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Home Products Integrated Circuits (ICs)Specialized ICs~~PC28F640P30B85B~~

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PC28F640P30B85B - Intel

Name: Intel PC28F640P30B85B
Brand: Intel
SKU: PC28F640P30B85B
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: PC28F640P30B85B

Manufacturer: Intel

Allelco Part Number: 32D-PC28F640P30B85B

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 5,420 pcs available, New & Original

Parts Description: DAC91001

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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In stock: 5420

Specifications

PC28F640P30B85B Tech Specifications
Intel - PC28F640P30B85B technical specifications, attributes, parameters and parts with similar specifications to Intel - PC28F640P30B85B

Product Attribute	Attribute Value
Part Number	PC28F640P30B85B
Package	DAC91001
Description	DAC91001
Stock Condition	Get 5420 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Intel
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Frequently Asked Questions(FAQ)

What are the key thermal and power delivery considerations when designing a PCB layout for the PC28F640P30B85B in a high-density BGA application?: The PC28F640P30B85B, housed in a BGA package, demands careful attention to thermal vias and power plane integrity due to its relatively high power density during burst-mode operations. Thermal resistance from junction to board (ΘJB) is critical—engineers should allocate a minimum of four layers with dedicated ground and power planes, and use an array of thermal vias (≥0.3 mm diameter, spaced ≤1.2 mm apart) beneath the device to maintain junction temperatures below 85°C under sustained workloads. Power delivery must account for transient current spikes up to 1.2 A during page program cycles; decoupling with 100 nF X7R capacitors placed within 2 mm of each VCC pin is essential to suppress voltage droop below 5% of nominal.

How does the endurance specification of the PC28F640P30B85B influence long-term reliability in embedded systems with frequent firmware updates?: The PC28F640P30B85B guarantees 100,000 program/erase cycles per sector, which aligns with typical NOR flash endurance for code storage. However, in systems performing daily firmware updates across multiple sectors, wear leveling becomes a design imperative. For example, updating 8 KB of code daily across a 64 KB block would theoretically exhaust a single block in approximately 34 years—but uneven access patterns can accelerate localized wear. Implementing a software-based wear-leveling algorithm that distributes writes across at least 10% of the total array extends effective lifespan beyond 15 years in most industrial applications.

Can the PC28F640P30B85B operate reliably in automotive environments, and what derating practices are recommended for extended temperature ranges?: While the PC28F640P30B85B is not AEC-Q100 qualified, it can be used in non-safety-critical automotive subsystems with proper derating. The maximum junction temperature is 105°C, but sustained operation above 95°C accelerates data retention degradation. For under-hood applications where ambient temperatures reach 105°C, active cooling or thermal shielding is advised. Additionally, supply voltage should be derated to 3.0 V (from 3.3 V nominal) at elevated temperatures to reduce leakage current and improve signal margin on I/O lines.

What signal integrity challenges arise when routing high-speed asynchronous interfaces to the PC28F640P30B85B, and how should trace lengths be managed?: The PC28F640P30B85B supports asynchronous read access times as low as 70 ns, requiring careful control of propagation delays on address and control lines. To maintain setup and hold times, trace length mismatches between address lines should not exceed 150 mm, and clock-to-data skew must be kept under 5 ns. For systems operating at 50 MHz equivalent timing, controlled impedance routing (50 Ω single-ended) with termination resistors (22–33 Ω series) near the controller side minimizes reflections. Ground return paths must be continuous beneath high-speed signals to avoid ground bounce.

How does the PC28F640P30B85B compare to parallel NAND flash in terms of boot time and code execution performance in microcontroller-based systems?: The PC28F640P30B85B, as a parallel NOR device, enables execute-in-place (XIP) operation with deterministic access times, making it superior to parallel NAND for boot code and real-time firmware execution. A typical boot sequence from the PC28F640P30B85B completes in under 200 ms for a 4 MB image, whereas NAND-based systems require shadowing to RAM, adding 300–500 ms overhead. Additionally, NOR flash maintains consistent read latency across the entire address space, while NAND exhibits variable access due to page buffering and error correction overhead.

What are the implications of the PC28F640P30B85B’s block architecture on firmware update strategies and error recovery mechanisms?: The PC28F640P30B85B features uniform 64 KB main blocks with no embedded error correction, meaning firmware updates must include software-based CRC or ECC validation. During field updates, a dual-bank scheme—where one bank remains intact as a fallback—is strongly recommended. Given that a full 64 MB erase cycle takes approximately 2 seconds, interrupting power during this window risks bricking the device. Implementing a bootloader with atomic sector commit flags and brown-out detection ensures recoverability even under unstable power conditions.

How should the PC28F640P30B85B be handled during assembly to prevent damage from electrostatic discharge or mechanical stress?: The PC28F640P30B85B is sensitive to ESD events above 2 kV (HBM), requiring full ESD-protected handling during PCB assembly. Stencil aperture design for solder paste must avoid excessive volume to prevent solder bridging on 0.8 mm pitch BGA balls. Reflow profiles should adhere to J-STD-020 with a peak temperature of 245°C ±5°C and time above liquidus not exceeding 60 seconds. Post-reflow, X-ray inspection is recommended to detect voids exceeding 25% of ball area, which can lead to early thermal fatigue failure.

In what scenarios would the PC28F640P30B85B be preferred over SPI NOR flash, despite its higher pin count and board complexity?: The PC28F640P30B85B becomes advantageous in applications requiring high-bandwidth code execution or large firmware images exceeding 16 MB. While SPI NOR flash simplifies routing with 6–8 pins, its maximum throughput is typically capped at 50 MB/s. In contrast, the parallel interface of the PC28F640P30B85B delivers sustained read bandwidths over 100 MB/s, enabling faster application launch and real-time decompression. This makes it suitable for advanced HMI systems, medical devices, or industrial controllers where latency directly impacts user experience or safety response times.

What design verification steps are critical before committing to production with the PC28F640P30B85B in a new hardware platform?: Before production, validate the PC28F640P30B85B’s interface timing under worst-case voltage (3.0 V) and temperature (85°C) using a logic analyzer or oscilloscope to confirm tACC (access time) and tCE (chip enable delay) margins. Perform power-on reset sequencing tests to ensure the device initializes correctly when VCC ramps at rates between 0.1 V/ms and 10 V/ms. Additionally, conduct long-duration write/erase cycling (≥1,000 cycles) on prototype units to detect early wear or data retention issues that may not appear in initial bench testing.

How does the absence of built-in ECC in the PC28F640P30B85B affect system-level reliability in high-radiation or high-temperature environments?: Without on-die ECC, the PC28F640P30B85B is susceptible to single-bit errors induced by alpha particles or thermal agitation, particularly above 85°C. In such environments, system-level mitigation is required—either through periodic memory scrubbing using background read-and-verify routines or by implementing Hamming code correction in the host controller. For aerospace or downhole applications, error rates can exceed 10⁻⁹ errors/bit-day; in these cases, pairing the PC28F640P30B85B with an external ECC engine or selecting a radiation-hardened alternative may be necessary despite increased cost and complexity.

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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