE#, RE#, BYTE#, etc.), the PC28F640P30B85 demands strict separation from analog sections using at least two ground guard rings around its BGA pads. Routing critical signals perpendicularly across power planes helps reduce crosstalk, and decoupling capacitors (100 nF MLCCs placed within 3 mm of VCC pins) are essential to suppress switching transients during high-frequency writes. Layer stacking should position the flash near the center plane to minimize loop inductance.

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

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Intel

PC28F640P30B85

Intel
32D-PC28F640P30B85

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