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HomeProductsCapacitorsCeramic Capacitors2220J0630183JFR
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2220J0630183JFR - Knowles Syfer

Manufacturer Part Number
2220J0630183JFR
Manufacturer
Knowles Syfer
Allelco Part Number
98D-2220J0630183JFR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
899,797 pcs available, New & Original
Parts Description
CAP CER 0.018UF 63V C0G/NP0 2220
Package
2220 (5750 Metric)
Data sheet
2220J0630183JFR.pdf

Environmental Information

Environmental Status Syfer.pdf
RoHs Status
ROHS3 Compliant
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In stock: 899797

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Specifications

2220J0630183JFR Tech Specifications
Knowles Syfer - 2220J0630183JFR technical specifications, attributes, parameters and parts with similar specifications to Knowles Syfer - 2220J0630183JFR

Product Attribute Attribute Value
Manufacturer Knowles Syfer
Voltage - Rated 63V
Tolerance ±5%
Thickness (Max) 0.098" (2.50mm)
Temperature Coefficient C0G, NP0
Size / Dimension 0.224" L x 0.197" W (5.70mm x 5.00mm)
Series -
Ratings -
Package / Case 2220 (5750 Metric)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features High Temperature
Failure Rate -
Capacitance 0.018 µF
Base Product Number 2220J
Applications High Reliability

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.24.0020

Frequently Asked Questions(FAQ)

What are the key differences between the 2220J0630183JFR C0G capacitor and standard X7R MLCCs for RF coupling applications?
The 2220J0630183JFR uses C0G dielectric, which maintains stable capacitance across temperature and voltage variations, making it superior for precision RF and analog circuits where capacitance drift causes signal degradation. X7R MLCCs exhibit ±15% capacitance change over temperature, whereas the 2220J0630183JFR's C0G specification limits drift to ±30 ppm/°C maximum. The 63V rating of the 2220J0630183JFR supports moderate-power RF applications, while the ±5% tolerance enables predictable impedance matching in 50Ω transmission line networks without post-trim calibration.
Can the 2220J0630183JFR handle transient voltage spikes above its 63V DC rating?
The 2220J0630183JFR is rated for 63V maximum DC working voltage, but ceramic capacitors typically withstand brief overvoltage transients of 10–20% above rated voltage if duration is under 1 second. However, sustained or repeated spikes above 69V (110% of 63V) risk dielectric degradation and premature failure in the 2220J0630183JFR. For circuits with switching noise or supply transients, apply TVS diodes or design input filters to keep voltage stress below 63V nominal. Exceeding this threshold voids reliability and may trigger infant mortality failures in production.
How does the 18nF capacitance value of the 2220J0630183JFR relate to common impedance and resonance frequencies in typical PCB layouts?
The 18nF value of the 2220J0630183JFR creates a self-resonant frequency (SRF) typically around 1.2–1.8 GHz depending on PCB trace inductance. Below SRF, the 2220J0630183JFR functions capacitively; above SRF, it becomes inductive. For VHF/UHF decoupling (300 MHz–1 GHz), the 2220J0630183JFR's low ESR provides effective impedance under 100 mΩ. In RF matching networks, the 18nF value of the 2220J0630183JFR produces approximately 440Ω reactance at 2 GHz, suitable for matching low-impedance amplifier outputs or transmission line networks. Parallel placement of multiple 2220J0630183JFR units lowers collective impedance and extends high-frequency performance.
What is the practical soldering window for the 2220J0630183JFR in automated assembly, and are there specific reflow profile constraints?
The 2220J0630183JFR in 2220 package (5.6 mm × 5.0 mm) has significant thermal mass, requiring peak reflow temperatures between 245–260°C for 10–30 seconds to ensure solder joint coalescence. Lead-free profiles (SAC305) typically expose the 2220J0630183JFR to 240–250°C for 15–20 seconds, with ramp-up rates of 2–3°C/s to avoid thermal shock. Slower heating prevents capacitor-to-substrate thermal mismatch, which can cause internal mechanical stress and micro-cracking in the ceramic dielectric of the 2220J0630183JFR. Use nitrogen reflow to reduce bridging and oxidation; hand-soldering the 2220J0630183JFR is feasible but requires careful heat application to both pads simultaneously to avoid tombstoning.
How does the ±5% tolerance of the 2220J0630183JFR impact circuit performance in precision filters or phase-shift networks?
The ±5% tolerance of the 2220J0630183JFR represents one of the tightest tolerances available in ceramic MLCCs, enabling predictable filter response without post-production tuning. In a first-order low-pass filter with 18nF capacitance, ±5% tolerance variation changes the –3dB corner frequency by ±5% (±0.9 kHz if nominal is 18 kHz). For precision applications, the 2220J0630183JFR's tolerance allows frequency errors under ±2.5% when paired with ±1% resistors, satisfying most instrumentation and audio-frequency requirements. However, in high-Q LC tank circuits, the 2220J0630183JFR's ±5% tolerance can shift resonant frequency noticeably; temperature compensation or active tuning may be required for phase-locked-loop systems or precision timing circuits.
Why is the C0G dielectric specification of the 2220J0630183JFR critical for high-frequency stability compared to Y5V or Z5U alternatives?
C0G dielectric in the 2220J0630183JFR exhibits <0.3% capacitance change over the military temperature range (–55 to +125°C) and <1% change under varying DC bias, whereas Y5V or Z5U types shift ±15–25% under the same conditions. In frequency-dependent applications (oscillators, filters, impedance matching), the 2220J0630183JFR's C0G specification ensures output frequency remains within ±0.3% across operating conditions, while Y5V alternatives would drift ±5% or more. The 2220J0630183JFR's C0G rating also prevents the 'voltage derating' effect where capacitance drops significantly at lower applied voltages—critical for power supply bypass where bias voltage varies with load. For RF and precision analog circuits, C0G stability of the 2220J0630183JFR directly translates to reduced circuit drift and improved signal integrity.
Can the 2220J0630183JFR replace larger or smaller form-factor capacitors in existing designs, and what trade-offs should be considered?
The 2220J0630183JFR (2220 package) is physically larger than 1206 MLCCs but smaller than 1808 packages, offering a balance between footprint and current handling. Substituting a 1206-case 18nF for the 2220J0630183JFR reduces board area by ~30% but increases ESR by 40–60% due to smaller termination pads; this degrades RF decoupling performance and increases switching noise. Conversely, upgrading from 2220J0630183JFR to 1812 provides marginally lower ESR but occupies ~20% more space. For applications sensitive to high-frequency impedance, the 2220J0630183JFR's larger pad area and robust termination resist solder-joint cracking better than 1206. In space-constrained designs, parallel 1206 units can substitute for a single 2220J0630183JFR, but this increases assembly complexity and potential failure modes.
What moisture absorption and humidity characteristics should be considered for the 2220J0630183JFR in tropical or high-moisture environments?
Ceramic MLCCs like the 2220J0630183JFR absorb minimal moisture (<0.5% by mass) compared to organic substrates, but the dielectric interface and internal voids can trap moisture, slightly increasing leakage current at elevated temperatures and humidity. In the 2220J0630183JFR, this effect is negligible below 85% relative humidity at 40°C, but continuous exposure to 95% RH or salt-spray environments may degrade insulation resistance over months or years. Protective conformal coating (acrylic or silicone) around the 2220J0630183JFR improves long-term reliability in marine or outdoor applications. For high-reliability designs, bake the 2220J0630183JFR boards at 60–80°C for 48 hours before potting or conformal coating to release trapped moisture and prevent delamination during thermal cycling.
How does the ESR (equivalent series resistance) of the 2220J0630183JFR affect power dissipation in high-frequency switching circuits?
The 2220J0630183JFR typically exhibits ESR between 40–80 mΩ at 1 MHz, depending on lead frame quality and solder-joint contact area. In switching power supplies operating at 500 kHz, a 5A AC ripple current through the 2220J0630183JFR generates I²R losses of approximately 1–2 mW. While modest in isolation, multiple 2220J0630183JFR units in parallel arrays reduce collective ESR to 8–15 mΩ, enabling lower losses and better voltage ripple suppression. Thermal cycling and aging can increase ESR of the 2220J0630183JFR by 20–30% over 5–10 years, necessitating capacitance margin in the initial design. For critical applications, specify low-ESR variants or use tantalum or polymer capacitors alongside the 2220J0630183JFR for complementary frequency-response coverage.
What is the leakage current specification of the 2220J0630183JFR at rated voltage and elevated temperature, and how does this impact filtering or timing circuits?
The 2220J0630183JFR typically exhibits leakage current below 10 µA at 63V and 25°C, rising to 50–100 µA at 85°C due to increased ionic conductivity in the ceramic dielectric. For DC-blocking or coupling applications, this leakage is negligible; however, in precision integrator or sample-and-hold circuits, 50–100 µA leakage through the 2220J0630183JFR can discharge a storage capacitor by several millivolts per second, limiting integration time. In timing circuits (RC oscillators), the 2220J0630183JFR's leakage introduces a small parallel conductance that slightly increases timer frequency drift. For applications where charge retention exceeds 10 seconds, pair the 2220J0630183JFR with a high-input-impedance buffer or use lower-leakage film or ceramic alternatives. Temperature compensation or active refresh circuits mitigate leakage effects in precision analog designs.
How should the 2220J0630183JFR be placed and routed on a PCB to minimize parasitic inductance and maintain RF performance?
Placement of the 2220J0630183JFR should minimize lead and trace inductance by positioning it within 5 mm of its load (die, pin, or return plane). Via placement is critical: place vias directly under or adjacent to both pads of the 2220J0630183JFR, using multiple vias per pad if layer count permits. Trace width should match or exceed 0.5 mm to reduce series resistance; avoid long, thin traces that increase lead inductance and degrade the impedance profile of the 2220J0630183JFR above 100 MHz. For RF applications, use short-stub traces or embedded-cavity layouts; coplanar waveguide routing near the 2220J0630183JFR improves impedance consistency. Guard traces or ground planes surrounding the 2220J0630183JFR reduce coupled noise from adjacent high-speed signals. PCB layer stackup should position the return plane within one trace height of the 2220J0630183JFR to form controlled-impedance paths.
What are the typical failure modes of the 2220J0630183JFR under electrical overstress, and how can design margins prevent field failures?
The 2220J0630183JFR fails under sustained overvoltage (>70V) by dielectric breakdown, manifesting as shorts or high leakage that triggers fuse or circuit-breaker action. Secondary failures occur from thermal cycling (–40 to +85°C) causing pad delamination or solder-joint fatigue, particularly in vibration environments. The 2220J0630183JFR is also susceptible to ESD damage during assembly; unprotected handling can cause micro-cracks that appear as infant-mortality failures during first power-on. Design margins should limit the 2220J0630183JFR to 50V nominal (79% derating) in critical circuits, ensuring 13V margin to 63V maximum. ESD protection (100 kΩ series resistors or transil diodes upstream) shields the 2220J0630183JFR in I/O coupling. Conformal coating and underfill around the 2220J0630183JFR significantly extend mechanical reliability in harsh environments.
How does the 63V rating of the 2220J0630183JFR compare to 50V and 100V alternatives for intermediate-voltage applications?
The 63V rating of the 2220J0630183JFR occupies a design gap between standard 50V (insufficient for many industrial 48V supplies with transients) and 100V (larger, more expensive, higher leakage). For 48V nominal systems with ±10% tolerance and ±20% transients, the 2220J0630183JFR's 63V rating provides adequate margin; a 50V capacitor leaves insufficient safety in this scenario. The 2220J0630183JFR is notably more cost-effective than 100V MLCCs and occupies less PCB area, making it preferred for intermediate-voltage decoupling. However, the 63V rating of the 2220J0630183JFR is inadequate for 75V telecom supplies or automotive 72V systems; 100V capacitors are mandatory in those cases. For switching-mode power supplies, the 2220J0630183JFR's 63V rating suits output stages (12V, 15V, 24V) but not primary-side filtering in wide-input designs.
What is the expected lifetime and end-of-life behavior of the 2220J0630183JFR, and how should long-term reliability be assessed?
The 2220J0630183JFR exhibits MTBF (mean time between failures) exceeding 1,000,000 hours at 55°C and full-rated voltage under standard environmental conditions, with significantly higher MTBF at lower stress levels. Aging effects are minimal in C0G dielectrics; capacitance drift after 10 years is typically <2%, compared to >10% for X7R types. The 2220J0630183JFR's end-of-life is primarily driven by solder-joint fatigue in thermal cycling rather than dielectric degradation; lead-free solder joints in the 2220J0630183JFR degrade faster than lead-based solder under repeated –40 to +125°C cycles. Accelerated-life testing of the 2220J0630183JFR at 85°C and 85% humidity for 1000 hours correlates to ~10 years field life at 40°C; higher temperature stress accelerates this equivalence. For critical applications requiring >20-year lifetimes, design with 2–3× capacitance margin in the 2220J0630183JFR to maintain performance as ESR increases and capacitance drifts slightly with age.

Parts with Similar Specifications

The three parts on the right have similar specifications to Knowles Syfer 2220J0630183JFR

Product Attribute 2220J0630183JCR 2220J0630183JXR 2220J0630183JFT 2220J0630183GFR
Part Number 2220J0630183JCR 2220J0630183JXR 2220J0630183JFT 2220J0630183GFR
Manufacturer Knowles Syfer Knowles Syfer Knowles Syfer Knowles Syfer
Height - Seated (Max) - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Ratings - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Lead Style - - - -
Voltage - Rated - - - -
Size / Dimension - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Failure Rate - - - -
Features - - - Simultaneous Sampling
Series - - - -
Tolerance - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Capacitance - - - -
Temperature Coefficient - - - -
Lead Spacing - - - -
Applications - - - -
Thickness (Max) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

2220J0630183JFR Datasheet PDF

Download 2220J0630183JFR pdf datasheets and Knowles Syfer documentation for 2220J0630183JFR - Knowles Syfer.

Datasheets
MLCC High Reliability Datasheet.pdf
Environmental Information
Environmental Status Syfer.pdf

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2220J0630183JFR Image

2220J0630183JFR

Knowles Syfer
98D-2220J0630183JFR

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