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HomeProductsResistorsChip Resistor - Surface MountRN732BTTD5113F100
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RN732BTTD5113F100 - KOA Speer Electronics, Inc.

Manufacturer Part Number
RN732BTTD5113F100
Manufacturer
KOA Speer Electronics, Inc.
Allelco Part Number
98D-RN732BTTD5113F100
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
32,931 pcs available, New & Original
Parts Description
RES 511K OHM 1% 1/8W 1206
Package
1206
Data sheet
RN732BTTD5113F1.pdf

PCN Obsolescence/ EOL

Mult Series 24/May/2021.pdf
RoHs Status
ROHS3 Compliant
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  • Unit Price: $0.078
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Specifications

RN732BTTD5113F100 Tech Specifications
KOA Speer Electronics, Inc. - RN732BTTD5113F100 technical specifications, attributes, parameters and parts with similar specifications to KOA Speer Electronics, Inc. - RN732BTTD5113F100

Product Attribute Attribute Value
Manufacturer KOA Speer Electronics, Inc.
Tolerance ±1%
Temperature Coefficient ±100ppm/°C
Supplier Device Package 1206
Size / Dimension 0.126" L x 0.063" W (3.20mm x 1.60mm)
Series RN73
Resistance 511 kOhms
Power (Watts) 0.125W, 1/8W
Product Attribute Attribute Value
Package / Case 1206 (3216 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 155°C
Number of Terminations 2
Height - Seated (Max) 0.028" (0.70mm)
Features Moisture Resistant
Composition Thin Film
Base Product Number RN732B

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8533.21.0030

Frequently Asked Questions(FAQ)

What are the practical thermal management considerations when designing with the RN732BTTD5113F100 in high-temperature environments above 125°C?
The RN732BTTD5113F100 operates across -55°C to 155°C, but the 511 kOhm thin-film resistance exhibits a temperature coefficient of ±100ppm/°C. In applications approaching the upper temperature limit, resistance drift becomes measurable: at 155°C, the RN732BTTD5113F100 can shift approximately ±5.1 kOhms from room-temperature nominal value. For precision analog circuits, sensor interfaces, or reference dividers where this 1% tolerance resistor is chosen for stability, thermal management should account for cumulative drift. In oscillator biasing or timing-critical networks, PCB layout should minimize localized heating near the RN732BTTD5113F100, and thermal cycling testing is recommended if the resistor sits adjacent to high-power components or operates in industrial environments with wide ambient swings.
How does the moisture-resistant thin-film construction of the RN732BTTD5113F100 compare to metal-film alternatives for reliability in outdoor and humidity-prone applications?
The RN732BTTD5113F100 features thin-film construction with moisture-resistant coating and carries Moisture Sensitivity Level (MSL) 1, indicating unlimited moisture tolerance without baking or desiccant storage requirements. This design choice reflects KOA's engineering approach to reduce field failures in humid or salt-spray environments. Metal-film resistors, by contrast, often carry MSL 2 or higher and may require controlled drying protocols in high-humidity manufacturing regions. For outdoor instrumentation, automotive underbody circuits, or coastal industrial deployments where the RN732BTTD5113F100 would be exposed to condensation or salt fog, the moisture-resistant thin-film construction eliminates reflow-cycle risk and simplifies supply-chain logistics. However, the 511 kOhm value in the RN732BTTD5113F100 is less critical than its construction for moisture resilience; the real advantage lies in eliminating post-manufacturing bake cycles and enabling direct board-level assembly without humidity chamber management.
Can the RN732BTTD5113F100 be substituted with RT1206FRD07511KL or RN73R2BTTD5113F100 in precision measurement or calibration circuits without recalibration?
Datasheet cross-references list RT1206FRD07511KL, RT1206FRE07511KL, and RN73R2BTTD5113F100 as substitutes, but substitution in precision circuits requires component-level assessment. The RN732BTTD5113F100 specifies ±1% tolerance and ±100ppm/°C temperature coefficient across its -55°C to 155°C range. Vishay's RT1206 series may use different thin-film deposition chemistry or aging characteristics, introducing divergent long-term drift signatures. The RN73R2BTTD5113F100 (RN732B variant with tighter processing) could exhibit improved stability but may carry cost or lead-time tradeoffs. In calibration-grade applications where the RN732BTTD5113F100 is part of a trimmed divider network, component substitution should be validated through parallel characterization across temperature and storage cycles. For general signal conditioning where ±1% absolute tolerance dominates design margin, substitution risk is lower; however, system-level recalibration is prudent if substitution affects impedance-critical RF or high-speed analog paths.
What is the actual power dissipation headroom of the RN732BTTD5113F100 in continuous-operation circuits, and how does the 1206 package footprint limit thermal relief options?
The RN732BTTD5113F100 is rated for 0.125W (1/8W) continuous dissipation in free-air conditions, corresponding to approximately 8 mA RMS current capability at 511 kOhms (√(0.125W × 511kΩ) ≈ 8mA). The 1206 (3.20mm × 1.60mm) surface-mount package offers limited thermal mass; without active heatsinking or thermal vias, the RN732BTTD5113F100 relies on PCB copper area for heat spreading. In high-impedance biasing networks (100+ MΩ dividers or leakage-current paths), the RN732BTTD5113F100 dissipates milliwatts and operates well below thermal stress. However, in transimpedance amplifier feedback networks where 0.5 V DC bias or AC signal swing is applied across the 511 kOhm resistor, operating margins narrow. Practical guidance: if steady-state power approaches 75 mW in the RN732BTTD5113F100, consider 1/4W packages or derated operating temperatures; if thermal cycling is anticipated, verify that the RN732BTTD5113F100 remains below 100°C junction temperature to preserve long-term reliability and minimize resistance drift.
Why does the RN732BTTD5113F100 specify ±100ppm/°C temperature coefficient when higher-precision applications demand stability below ±50ppm/°C?
The RN732BTTD5113F100 is engineered as a general-purpose thin-film resistor balancing cost, process margin, and manufacturing throughput. KOA's ±100ppm/°C specification reflects typical thin-film deposition tolerances and annealing processes; achieving ±25ppm/°C or lower requires specialized substrate conditioning, tighter process control, and higher screening costs. For high-precision applications requiring sub-50ppm/°C stability, component selection should shift to precision grades (RN73 High-Precision or Vishay Precision Foil variants), which command 2-3× cost premiums. The RN732BTTD5113F100 remains appropriate for sensor linearization networks, non-ratiometric signal conditioning, and reference dividers where absolute temperature stability is secondary to ratiometric matching between paired resistors. In temperature-compensated circuits where two RN732BTTD5113F100 resistors are paired on the same PCB region, their ±100ppm/°C drifts tend to track, making relative tolerance more stable than absolute drift suggests. Design strategy: validate whether the application requires absolute stability (pushing toward precision grades) or ratiometric stability (where the RN732BTTD5113F100 is cost-effective).
Is the RN732BTTD5113F100 suitable for analog-to-digital converter (ADC) input impedance matching, and what acquisition time penalties result from its 511 kOhm value?
The RN732BTTD5113F100 presents 511 kOhms of series resistance, which impacts ADC sampling circuits. Modern ADCs (8–16 bit, 100 kSPS+) specify input impedance (typically 10–100 kΩ) and sampling capacitance (5–50 pF). The RC time constant formed by the RN732BTTD5113F100 and ADC input capacitance ranges from 2.5 µs to 25 µs, depending on ADC architecture. For 10 kSPS or slower conversions, settling is adequate; at 1 MSPS, the RN732BTTD5113F100 introduces 5–10% converter error without additional buffering or input filtering. The RN732BTTD5113F100 is suitable for pre-filtering roles (combining with a capacitor to form anti-aliasing networks with corner frequencies of 50–300 Hz), but direct ADC input coupling should be verified against the converter's settling-time requirements. For impedance-matched reference dividers in ratiometric measurements, the RN732BTTD5113F100 is appropriate; for high-speed data acquisition, interposing an op-amp buffer or selecting lower-impedance dividers (100–200 kΩ range) is recommended.
How do the RoHS3 compliance and REACH unaffected status of the RN732BTTD5113F100 affect component qualification for automotive and medical device design?
The RN732BTTD5113F100 is RoHS3 compliant and REACH unaffected, meaning it meets EU heavy-metal and restricted substance directives without exemptions. For automotive Grade 1 (AEC-Q200) or medical Class II device qualification, this status simplifies supply-chain compliance but does not confer automotive or medical device certification by itself. The RN732BTTD5113F100 carries ECCN EAR99 (unrestricted commercial classification), enabling standard international distribution. In automotive applications, the RN732BTTD5113F100 can be qualified as a standard resistor component within a larger functional safety assessment (ISO 26262), but the resistor itself requires no automotive-specific testing. For medical devices, the RN732BTTD5113F100 enters Bill of Materials as a standard passive component; system-level biocompatibility, sterilization compatibility, and electromagnetic emissions testing supersede the resistor-level certification. Practical implication: RoHS3 and REACH compliance reduce procurement delays and conflict-minerals documentation, but do not eliminate the need for system-level qualification review when the RN732BTTD5113F100 is integrated into regulated applications.
What are the failure modes and degradation mechanisms of the RN732BTTD5113F100 when exposed to repeated thermal cycling between -55°C and +155°C?
The RN732BTTD5113F100 experiences three primary degradation pathways under thermal cycling: (1) thin-film layer stress from differential thermal expansion of the substrate and metal deposition, causing permanent resistance drift (typically 0.5–2% cumulative shift after 500+ cycles); (2) solder-joint fatigue at the 1206 terminations, exacerbated by the large thermal swings and 3.20mm × 1.60mm package geometry; (3) moisture ingress if the moisture-resistant coating is compromised by mechanical stress or contamination. Long-term reliability data suggest the RN732BTTD5113F100 tolerates ±100°C thermal swings (e.g., -40°C to +85°C industrial range) with <1% drift over 1000 cycles; the full -55°C to +155°C excursion introduces 3–5× stress concentration. For aerospace or demanding industrial applications, the RN732BTTD5113F100 should be evaluated through accelerated thermal cycle testing (IPC-TM-650 or MIL-STD-883 standards). In automotive underbody circuits experiencing repeated engine bay thermal transients, the RN732BTTD5113F100 remains acceptable but should be paired with PCB design practices that minimize mechanical strain (avoid placing the RN732BTTD5113F100 near board edges or high-stress mounting points).
How should the RN732BTTD5113F100 be integrated into precision current-sense or transimpedance feedback networks to maximize ±1% tolerance benefit?
The RN732BTTD5113F100's ±1% tolerance is most effectively leveraged in ratiometric measurement topologies where absolute values are less critical than ratio stability. In transimpedance amplifiers (photodiode or X-ray detector front-ends), the RN732BTTD5113F100 as feedback resistor determines transimpedance gain: 511 kΩ ±1% yields a ±1% gain tolerance, directly translating to output error. To maximize performance: (1) pair the RN732BTTD5113F100 with equally tolerant input/feedback networks to avoid tolerance stack-up; (2) locate the RN732BTTD5113F100 close to the op-amp inverting input, minimizing parasitic impedance; (3) use guard traces or Kelvin connections if input current levels exceed 1 µA to suppress leakage coupling. In precision current-sense applications (measuring sub-milliamp currents), a shunt resistor network using matched RN732BTTD5113F100 pairs offers better performance than individual hand-selected resistors. Trimmer potentiometers in parallel or series with the RN732BTTD5113F100 can provide factory calibration to absorb manufacturing tolerance and temperature drift, resulting in net 0.1–0.2% accuracy at room temperature.
Can the RN732BTTD5113F100 be used in RF impedance matching or high-frequency signal conditioning, and what frequency limitations apply?
The RN732BTTD5113F100 is a dc-biased thin-film resistor without specified high-frequency parameters (no frequency-dependent loss, inductance, or reactance data). Below 10 MHz, the RN732BTTD5113F100 behaves as a pure resistor; package parasitic inductance (estimated 0.3–0.8 nH for a 1206 device) becomes negligible. Above 100 MHz, thin-film substrate dielectric loss and termination inductance begin to alter impedance; by 1 GHz, the RN732BTTD5113F100 exhibits frequency-dependent behavior unsuitable for precise impedance matching. For RF applications, use dedicated thick-film or carbon-film resistors with specified high-frequency parameters and lower parasitic reactance. The RN732BTTD5113F100 remains suitable for: low-frequency impedance networks (< 100 kHz), bias resistors in RF amplifier stages (where the 511 kOhm value decouples RF signal from DC biasing), and input/output termination in baseband instrumentation. In mixed-signal designs where the RN732BTTD5113F100 bridges RF and analog baseband sections, verify that RF signal coupling through the resistor does not degrade signal-to-noise ratio; if coupling is critical, use dedicated RF termination resistors rated for impedance control.
What is the effective sheet resistance and tolerance stack-up when using arrays of RN732BTTD5113F100 resistors in precision divider or network configurations?
The RN732BTTD5113F100 operates as a discrete thin-film device with ±1% individual tolerance, rather than a laser-trimmed network. When building precision dividers using two RN732BTTD5113F100 resistors in series or parallel, tolerance combines quadratically: a 2-resistor divider exhibits approximately √(1%² + 1%²) ≈ 1.4% output tolerance before accounting for temperature coefficient mismatch. To achieve sub-1% divider accuracy, component selection strategies include: (1) factory-matched pairs (KOA offers sorted RN73 resistors with tighter pair tolerance, typically ±0.1% or ±0.25%); (2) post-assembly laser trimming of one resistor to compensate divider ratio; (3) ratiometric calibration in firmware for ADC-based measurements. The RN732BTTD5113F100 sheet resistance is not typically specified for discrete components; the quoted ±1% applies to absolute resistance value, not sheet resistance uniformity. For applications requiring precision networks, integrated resistor networks or thin-film hybrid modules with laser-trimmed matching offer superior performance; the RN732BTTD5113F100 remains a cost-effective general-purpose choice for single-resistor functions or loosely matched networks.
What PCB layout and thermal design practices best preserve the temperature coefficient stability of the RN732BTTD5113F100 in production environments?
The RN732BTTD5113F100 exhibits ±100ppm/°C temperature coefficient, translating to ~5 Ω per °C resistance change at its 511 kOhm nominal value. PCB layout practices to minimize temperature-induced variation: (1) co-locate matched RN732BTTD5113F100 pairs (e.g., in divider networks) within a 5–10 mm region to ensure thermal symmetry; (2) avoid placing the RN732BTTD5113F100 adjacent to high-power components (switching converters, amplifiers) or on the periphery of thermal hot spots; (3) use thermal spreading via arrays under nearby high-dissipation devices to equalize board temperature; (4) if the RN732BTTD5113F100 is part of a calibration network, co-locate it with temperature sensors to enable software compensation. In manufacturing environments with ambient temperature swings (20°C to 40°C), the RN732BTTD5113F100 exhibits ~1–2 kOhm variation, acceptable for most applications. For precision metrology or aerospace systems requiring <0.1% temperature stability, consider active thermal management (PCB heaters or temperature-controlled enclosures) or select precision resistor grades with ±25ppm/°C specifications.
How does the 0.028" maximum seated height of the RN732BTTD5113F100 affect board assembly density and coplanarity in high-volume manufacturing?
The RN732BTTD5113F100 in 1206 package has maximum seated height of 0.028" (0.70 mm), reflecting standard thin-film chip resistor dimensions. This low profile enables dense PCB layouts with minimal vertical clearance (suitable for <5 mm board-to-enclosure spacing) and supports 2-pass assembly processes. In automated pick-and-place equipment, the RN732BTTD5113F100 coplanarity tolerance (typically ±0.05–0.1 mm across a PCB panel) is easily accommodated by modern placement machines, eliminating hand-sorting or height-matching requirements. High-volume production benefits: the RN732BTTD5113F100's low, consistent height prevents solder bridge formation in dense layouts and reduces reflow profile sensitivity compared to taller passives. In mixed-technology assemblies (combining 0402, 0603, 0805, and 1206 packages), the RN732BTTD5113F100 presents no coplanarity risk if PCB pad design and solder paste volume are optimized to each footprint. Potential concern: if the RN732BTTD5113F100 is placed on warped PCB panels or printed at reduced solder paste thickness (<50% nominal), height variation can degrade reflow wetting; quality control emphasis should include in-process height verification for boards exceeding 500 × 500 mm dimension.
What are the long-term aging and shelf-life stability characteristics of the RN732BTTD5113F100, and how do storage conditions affect resistance drift?
The RN732BTTD5113F100 exhibits minimal long-term aging in controlled storage (15–25°C, 30–70% relative humidity). Thin-film resistors are inherently stable; aging drift is typically <0.5% over 10 years under standard conditions. The moisture-resistant construction and MSL 1 rating mean the RN732BTTD5113F100 does not require desiccant packaging or controlled humidity during storage, simplifying logistics. Accelerated aging tests (85°C/85% RH for 1000 hours per IEC 60068-2-30) suggest cumulative drift of 1–2% for the RN732BTTD5113F100, broadly consistent with datasheet tolerance. Practical implications: components in sealed, climate-controlled warehouses exhibit negligible change; components subject to temperature cycling or humidity extremes may drift toward the upper tolerance limit. For critical applications (medical device spares, aerospace long-lead projects), periodic measurement of sample RN732BTTD5113F100 batches stored for >3 years is recommended. Manufacturing floor hold-time is typically 12–24 months without performance degradation; once soldered into populated boards, the RN732BTTD5113F100 stabilizes within weeks, with aging rate dropping below 0.1% per year.

Parts with Similar Specifications

The three parts on the right have similar specifications to KOA Speer Electronics, Inc. RN732BTTD5113F100

Product Attribute RN732BTTD5112F100 RN732BTTD5113D100 RN732BTTD5113F50 RN732BTTD5113F25
Part Number RN732BTTD5112F100 RN732BTTD5113D100 RN732BTTD5113F50 RN732BTTD5113F25
Manufacturer KOA Speer Electronics, Inc. KOA Speer Electronics, Inc. KOA Speer Electronics, Inc. KOA Speer Electronics, Inc.
Height - Seated (Max) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Number of Terminations - - - -
Size / Dimension - - - -
Power (Watts) - - - -
Composition - - - -
Features - - - Simultaneous Sampling
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Tolerance - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Resistance - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Temperature Coefficient - - - -

RN732BTTD5113F100 Datasheet PDF

Download RN732BTTD5113F100 pdf datasheets and KOA Speer Electronics, Inc. documentation for RN732BTTD5113F100 - KOA Speer Electronics, Inc..

Datasheets
RN73 Series Datasheet.pdf
PCN Obsolescence/ EOL
Mult Series 24/May/2021.pdf

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RN732BTTD5113F100 Image

RN732BTTD5113F100

KOA Speer Electronics, Inc.
98D-RN732BTTD5113F100

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