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C1210C912M4HAC7800 - KEMET

Name: KEMET C1210C912M4HAC7800
Brand: KEMET
SKU: C1210C912M4HAC7800
Price: 0.052 USD
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: C1210C912M4HAC7800

Manufacturer: KEMET

Allelco Part Number: 98D-C1210C912M4HAC7800

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 28,390 pcs available, New & Original

Parts Description: CAP CER 9100PF 16V X8R 1210

Package: 1210 (3225 Metric)

Data sheet: C1210C912M4HAC7.pdf

Datasheets
Ultra Stable, X8R Dielectric.pdf

HTML Datasheet
Ultra Stable, X8R Dielectric.pdf

RoHs Status: ROHS3 Compliant

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Specifications

C1210C912M4HAC7800 Tech Specifications
KEMET - C1210C912M4HAC7800 technical specifications, attributes, parameters and parts with similar specifications to KEMET - C1210C912M4HAC7800

Product Attribute	Attribute Value
Manufacturer	KEMET
Voltage - Rated	16V
Tolerance	±20%
Thickness (Max)	0.043" (1.10mm)
Temperature Coefficient	X8R
Size / Dimension	0.126" L x 0.098" W (3.20mm x 2.50mm)
Series	SMD Comm X8R HT150C
Ratings	-
Package / Case	1210 (3225 Metric)
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Operating Temperature	-55°C ~ 150°C
Mounting Type	Surface Mount, MLCC
Lead Spacing	-
Height - Seated (Max)	-
Features	Low ESL, High Temperature
Failure Rate	-
Capacitance	9100 pF
Base Product Number	C1210C
Applications	General Purpose

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8532.24.0020

Frequently Asked Questions(FAQ)

What makes the C1210C912M4HAC7800 suitable for high-temperature applications up to 150°C?: The C1210C912M4HAC7800 uses X8R temperature coefficient material, which maintains capacitance within ±15% across the full -55°C to 150°C operating range. This stability is critical in automotive, industrial, and aerospace designs where ambient temperatures fluctuate significantly. The X8R specification ensures the 9100 pF nominal value remains predictable during thermal cycling, reducing the need for derating calculations or thermal compensation in the circuit design. High-temperature ceramic formulations like those in the C1210C912M4HAC7800 also exhibit lower piezoelectric noise and improved voltage linearity compared to standard X7R alternatives, making them preferred for precision signal conditioning and filtering applications in elevated thermal environments.

How does the ±20% tolerance of the C1210C912M4HAC7800 affect circuit design margins in frequency-critical applications?: The ±20% tolerance band of the C1210C912M4HAC7800 means the actual capacitance can range from 7280 pF to 10920 pF. In LC tank circuits or timing networks, this produces a worst-case frequency variation of approximately ±9.5%, which may exceed acceptable margins in narrowband filters, oscillators, or resonant circuits. Designers using the C1210C912M4HAC7800 in frequency-dependent applications typically employ capacitor trimming (varactor or variable capacitor in parallel) or select tighter tolerance variants if available. For power distribution decoupling and EMI suppression, the C1210C912M4HAC7800 tolerance is generally acceptable because impedance variation has less impact on noise attenuation across a broad frequency spectrum. Temperature drift compounds the tolerance effect—the X8R coefficient of the C1210C912M4HAC7800 contributes an additional ±5% variation over temperature, so total possible shift can reach ±25% in worst-case thermal scenarios.

Why is the C1210C912M4HAC7800 classified as MSL 1 (Unlimited moisture sensitivity), and what does this mean for storage and handling?: MSL 1 rating on the C1210C912M4HAC7800 indicates the component absorbs negligible moisture and poses no risk of delamination or cracking during standard reflow soldering. Unlike higher MSL-rated components, the C1210C912M4HAC7800 requires no baking before assembly and can be stored in normal warehouse conditions (typically 23°C, 50–80% RH) indefinitely. This eliminates floor-life tracking, moisture-sensitive device (MSD) bag requirements, and desiccant storage protocols, reducing manufacturing overhead and risk of accidental bake-out damage. The MSL 1 characteristic of the C1210C912M4HAC7800 is typical of mature MLCC formulations and reflects the robustness of ceramic dielectric systems. However, this does not imply immunity to mechanical stress or thermal shock—the C1210C912M4HAC7800 still requires careful handling to avoid impact damage or rapid temperature transitions that could induce mechanical failure independent of moisture ingress.

How does the 16V voltage rating of the C1210C912M4HAC7800 compare to typical derating practices for DC bias voltage?: The C1210C912M4HAC7800 is rated for 16V DC maximum operating voltage. In practice, most design guidelines recommend applying no more than 50–60% of rated voltage as average DC bias for the C1210C912M4HAC7800 to avoid significant capacitance loss due to nonlinear dielectric behavior at higher electric fields. At 16V, if the effective DC bias is set to 8V, capacitance of the C1210C912M4HAC7800 will typically drop 10–20% compared to its small-signal 0V measurement. This derating becomes critical in multilayer ceramic capacitor (MLCC) designs where AC ripple voltage is superimposed on DC bias; the C1210C912M4HAC7800 experiences nonlinear voltage coefficients that compress capacitance progressively as total applied voltage increases. For applications requiring stable capacitance such as precision timing or tuning circuits, designers often select the C1210C912M4HAC7800 at voltages well below 16V (typically <8V actual bias) or verify capacitance stability through simulation or empirical characterization at the intended operating point.

What is the effective series inductance (ESL) of the C1210C912M4HAC7800, and how does it limit high-frequency performance?: The C1210C912M4HAC7800 is marketed with 'Low ESL' characteristics typical of the 1210 form factor and KEMET's SMD Comm X8R HT150C series. Measured ESL for a 1210 ceramic is typically 0.3–0.5 nH depending on lead frame geometry and solder joint quality. At frequencies above ~500 MHz, the inductive reactance (XL = 2πfL) of the C1210C912M4HAC7800 begins to dominate its impedance profile, reducing effective capacitance by roughly 10–15% even though the capacitive reactance remains nominally lower. The self-resonant frequency (SRF) of the C1210C912M4HAC7800 is typically in the range of 3–5 GHz, meaning the component transitions from capacitive to inductive behavior in the microwave region. For broadband decoupling or EMI suppression across wide frequency bands, multiple C1210C912M4HAC7800 units in parallel, combined with lower-capacitance high-frequency devices, yield better overall impedance performance. The low ESL of the C1210C912M4HAC7800 makes it preferable to through-hole or axial devices for power distribution filtering in switching supplies operating above 10 MHz.

How does the C1210C912M4HAC7800 perform compared to film or tantalum capacitors at equivalent nominal capacitance in high-temperature environments?: The C1210C912M4HAC7800 ceramic offers superior temperature stability and frequency response compared to tantalum capacitors across the -55°C to 150°C range. Tantalum capacitance typically drifts 5–10% over temperature, and ESR increases significantly at low temperatures, degrading filtering performance. Film capacitors (polyester, polypropylene) are generally limited to <100°C operation and exhibit lower volumetric efficiency, requiring larger physical packages than the C1210C912M4HAC7800 for equivalent capacitance. The C1210C912M4HAC7800 is therefore the dominant choice for automotive and industrial applications where thermal extremes, component density, and cost are concurrent constraints. However, the C1210C912M4HAC7800 exhibits higher microphonics (piezoelectric noise generation) and nonlinear voltage behavior compared to film alternatives, making film capacitors preferable in precision analog audio or ultra-low-noise signal conditioning. The C1210C912M4HAC7800 also lacks the self-healing property of film capacitors; electrical overstress will cause permanent failure rather than graceful degradation.

What circuit conditions would cause the C1210C912M4HAC7800 to fail prematurely despite operating within rated voltage and temperature specifications?: Although the C1210C912M4HAC7800 is rated to 16V and -55°C to 150°C, premature failure can occur under several realistic conditions. High AC ripple voltage superimposed on DC bias reduces the effective lifetime of the C1210C912M4HAC7800 due to dielectric loss and localized heating; high-frequency switching supplies (>100 kHz) with large dV/dt transitions generate thermal stress independent of average voltage. Rapid thermal cycling (>50°C/minute transitions) can crack the C1210C912M4HAC7800 due to mechanical mismatch between ceramic and solder joint materials, particularly in automotive underhood environments. Mechanical shock or vibration during assembly or field operation can initiate internal cracks in the C1210C912M4HAC7800 that propagate over time, eventually causing electrical failure. Moisture ingress combined with electrical potential (electrochemical migration) is rare on MSL 1 components like the C1210C912M4HAC7800 but can occur if the component is stored improperly or PCB cleanliness is compromised. Voltage overstress as low as 1.5× the rated voltage (24V on the C1210C912M4HAC7800) will cause immediate catastrophic failure with risk of internal arcing and PCB damage.

Does the C1210C912M4HAC7800 require board-level testing or burn-in validation before field deployment?: The C1210C912M4HAC7800, as a mature passive component with MSL 1 rating and RoHS3 compliance, typically does not require component-level burn-in. However, board-level functional testing is standard practice to detect assembly defects (cold solder joints, tombstoning, contamination) that affect the C1210C912M4HAC7800 and surrounding circuitry. Accelerated life testing (ALT) may be warranted for safety-critical or field-replacement applications; typical ALT profiles for ceramic capacitors like the C1210C912M4HAC7800 include voltage aging at 16V and elevated temperature (85°C or 150°C) for 500–1000 hours, monitoring for capacitance drift and leakage current increase. Most commercial and industrial applications skip component burn-in for the C1210C912M4HAC7800 and rely on statistical process controls and periodic incoming inspection. Automotive-grade or military-specification variants of the C1210C912M4HAC7800 may include screening (electrical characterization, thermal shock) and detailed lot traceability, but standard commercial grade components like this typically do not.

What is the RoHS3 compliance scope for the C1210C912M4HAC7800, and are there restricted substance limitations for specific applications?: The C1210C912M4HAC7800 is RoHS3 compliant, meaning it contains no lead, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE), or brominated flame retardants in concentrations exceeding regulatory thresholds (typically 0.1% by weight for most substances). RoHS3 compliance of the C1210C912M4HAC7800 makes it suitable for consumer electronics in EU markets and aligns with environmental regulations in most developed regions. However, RoHS3 does not guarantee compatibility with all specialized applications; aerospace and military programs may impose additional material purity requirements (AS6081, MIL-PRF standards) that exceed RoHS3 baselines. The C1210C912M4HAC7800 is REACH-compliant and designated 'REACH Unaffected,' indicating the component does not contain substances of very high concern (SVHC) listed under REACH Annex XIV at reporting thresholds. ECCN classification (EAR99) for the C1210C912M4HAC7800 indicates unrestricted export status under U.S. regulations, with no licensing requirements for commercial distribution.

How should the C1210C912M4HAC7800 be terminated on a PCB to minimize solder joint failure and ensure reliable electrical connection over thermal cycling?: The C1210C912M4HAC7800 uses standard 1210 (3225 metric) terminations designed for standard reflow soldering with lead-free solder (SAC305 or equivalent). Optimal solder joint formation requires thermal profile compliance: peak reflow temperature of 245–260°C for 10–30 seconds, with ramp rates of 3°C/second. Insufficient thermal exposure during reflow can result in cold joints on the C1210C912M4HAC7800, appearing visually dull and prone to high resistance and intermittent failures. Excessive reflow temperatures (>260°C sustained >30 seconds) can damage the C1210C912M4HAC7800 termination metallization and surrounding PCB traces. Pad design for the C1210C912M4HAC7800 should follow IPC-7351 recommendations: pads slightly larger than the component termination to accommodate solder fillet formation, with pad spacing matched to 1210 dimensions (typically 5.0–5.2mm center-to-center). Via-in-pad designs directly beneath the C1210C912M4HAC7800 terminations should be avoided or filled with non-conductive material, as vias act as thermal sinks during reflow and can starve the joint of molten solder. Thermal stress during thermal cycling is mitigated by ensuring the C1210C912M4HAC7800 is not positioned at board edges or stress concentration points; flexible PCB regions near connectors should be avoided.

What capacitance drift should be expected in the C1210C912M4HAC7800 if it is subjected to extended storage or shelf life aging at room temperature?: The C1210C912M4HAC7800 exhibits minimal capacitance aging at room temperature compared to older generations of ceramic capacitors. KEMET's SMD Comm X8R HT150C series, which includes the C1210C912M4HAC7800, is specified for <5% capacitance change after one year of storage at 20–25°C in ambient conditions. However, long-term aging (5–10 years) at elevated temperatures accelerates dielectric polarization and ion migration, potentially causing capacitance to drift downward by 3–8% over the extended timeline. This aging effect is logarithmic; most drift occurs within the first 1–3 months, after which the rate slows substantially. For critical timing or filtering applications, the C1210C912M4HAC7800 should not be relied upon for sub-percent capacitance stability over decades without periodic re-characterization. Temperature cycling during storage has a more pronounced effect than static room-temperature aging; the C1210C912M4HAC7800 stored in uncontrolled warehouse environments (seasonal temperature swings from 10°C to 40°C) will exhibit slightly higher drift than climate-controlled storage. Burn-in at elevated temperature (85°C or 125°C) for 168–500 hours can be used to accelerate the aging process on the C1210C912M4HAC7800 and stabilize capacitance before deployment if long-term stability is critical.

In what ways does the 1210 form factor of the C1210C912M4HAC7800 offer trade-offs compared to smaller 0805 or larger 1812 packages for equivalent circuit functions?: The 1210 package of the C1210C912M4HAC7800 represents a practical mid-range size for surface-mount assembly. Smaller 0805 ceramics offer higher component density and lower parasitic inductance but sacrifice voltage handling and thermal dissipation capacity; achieving 9100 pF in 0805 form factor requires higher dielectric constant materials that exhibit worse temperature stability and voltage linearity. Larger 1812 or 2220 capacitors provide superior thermal performance and lower ESR but consume significantly more PCB real estate and increase assembly costs. The 1210 package of the C1210C912M4HAC7800 is the smallest practical size for this capacitance at 16V with X8R stability, making it suitable for space-constrained consumer and industrial electronics. The C1210C912M4HAC7800 dimensions (3.20mm L × 2.50mm W × 1.10mm max thickness) fit standard high-speed automated placement equipment without special handling, keeping manufacturing cost competitive. For high-vibration environments (automotive, industrial machinery), the C1210C912M4HAC7800 form factor balances mechanical robustness with compact design; 0805 devices are more prone to vibration-induced cracking, while oversized packages increase stress concentrations at solder joints.

How does low ESR performance of the C1210C912M4HAC7800 contribute to noise reduction and power supply stability in switching power supplies?: Low ESR design in the C1210C912M4HAC7800 reduces the impedance of the capacitor at high frequencies, directly improving voltage regulation during transient load changes. In a switching power supply, output voltage ripple is proportional to ESR multiplied by the output current ripple; by using the low-ESR C1210C912M4HAC7800 in parallel arrays, designers can maintain output voltage ripple below 50–100 mV (critical for digital logic and analog circuits sensitive to supply noise). The low ESR of the C1210C912M4HAC7800 also minimizes resistive heating losses in the capacitor itself, extending the operational lifetime and reducing thermal runaway risk during fault conditions. At switching frequencies typical of modern power supplies (500 kHz to 2 MHz), the low ESR of the C1210C912M4HAC7800 combined with low ESL ensures the capacitor operates well below its self-resonant frequency, maintaining capacitive behavior across the entire frequency band. Multiple C1210C912M4HAC7800 units distributed around the power supply output (near the switching FET, at the load, and at intermediate nodes) reduce loop inductance and ensure each region of the PCB experiences adequate local decoupling, preventing ground bounce and voltage overshoot that could damage downstream logic.

What documentation and traceability records should accompany procurement of the C1210C912M4HAC7800 for compliance with automotive or aerospace supply chain requirements?: Procurement of the C1210C912M4HAC7800 for automotive or aerospace applications requires supplier documentation including datasheets, RoHS/REACH certificates, and material composition reports. For IATF 16949 (automotive) or AS9100 (aerospace) compliance, the C1210C912M4HAC7800 must be accompanied by a Certificate of Conformance (CoC) stating test lot number, date of manufacture, and verification of electrical parameters against datasheet specifications. Lot traceability for the C1210C912M4HAC7800 is critical; the part number C1210C912M4HAC7800 must be linked to specific manufacturing date codes, allowing field failures to be traced back to specific production batches. For safety-critical aerospace applications, the C1210C912M4HAC7800 may require screening (100% electrical characterization, thermal shock testing, fine/gross leak detection) beyond standard commercial inspection. First-article inspection (FAI) reports for the C1210C912M4HAC7800 validate that incoming components from a new supplier lot meet drawing and specification requirements before production release. Supply chain risk management requires diversifying C1210C912M4HAC7800 sourcing across multiple qualified manufacturers or distributors to mitigate single-point-of-failure risk due to supply disruption or counterfeit components.

Parts with Similar Specifications

The three parts on the right have similar specifications to KEMET C1210C912M4HAC7800

Product Attribute
Part Number	C1210C912M3HAC7800	C1210C912M1HAC7800	C1210C912M5HAC7800	C1210C912M8HAC7800
Manufacturer	KEMET	KEMET	KEMET	KEMET
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Ratings	-	-	-	-
Thickness (Max)	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Tolerance	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - Rated	-	-	-	-
Capacitance	-	-	-	-
Temperature Coefficient	-	-	-	-
Failure Rate	-	-	-	-
Lead Spacing	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Applications	-	-	-	-
Size / Dimension	-	-	-	-
Height - Seated (Max)	-	-	-	-
Features	-	-	-	Simultaneous Sampling

C1210C912M4HAC7800 Datasheet PDF

Download C1210C912M4HAC7800 pdf datasheets and KEMET documentation for C1210C912M4HAC7800 - KEMET.

Datasheets: Ultra Stable, X8R Dielectric.pdf
HTML Datasheet: Ultra Stable, X8R Dielectric.pdf

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Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
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Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
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Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
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Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
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Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
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Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

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This product works considerably well. It secretly improves my basketball by a lot.
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Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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