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HomeProductsCapacitorsCeramic CapacitorsC327C111J3G5TA
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C327C111J3G5TA - KEMET

Manufacturer Part Number
C327C111J3G5TA
Manufacturer
KEMET
Allelco Part Number
98D-C327C111J3G5TA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
38,525 pcs available, New & Original
Parts Description
CAP CER RAD 110PF 25V C0G 5%
Package
Radial
Data sheet
C327C111J3G5TA.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 38525
  • Unit Price: $0.081
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.081 $0.08
200+ $0.031 $6.20
500+ $0.03 $15.00
1000+ $0.03 $30.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

C327C111J3G5TA Tech Specifications
KEMET - C327C111J3G5TA technical specifications, attributes, parameters and parts with similar specifications to KEMET - C327C111J3G5TA

Product Attribute Attribute Value
Manufacturer KEMET
Voltage - Rated 25V
Tolerance ±5%
Thickness (Max) -
Temperature Coefficient C0G, NP0
Size / Dimension 0.200' L x 0.125' W (5.08mm x 3.18mm)
Series GoldMax 300 Comm C0G
Ratings -
Package / Case Radial
Package Bulk
Product Attribute Attribute Value
Operating Temperature -55°C ~ 125°C
Mounting Type Through Hole
Lead Style Formed Leads - Kinked
Lead Spacing 0.200' (5.08mm)
Height - Seated (Max) 0.320' (8.13mm)
Features Low ESL
Failure Rate -
Capacitance 110 pF
Base Product Number C327C
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.24.0060

Frequently Asked Questions(FAQ)

What makes the C327C111J3G5TA suitable for high-frequency decoupling applications despite its 110 pF capacitance?
The C327C111J3G5TA achieves low ESL (equivalent series inductance) through its radial geometry and kinked lead design, which reduces the inductive path length compared to axial configurations. At 110 pF, this capacitance value pairs effectively with the low ESL characteristic to maintain impedance control in the 100 MHz to 1 GHz range, where parasitic inductance typically dominates impedance behavior. The C0G dielectric ensures stable capacitance across temperature extremes (-55°C to 125°C), preventing impedance drift during thermal cycling—a critical factor in precision RF and clock distribution circuits where the C327C111J3G5TA would be deployed alongside larger bulk capacitors.
How does the C0G temperature coefficient of the C327C111J3G5TA compare to X7R alternatives for temperature-sensitive analog circuits?
The C327C111J3G5TA employs C0G (NP0) dielectric, which exhibits negligible capacitance variation across temperature—typically ±30 ppm/°C or better. This contrasts with X7R dielectrics, which exhibit ±15% capacitance shift over military temperature ranges (-55°C to 125°C). For the C327C111J3G5TA's 110 pF nominal value, a ±5% tolerance combined with C0G stability means total capacitance variation remains bounded within tight margins, making it suitable for precision timing filters, tuning circuits, and analog reference networks where predictable capacitance is non-negotiable. X7R alternatives offer higher capacitance density but introduce temperature-dependent frequency response changes that complicate compensation.
What design considerations arise when substituting the C327C111J3G5TA's 25V rating in circuits with 15V or 20V rails?
Operating the C327C111J3G5TA at 25V rated voltage within lower-voltage rails (15V or 20V nominal) provides significant voltage derating margin, extending ceramic capacitor lifetime and reducing failure rate substantially. However, the 110 pF capacitance of the C327C111J3G5TA remains fixed regardless of applied voltage; derating voltage does not increase capacitance. Designers must ensure that the C327C111J3G5TA's 0.200" (5.08 mm) lead spacing accommodates PCB layout without routing conflicts, and that the kinked lead geometry does not impose mechanical stress during insertion or thermal cycling. In power distribution networks where voltage transients exceed 25V peaks, the C327C111J3G5TA would be insufficient and require series alternative components or stacking topologies.
How do the formed, kinked leads of the C327C111J3G5TA affect automated assembly and rework procedures?
The C327C111J3G5TA's kinked lead design improves mechanical retention during wave soldering and reduces vibration-induced failures by creating mechanical keying during insertion. However, kinked leads demand precise insertion depth control during PCB assembly—over-insertion can damage leads or distort the component body, while under-insertion compromises solder joint quality. The 0.200" (5.08 mm) lead spacing of the C327C111J3G5TA must match PCB drill hole spacing precisely; tolerance stack-up between component and PCB can create insertion resistance. Rework of the C327C111J3G5TA requires careful desoldering temperature control (below 260°C peak) to avoid lead embrittlement, and lead straightening must be performed cold post-solder to prevent stress cracking in the ceramic body.
Why is the C327C111J3G5TA's ±5% tolerance insufficient for precision oscillator tank circuits, and what are the practical workarounds?
The C327C111J3G5TA's ±5% tolerance translates to 110 pF ±5.5 pF capacitance distribution across production batches. In parallel-resonant oscillator designs where oscillation frequency is set by LC resonance, this tolerance produces frequency uncertainty of approximately ±2.5% (half the capacitive tolerance), exceeding stability budgets for frequency-locked loops or precision reference clocks. Practical solutions include: (1) hand-selecting C327C111J3G5TA components from a single manufacturing lot to minimize spread, (2) using a trimmer capacitor in parallel with the C327C111J3G5TA to compensate for tolerance variation, or (3) switching to ±1% or ±0.5% tolerance alternatives if production volume and cost justify the premium. The C327C111J3G5TA's C0G stability remains an advantage even with tolerance variation, ensuring calibration remains valid across operating temperature.
What environmental and reliability factors does the ROHS3 compliance status of the C327C111J3G5TA imply for long-term field deployment?
The C327C111J3G5TA's ROHS3 compliance confirms lead-free solder compatibility and absence of restricted substances (cadmium, mercury, hexavalent chromium), meeting EU directive requirements for consumer and industrial electronics. However, ROHS3 compliance does not guarantee extended environmental resistance beyond standard ceramic capacitor behavior. The C327C111J3G5TA's 110 pF capacitance and low ESL characteristics remain stable in temperature-cycled automotive or industrial environments, but no special inherent protection against moisture ingress, vibration fatigue, or salt-spray corrosion is conferred by ROHS3 status alone. Long-term field deployment of the C327C111J3G5TA requires conformal coating or potting in high-humidity or corrosive environments, and mechanical stress relief near the C327C111J3G5TA's kinked leads should be verified through bend-test validation during design validation phases.
How does the C327C111J3G5TA's 110 pF value position itself relative to common decoupling strategies at power supply rails?
The C327C111J3G5TA's 110 pF capacitance falls into the high-frequency decoupling tier, designed to suppress noise above 500 MHz rather than provide bulk charge storage. Typical power distribution networks cascade three capacitance decades: bulk capacitors (10–100 µF), intermediate ceramic capacitors (1–10 µF), and high-frequency ceramics like the C327C111J3G5TA (100–1000 pF). The C327C111J3G5TA addresses transient current spikes associated with switching frequencies beyond 1 GHz, where bulk and intermediate capacitors' impedance rises sharply due to parasitic inductance. The C327C111J3G5TA's ±5% tolerance and C0G stability ensure predictable high-frequency impedance, but multiple units (typically 2–4 per power supply region) are required to achieve aggregate capacitance sufficient for noise attenuation; a single C327C111J3G5TA alone provides insufficient charge for low-frequency transient buffering.
What failure mechanisms are most likely to affect the C327C111J3G5TA in voltage overstress or thermal cycling stress tests?
The C327C111J3G5TA's ceramic dielectric exhibits voltage-dependent behavior; overstress beyond 25V rated voltage causes dielectric polarization saturation, leading to permanent capacitance loss and leakage current increase. Repeated thermal cycling (-55°C to 125°C) induces mechanical strain at the C327C111J3G5TA's lead-to-body interface due to thermal expansion coefficient mismatch between ceramic (typically 5–8 ppm/°C), solder (16–17 ppm/°C), and PCB (16–20 ppm/°C). This mismatch causes micro-crack initiation and propagation, particularly in the kinked lead geometry where stress concentration occurs. The C327C111J3G5TA's low ESL design places mechanical demands on the internal electrode structure; vibration-induced stress can accelerate lead separation or cracking near the ceramic body. Reliability testing (IPC-TM-650 thermal shock cycles) typically reveals failures after 100–500 cycles in highly constrained mechanical designs.
How should the C327C111J3G5TA's physical dimensions and lead spacing be validated against legacy PCB designs when retrofitting older equipment?
The C327C111J3G5TA measures 0.200" L × 0.125" W with 0.200" lead spacing and 0.320" maximum seated height. When retrofitting the C327C111J3G5TA into legacy PCB designs, physical clearance conflicts often arise: (1) lead spacing mismatch—older boards may specify 0.210" or 0.250" spacing, requiring modified drilling or lead bending (which risks reliability degradation), (2) height constraints in compact form factors where 0.320" seated height exceeds clearance to adjacent components or conformal coating, and (3) footprint pattern rotation misalignment if the C327C111J3G5TA's kinked lead orientation differs from original radial component specifications. Manual lead spacing adjustment for the C327C111J3G5TA should be avoided; instead, PCB redrill or selective component repositioning is preferable to maintain mechanical integrity and solder joint quality.
What is the practical frequency limit where the C327C111J3G5TA's impedance performance begins to degrade significantly?
The C327C111J3G5TA's impedance curve exhibits a minimum impedance point typically around 500 MHz to 1 GHz, determined by its low ESL and 110 pF capacitance. Above this resonant frequency, parasitic inductance (remaining lead inductance and PCB traces) dominates impedance, causing impedance to rise at ~20 dB/decade. By 5–10 GHz, the C327C111J3G5TA transitions from capacitive to inductive behavior, and its practical decoupling effect diminishes. For frequencies exceeding 2 GHz continuous operation, the C327C111J3G5TA should be paired with smaller capacitances (10–47 pF range) to address impedance spikes above its resonant peak. The C327C111J3G5TA remains effective for signal filtering and EMI suppression to approximately 3 GHz in well-designed PCB layouts with minimal lead inductance.

Parts with Similar Specifications

The three parts on the right have similar specifications to KEMET C327C111J3G5TA

Product Attribute C327C111J3G5TA7301 C327C111F3G5TA C327C111G3G5TA7301 C327C111G3G5TA
Part Number C327C111J3G5TA7301 C327C111F3G5TA C327C111G3G5TA7301 C327C111G3G5TA
Manufacturer KEMET KEMET KEMET KEMET
Size / Dimension - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Features - - - Simultaneous Sampling
Height - Seated (Max) - - - -
Voltage - Rated - - - -
Capacitance - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Thickness (Max) - - - -
Series - - - -
Ratings - - - -
Lead Spacing - - - -
Lead Style - - - -
Tolerance - - - -
Temperature Coefficient - - - -
Applications - - - -
Failure Rate - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

C327C111J3G5TA Datasheet PDF

Download C327C111J3G5TA pdf datasheets and KEMET documentation for C327C111J3G5TA - KEMET.

Datasheets
Goldmax, C0G 330 Series.pdf

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Evaluation: 10 Articles

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Region Country Logistic Time(Day)
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Brazil 7
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United Kingdom 4
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New Zealand 5
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Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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C327C111J3G5TA Image

C327C111J3G5TA

KEMET
98D-C327C111J3G5TA

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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