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HomeProductsCapacitorsCeramic Capacitors2225J6K00330GCT
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2225J6K00330GCT - Knowles Syfer

Manufacturer Part Number
2225J6K00330GCT
Manufacturer
Knowles Syfer
Allelco Part Number
98D-2225J6K00330GCT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
38,321 pcs available, New & Original
Parts Description
CAP CER 33PF 6KV C0G/NP0 2225
Package
2225 (5763 Metric)
Data sheet
2225J6K00330GCT.pdf

Environmental Information

Environmental Status Syfer.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 38321
  • Unit Price: $4.612
  • Subtotal: $0.00

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Specifications

2225J6K00330GCT Tech Specifications
Knowles Syfer - 2225J6K00330GCT technical specifications, attributes, parameters and parts with similar specifications to Knowles Syfer - 2225J6K00330GCT

Product Attribute Attribute Value
Manufacturer Knowles Syfer
Voltage - Rated 6000V (6kV)
Tolerance ±2%
Thickness (Max) 0.098" (2.50mm)
Temperature Coefficient C0G, NP0 (1B)
Size / Dimension 0.224" L x 0.248" W (5.70mm x 6.30mm)
Series -
Ratings -
Package / Case 2225 (5763 Metric)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features -
Failure Rate -
Capacitance 33 pF
Base Product Number 2225J
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.24.0020

Frequently Asked Questions(FAQ)

What makes the 2225J6K00330GCT suitable for high-voltage filtering applications compared to standard ceramic capacitors?
The 2225J6K00330GCT is rated for 6000V, which places it in the high-voltage class and enables direct use in circuits operating above 1kV without requiring series or parallel arrangements for voltage division. Standard multilayer ceramic capacitors (MLCCs) typically operate at 50V to 500V, making the 2225J6K00330GCT approximately 12 to 120 times higher in voltage capability. This single-component approach reduces board space, simplifies layout, and eliminates the reliability concerns associated with voltage-sharing resistors or balancing networks. The C0G/NP0 temperature coefficient ensures that the 33 pF capacitance remains stable across the -55°C to 125°C operating range, critical for precision filtering where capacitance drift would degrade high-voltage DC bus regulation or RF circuit performance.
How does the ±2% tolerance of the 2225J6K00330GCT affect timing and resonant frequency calculations in resonant tank circuits?
The ±2% tolerance of the 2225J6K00330GCT translates to a capacitance range of 32.34 pF to 33.66 pF. In resonant circuits, resonant frequency is proportional to 1/√(LC), so a ±2% capacitance variation produces approximately ±1% frequency shift. For example, in a tank circuit designed around 50 MHz with the 2225J6K00330GCT, frequency could drift ±500 kHz across the tolerance band. This drift is typically managed through tuning inductors, trimmer capacitors, or software-based frequency correction in phase-locked loops. The tight tolerance minimizes the required tuning range and reduces design margin consumption, allowing narrower bandwidth filtering or more precise oscillator center frequency without external trimming in some applications.
Why is MSL 1 (Unlimited) moisture sensitivity on the 2225J6K00330GCT beneficial for lead-free soldering and storage protocols?
MSL 1 rating on the 2225J6K00330GCT means the component absorbs negligible moisture and requires no floor-life time tracking or pre-reflow baking. Lead-free soldering processes operate at 260°C peak temperature, approximately 30–50°C higher than lead-based processes. Without MSL 1 classification, components with higher moisture sensitivity (MSL 2–4) risk internal delamination or popcorning when moisture absorbed during storage rapidly expands during reflow. The 2225J6K00330GCT can be stored in standard dry-pack pouches and deployed immediately without bake-out procedures, reducing manufacturing cycle time and eliminating a failure mode. This simplifies supply chain handling, particularly for high-volume production where coordinating bake schedules across multiple component types introduces logistics complexity.
What is the physical footprint difference between the 2225J6K00330GCT and competing 1812 case size capacitors for similar voltage ratings?
The 2225J6K00330GCT measures 5.70 mm × 6.30 mm × 2.50 mm (2225 metric case), while a comparable 1812 case size is 4.57 mm × 3.05 mm. Although the 2225 footprint is larger in length and width, it accommodates 6kV operation in a single component without series stacking. Two 1812 capacitors in series to achieve 6kV would consume approximately 9.14 mm length on the board, plus routing space for the intermediate node connection and any voltage-balancing resistors. The 2225J6K00330GCT's single-component approach reduces component count, solder joints, and interconnect routing, offsetting the absolute size difference in high-density designs. For applications where board space per circuit function is the limiting factor, the 2225J6K00330GCT consolidates function more efficiently than parallel or series arrangements of smaller capacitors.
How does the C0G/NP0 temperature coefficient of the 2225J6K00330GCT compare to X7R alternatives in precision analog signal conditioning?
The 2225J6K00330GCT carries C0G/NP0 classification, guaranteeing zero temperature coefficient (±30 ppm/°C maximum over -55°C to 125°C). X7R capacitors, by contrast, allow ±15% capacitance change over this temperature range. For a 33 pF value, X7R could drift ±4.95 pF, introducing filter cutoff frequency shifts of several percent in AC coupling or DC blocking applications. The 2225J6K00330GCT maintains repeatable 33 pF performance across temperature, enabling precision coupling in photodiode transimpedance amplifiers, charge-sensitive detectors, and precision instrumentation where temperature-induced gain drift must be minimized. In high-frequency analog frontends operating across wide temperature ranges, X7R would require temperature compensation circuitry or post-manufacturing calibration; the 2225J6K00330GCT eliminates this design overhead.
What precautions are necessary when routing high-voltage traces near the 2225J6K00330GCT to prevent field concentration and arc-over?
At 6kV operation, the 2225J6K00330GCT experiences internal electric field stress of approximately 2.4 MV/cm (6000V ÷ 2.5 mm thickness), near the ceramic dielectric breakdown threshold. PCB routing must maintain adequate creepage distances—typically 2–3 mm per kV for PCB traces, so 12–18 mm minimum spacing between the 2225J6K00330GCT terminals and any trace at different potential. Avoid routing high-voltage signals directly over or under the component where fringing fields can couple to nearby low-voltage signal traces. Via placement should not be clustered immediately adjacent to 2225J6K00330GCT pads, as via-to-pad field concentration can initiate tracking or surface discharge. Additionally, the 2225J6K00330GCT should be mounted away from board edges and avoid placement in regions subject to mechanical stress, as ceramic capacitor failure modes under mechanical shock combined with high voltage can result in sudden internal short circuits rather than gradual degradation.
Is the 2225J6K00330GCT appropriate for energy storage in pulsed power applications, or is it limited to filtering and coupling?
The 2225J6K00330GCT's 33 pF capacitance and 6kV rating store only 5.94 µJ of energy (E = ½CV² = 0.5 × 33 × 10⁻¹² × 6000² = 5.94 µJ), making it unsuitable as a primary energy storage element for pulsed power. However, the 2225J6K00330GCT excels in fast transient energy transfer roles—snubbing, coupling RF pulses, or stabilizing voltage supplies during nanosecond-scale transients where charge redistribution, not bulk energy, is the design objective. In high-frequency RF applications or switching power supplies where 6kV transients occur at microsecond or nanosecond timescales, the 2225J6K00330GCT provides effective decoupling and dv/dt control. Designers requiring bulk energy storage at 6kV typically combine the 2225J6K00330GCT with electrolytic or film capacitors of much higher capacitance, with the 2225J6K00330GCT serving a secondary role in transient suppression or high-frequency filtering.
How does RoHS3 compliance of the 2225J6K00330GCT affect procurement decisions for automotive and medical device design?
The 2225J6K00330GCT carries RoHS3 (and REACH Unaffected) compliance, confirming absence of lead, cadmium, hexavalent chromium, and other restricted substances. This enables direct use in automotive applications governed by EU directives and medical device supply chains requiring lead-free component documentation. Automotive suppliers appreciate the 2225J6K00330GCT's compliance because regulatory audits are simplified and component traceability aligns with supply chain transparency requirements. For medical devices, RoHS3 compliance reduces supply chain risk; components that become restricted mid-production cycle can trigger redesigns or costly component substitutions. The MSL 1 rating combined with RoHS3 compliance means the 2225J6K00330GCT can be procured from multiple suppliers without renegotiating environmental or processing specifications, improving long-term design stability and reducing single-source procurement risk.
What is the expected operational lifespan of the 2225J6K00330GCT under continuous 6kV bias, and how does voltage derating affect reliability?
Ceramic capacitor lifespan under continuous bias is governed by insulation resistance degradation and electrochemical ion migration within the dielectric. Under full 6kV bias at 125°C, the 2225J6K00330GCT experiences the highest electromigration stress. Industry empirical data suggests operational lifetimes of 10+ years at rated voltage and temperature, though specific failure rate data is manufacturer-dependent and not uniformly published. Conservative designs often apply 50–80% derating, operating the 2225J6K00330GCT at 3–4.8 kV to dramatically extend lifespan and reduce failure probability. A design operating at 3 kV achieves approximately 10× the lifetime relative to 6 kV operation due to inverse exponential dependence of ion migration on applied field. In aerospace or long-life medical implants, 50% derating of the 2225J6K00330GCT may be standard practice; in consumer electronics with shorter mission profiles, full-rating operation is acceptable.
How should the 2225J6K00330GCT be tested during incoming quality assurance to verify 6kV rating integrity?
Incoming testing of the 2225J6K00330GCT should include dielectric withstand voltage (DWV) testing at 1.5× rated voltage (9 kV) for 60 seconds minimum, as defined in IEC 60384-1. This high-voltage stress screening identifies latent defects—internal voids, contamination, or manufacturing inconsistencies—that would cause early failure in production. Capacitance measurement at 1 MHz verifies the 33 pF nominal and ±2% tolerance. Insulation resistance testing (typically 1000 VDC applied for 1 minute) confirms the dielectric barrier integrity; a measurement below 100 GΩ flags potential moisture ingress or contamination. For critical applications, thermoshock cycling (-55°C to 125°C, 10–20 cycles) can accelerate stress-induced failures before components enter production. Temperature coefficient verification across the operating range confirms C0G/NP0 stability. These tests are particularly important for the 2225J6K00330GCT because defects that slip through manufacturing may catastrophically fail under 6kV stress during field operation, causing collateral circuit damage.
What are the dissipation factor and equivalent series resistance (ESR) characteristics of the 2225J6K00330GCT at RF frequencies, and how do these affect high-frequency circuit performance?
Ceramic capacitors exhibit frequency-dependent dissipation factor (DF) and ESR. The 2225J6K00330GCT, as a C0G/NP0 type, typically exhibits DF of 0.15–0.3% at 1 MHz, increasing to 0.5–1% at 100 MHz and higher frequencies. ESR is nominally 10–100 mΩ at MHz frequencies but can rise significantly above 100 MHz due to lead inductance and dielectric loss. In RF resonant tank circuits, elevated ESR at the operating frequency introduces Q degradation, lowering circuit selectivity and increasing bandwidth. For a 50 MHz resonant circuit using the 2225J6K00330GCT, ESR contributions of 50–200 mΩ reduce Q by approximately 10–30%, broadening the 3 dB bandwidth. Designers compensate by using low-inductance surface-mount placement, minimizing trace routing length, and, for extreme high-frequency applications (>500 MHz), potentially selecting alternate capacitor technologies with lower ESR. The 2225J6K00330GCT remains appropriate for most RF coupling and resonant applications below 200 MHz where high voltage is the primary design constraint.
Can the 2225J6K00330GCT be paralleled with lower-voltage capacitors to reduce overall cost in high-voltage DC bus filtering without reliability degradation?
Paralleling the 2225J6K00330GCT (6kV) with lower-voltage capacitors (e.g., 1.6kV or 2.5kV rated) is not recommended for DC bus applications because voltage division is uncontrolled. In parallel connection without series resistors, all capacitors charge to the full applied voltage; the lower-rated capacitor would immediately exceed its voltage rating and fail catastrophically. If cost reduction is the objective, external voltage-dividing resistors (typically 1–10 MΩ) can be connected in series with lower-voltage capacitors to share the voltage stress. However, this introduces current leakage paths, power dissipation, and additional component complexity. A simpler approach is to parallel multiple 2225J6K00330GCT units to increase total capacitance while maintaining voltage rating. For example, two 2225J6K00330GCT units in parallel provide 66 pF at 6kV. This approach maintains design reliability and simplifies manufacturing; the added cost per unit is typically lower than the engineering overhead of voltage-divider networks.
How does the 2225 package size of the 2225J6K00330GCT scale in cost and performance relative to 1210 or 1206 case sizes in lower-voltage applications where 6kV is not required?
The 2225J6K00330GCT's larger footprint (5.70 × 6.30 mm) versus 1210 (3.2 × 2.5 mm) or 1206 (3.2 × 1.6 mm) reflects the higher dielectric thickness and larger electrode area required to withstand 6kV stress safely. In applications requiring only 500V or 1kV, smaller case sizes (1206, 1210) offer identical 33 pF capacitance at significantly lower material cost and superior board density. However, the 2225J6K00330GCT's cost premium is justified when 6kV operation eliminates series-stacking requirements or voltage-sharing networks. A designer comparing 2225J6K00330GCT single-component cost against two 1210 capacitors in series (plus resistors and routing) often finds the 2225J6K00330GCT economically competitive when assembly, testing, and reliability factors are included. For high-volume consumer applications at low voltage, smaller packages are preferred; for industrial, medical, or aerospace applications where 6kV is mandatory and component reliability is critical, the 2225J6K00330GCT's cost becomes less significant relative to system performance and safety requirements.

Parts with Similar Specifications

The three parts on the right have similar specifications to Knowles Syfer 2225J6K00330GCT

Product Attribute 2225J6K00331GCT 2225J6K00330JCT 2225J6K00330FCT 2225J6K00330GCR
Part Number 2225J6K00331GCT 2225J6K00330JCT 2225J6K00330FCT 2225J6K00330GCR
Manufacturer Knowles Syfer Knowles Syfer Knowles Syfer Knowles Syfer
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Failure Rate - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Applications - - - -
Lead Style - - - -
Series - - - -
Features - - - Simultaneous Sampling
Thickness (Max) - - - -
Temperature Coefficient - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Lead Spacing - - - -
Tolerance - - - -
Height - Seated (Max) - - - -
Voltage - Rated - - - -
Size / Dimension - - - -
Capacitance - - - -
Ratings - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

2225J6K00330GCT Datasheet PDF

Download 2225J6K00330GCT pdf datasheets and Knowles Syfer documentation for 2225J6K00330GCT - Knowles Syfer.

HTML Datasheet
MLCC Capacitor Datasheet.pdf
Environmental Information
Environmental Status Syfer.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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2.00kg-3.00kg USD$50.00 - USD$100.00
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2225J6K00330GCT Image

2225J6K00330GCT

Knowles Syfer
98D-2225J6K00330GCT

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