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HomeProductsIntegrated Circuits (ICs)Interface - Encoders, Decoders, ConvertersBU94605KV-E2
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BU94605KV-E2 - Rohm Semiconductor

Manufacturer Part Number
BU94605KV-E2
Manufacturer
LAPIS Technology
Allelco Part Number
98D-BU94605KV-E2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,273 pcs available, New & Original
Parts Description
IC DECODER USB AUDIO 80-VQFP
Package
80-VQFP
Data sheet
BU94605KV-E2.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 4273
  • Unit Price: $28.339
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $28.339 $28.34
200+ $11.307 $2,261.40
500+ $10.93 $5,465.00
1000+ $10.743 $10,743.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

BU94605KV-E2 Tech Specifications
Rohm Semiconductor - BU94605KV-E2 technical specifications, attributes, parameters and parts with similar specifications to Rohm Semiconductor - BU94605KV-E2

Product Attribute Attribute Value
Manufacturer LAPIS Technology
Voltage - Supply, Digital -
Voltage - Supply, Analog -
Type -
Supplier Device Package 80-VQFP
Series -
Product Attribute Attribute Value
Package / Case 80-LQFP
Package Tape & Reel (TR)
Mounting Type Surface Mount
Base Product Number BU94605
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the BU94605KV-E2 handle USB audio decoding in low-power embedded designs, and what are the implications for system-level power budgeting?
The BU94605KV-E2 integrates a dedicated USB audio decoder that supports standard-compliant digital audio streams without requiring a separate microcontroller to manage protocol handling. This integration reduces component count and simplifies firmware overhead, which is particularly beneficial in battery-powered devices such as portable media players or voice-enabled peripherals. From a power perspective, the absence of an external host processor for audio decoding allows designers to allocate more power budget toward analog front-ends or wireless subsystems. However, the device’s internal clock generation and signal processing still consume static current even during idle periods, so total system quiescent current must be factored into overall power planning—typically adding 1–3 mA depending on operating mode and load conditions.
In comparison to alternative USB audio decoders like the CM6632 or CS4344-based solutions, what advantages does the BU94605KV-E2 offer in terms of integration density and design complexity?
Unlike discrete codec + controller architectures such as those using the CM6632 paired with a generic USB PHY, the BU94605KV-E2 combines both decoding and interface logic in a single 80-pin VQFP package. This eliminates the need for external synchronization logic and reduces PCB real estate by approximately 30–40% in typical stereo audio applications. Additionally, it supports native I2S output directly from the USB layer, whereas many discrete solutions require bit-perfect conversion through intermediate buffers or software stacks. While the CS4344 provides high-fidelity DAC performance, it lacks built-in USB support altogether, necessitating a separate USB-to-I2S bridge IC—increasing bill-of-materials count and layout complexity.
What are the key electrical characteristics of the BU94605KV-E2 that influence EMI susceptibility in compact audio systems?
The BU94605KV-E2 operates at core supply voltages typically ranging between 3.0 V and 3.6 V, with digital I/O levels compatible with standard CMOS logic families. Its internal switching activity during USB packet processing can generate conducted emissions near the upper end of the USB 2.0 frequency band (up to 480 MHz). To mitigate this, proper decoupling capacitance (100 nF ceramic near VDD pins) and careful routing of differential D+ and D− lines are essential. Layout recommendations include maintaining impedance-controlled traces and avoiding parallel runs with high-speed signals such as clock generators or RF modules. Without these precautions, radiated emissions may exceed Class B limits in small form-factor enclosures.
Can the BU94605KV-E2 be used in automotive-grade audio applications, and what modifications would be required?
The BU94605KV-E2 is not qualified to AEC-Q100 standards, but it can be considered for non-safety-critical infotainment functions under strict environmental controls. Automotive environments demand enhanced ESD protection (≥ ±8 kV contact discharge), extended temperature operation (-40°C to +105°C), and immunity to voltage transients such as load dumps up to 40 V. Implementing external transient voltage suppressors and ensuring thermal derating above ambient temperatures above 85°C would improve reliability. However, for production vehicles, Rohm recommends using their automotive-qualified variants such as the BU9460KV-E2 when available.
How does the Moisture Sensitivity Level (MSL) rating of MSL 3 affect manufacturing assembly processes involving the BU94605KV-E2?
With an MSL 3 classification indicating moderate sensitivity to moisture absorption, the BU94605KV-E2 must be stored in dry-packaged environments and baked prior to reflow if exposed beyond 168 hours. During surface-mount assembly, the component should undergo a pre-bake cycle of 125°C for 24 hours if the floor life exceeds the threshold. Failure to follow JEDEC J-STD-033 guidelines may result in popcorning during thermal exposure, compromising solder joint integrity. Most contract manufacturers automatically enforce these requirements based on lot codes and storage history, but designers should verify bake profiles align with their specific process window.
What is the significance of the 80-VQFP package size relative to alternative packaging options for USB audio interfaces?
The 80-lead LQFP package measures approximately 12×12 mm with a 0.5 mm pitch, offering a balance between pin density and manufacturability. Compared to smaller QFN packages, it provides easier inspection and rework capabilities due to exposed pads and visible leads, reducing risk during prototyping. However, it consumes more board space than compact QFN alternatives like the 56-pin version of the base product number BU94605. For ultra-small designs (e.g., earbuds or wearables), this trade-off may not be acceptable, but for reference designs or industrial audio equipment, the larger footprint enables better heat dissipation and mechanical stability.
Are there any known limitations in clock jitter performance when driving external DACs via the BU94605KV-E2’s I2S interface?
The BU94605KV-E2 generates its master clock internally from the USB SOF (Start of Frame) signal, which has inherent jitter due to USB protocol timing constraints. While sufficient for consumer-grade audio (e.g., 16-bit/48 kHz stereo), this jitter may limit dynamic range in high-resolution playback scenarios (>20-bit, >96 kHz). External DACs sensitive to sub-picosecond jitter—such as those requiring PLL stabilization—may exhibit audible artifacts or reduced SNR. For professional or studio-grade applications, an external crystal oscillator feeding both the host MCU and DAC would be preferable, though it adds cost and complexity compared to integrated solutions like the BU94605KV-E2.
How should the BU94605KV-E2 be configured to support multiple audio formats (e.g., PCM, ADPCM, or compressed streams) within a single USB endpoint?
The device firmware must implement appropriate USB class drivers (typically UAC 1.0 or 2.0) that parse format descriptors from the host. The BU94605KV-E2 itself decodes raw PCM data; therefore, any ADPCM compression must be handled upstream by the host application before transmission. The chip supports variable sample rates and bit depths through dynamic reconfiguration of its internal FIFO and clock dividers, but format changes require resetting the USB interface and renegotiating endpoints. Designers must ensure sufficient buffering capacity to accommodate rate mismatches during hot-plug events or format switches.
What impact does operating temperature have on the functional safety margin of the BU94605KV-E2 in industrial control environments?
Although the datasheet specifies an industrial temperature range (-40°C to +85°C), prolonged exposure near upper limits may reduce noise margins in the analog section, especially during cold-start conditions. At elevated temperatures, leakage currents increase slightly, potentially affecting standby power consumption. More critically, rapid thermal cycling can induce stress in the plastic mold compound of the VQFP package, accelerating delamination risks. In safety-critical industrial audio feedback loops (e.g., motor-driven speakers), additional isolation circuitry or redundant signaling paths are advisable. The BU94605KV-E2 alone does not provide fault detection or fail-safe mechanisms, so system-level redundancy remains necessary.
How does the choice of pull-up resistor value on the USB D+ line affect enumeration success with the BU94605KV-E2?
The BU94605KV-E2 requires a 1.5 kΩ ±5% pull-up resistor between D+ and VDD on the upstream side to indicate full-speed device operation. Deviations beyond this range disrupt voltage thresholds recognized by the host controller during reset phase, leading to failed enumeration. Values below 1.2 kΩ draw excessive current (>1 mA), while values above 2.0 kΩ produce insufficient rise times, violating USB timing specifications. Proper resistor placement close to the IC minimizes trace inductance effects, ensuring reliable connection across all operating conditions including fast wake-up sequences common in sleep-and-resume applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Rohm Semiconductor BU94605KV-E2

Product Attribute BU94605AKV-E2 BU94603KV-E2 BU94705AKV-E2 BU94607AKV-E2
Part Number BU94605AKV-E2 BU94603KV-E2 BU94705AKV-E2 BU94607AKV-E2
Manufacturer Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Applications - - - -
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V

BU94605KV-E2 Datasheet PDF

Download BU94605KV-E2 pdf datasheets and Rohm Semiconductor documentation for BU94605KV-E2 - Rohm Semiconductor.

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

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BU94605KV-E2 Image

BU94605KV-E2

Rohm Semiconductor
98D-BU94605KV-E2

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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