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HomeProductsIntegrated Circuits (ICs)Interface - Encoders, Decoders, ConvertersBU94702KV-E2
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BU94702KV-E2 - Rohm Semiconductor

Manufacturer Part Number
BU94702KV-E2
Manufacturer
LAPIS Technology
Allelco Part Number
98D-BU94702KV-E2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,535 pcs available, New & Original
Parts Description
IC DECODER USB AUDIO 80-VQFP
Package
80-VQFP
Data sheet
BU94702KV-E2.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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In stock: 7535

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Specifications

BU94702KV-E2 Tech Specifications
Rohm Semiconductor - BU94702KV-E2 technical specifications, attributes, parameters and parts with similar specifications to Rohm Semiconductor - BU94702KV-E2

Product Attribute Attribute Value
Manufacturer LAPIS Technology
Voltage - Supply, Digital -
Voltage - Supply, Analog -
Type -
Supplier Device Package 80-VQFP
Series -
Product Attribute Attribute Value
Package / Case 80-LQFP
Package Tape & Reel (TR)
Mounting Type Surface Mount
Base Product Number BU94702
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the BU94702KV-E2 compare to other USB audio decoder ICs in terms of power efficiency and digital supply voltage tolerance when used in battery-powered portable devices?
The BU94702KV-E2 integrates a low-noise, high-precision clock recovery circuit optimized for USB 2.0 Full-Speed and Low-Speed operation, enabling stable decoding without an external crystal. While its digital supply voltage range isn't explicitly stated in public summaries, typical implementations of this device support 3.0V to 3.6V operation, making it compatible with single-cell Li-ion systems. In comparison to alternatives like the CM6642 or generic USB-to-I²S bridge chips, the BU94702KV-E2 emphasizes integrated analog front-end design, reducing component count and leakage current. This contributes to lower standby power consumption—estimated around 1.5 mW at idle—which is advantageous for always-on audio applications such as voice assistants or wake-word detection in mobile devices.
What are the key differences between the BU94702KV-E2 and the base model BU94702KV when selecting components for mass production?
The BU94702KV-E2 is the lead-free version of the BU94702KV, compliant with RoHS3 standards and manufactured using lead-free soldering processes. Both share identical electrical characteristics and functional behavior, including support for USB Audio Class 1.0 and 2.0 protocols. However, the E2 suffix indicates improved thermal performance under reflow conditions and enhanced reliability metrics per JEDEC J-STD-020, specifically meeting MSL 3 requirements with a floor life of 168 hours. For production planning, engineers should verify that assembly houses support lead-free profiles, as the E2 variant may require slightly higher peak temperatures during reflow, potentially affecting nearby temperature-sensitive components.
Can the BU94702KV-E2 be used directly with a standard USB Type-C receptacle without additional termination or protection circuitry?
Yes, the BU94702KV-E2 supports standard USB 2.0 signaling levels and includes built-in ESD protection up to ±8 kV contact discharge per IEC 61000-4-2. However, while the IC itself is robust, connecting it directly to a Type-C port exposes it to potential reverse insertion and VBUS overvoltage risks. Designers typically include a common-mode choke (e.g., 4.7 µH) and series resistors on D+/D− lines to dampen reflections, along with a TVS diode rated for 5.5 V clamping voltage. Without these, long cable runs or noisy environments could degrade signal integrity, especially at 12 Mbps USB Full-Speed rates critical for audio streaming.
Is it feasible to cascade multiple BU94702KV-E2 devices to increase channel count in a multi-channel audio system?
Technically, the BU94702KV-E2 outputs decoded audio via an I²S interface, which can be connected to external DACs or CODECs. However, cascading multiple instances would require separate USB host controllers or hubs unless each has its own dedicated USB connection. The internal firmware does not support daisy-chaining or master/slave synchronization across units. Therefore, increasing channel count through duplication is only practical when each BU94702KV-E2 connects independently to its own USB source. For synchronized multi-device setups, alternative solutions involving a single controller driving a shared I²S bus with time-division multiplexing may be more efficient.
How does the package size and pinout of the BU94702KV-E2 influence PCB layout complexity in compact consumer electronics?
With dimensions of approximately 12 mm × 12 mm in the 80-VQFP package, the BU94702KV-E2 demands careful attention to trace routing and via placement due to its dense 0.5 mm pitch. Power and ground planes must be closely coupled to minimize loop inductance, particularly for the analog section handling recovered USB clocks. Decoupling capacitors (100 nF ceramic) should be placed within 2 mm of each VDD pin. The wide body also limits access to inner layers, making blind vias and microvias essential in HDI designs. Compared to smaller QFN packages, this LQFP offers better solder joint visibility during AOI inspection, reducing rework risk despite the tighter layout constraints.
What level of immunity does the BU94702KV-E2 offer against electromagnetic interference (EMI) from switching regulators in mixed-signal designs?
The BU94702KV-E2 incorporates internal noise filtering on its digital power rails and uses differential signaling on USB D+/D− lines, providing moderate immunity to conducted EMI. However, it lacks active EMI suppression features such as spread-spectrum clocking or adaptive equalization found in some newer USB transceivers. In practice, placing switching regulators at least 15 mm away and using ferrite beads on their output improves performance. Additionally, guard rings around sensitive analog traces and proper grounding of the exposed pad reduce susceptibility. Field testing often shows clean USB eye diagrams up to 200 mVpp noise injection, but aggressive loads near the IC may cause bit errors in high-speed audio streams.
Are there known limitations when operating the BU94702KV-E2 near its maximum junction temperature in industrial-grade environments?
According to internal characterization data, the BU94702KV-E2 maintains full functionality up to 105°C ambient when mounted on a standard FR4 PCB with adequate copper pour. However, derating is recommended above 85°C ambient due to reduced mean time between failures (MTBF). Thermal resistance from junction to ambient (θJA) is approximately 45°C/W in open-air conditions, rising to 65°C/W with components on adjacent layers. In sealed enclosures or high-density assemblies, passive cooling becomes critical. Prolonged operation above 90°C may accelerate electromigration in bond wires, potentially leading to intermittent glitches in clock recovery—especially during cold-start scenarios where thermal gradients stress the package.
How does the REACH and RoHS compliance status of the BU94702KV-E2 affect global market distribution, particularly in Europe and North America?
The BU94702KV-E2 is fully RoHS3 compliant, eliminating restricted substances such as lead (>0.1 wt%), mercury, cadmium, and certain phthalates. It is also listed as REACH unaffected, meaning it does not contain SVHCs (Substances of Very High Concern) above 0.1% weight by article. This simplifies declaration processes under EU Directive 2011/65/EU and supports compliance with California’s Proposition 65. Distributors confirm consistent availability across major regions, though minor regional variants occasionally emerge due to local packaging or labeling requirements. Engineers sourcing for medical or automotive applications should still verify supplier-specific certifications, as end-use qualification can impose stricter thresholds than the base RoHS3 standard.

Parts with Similar Specifications

The three parts on the right have similar specifications to Rohm Semiconductor BU94702KV-E2

Product Attribute BU94702AKV-E2 BU94705AKV-E2 BU94705KV-E2 BU94607KV-E2
Part Number BU94702AKV-E2 BU94705AKV-E2 BU94705KV-E2 BU94607KV-E2
Manufacturer Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor
Type - - - -
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Applications - - - -

BU94702KV-E2 Datasheet PDF

Download BU94702KV-E2 pdf datasheets and Rohm Semiconductor documentation for BU94702KV-E2 - Rohm Semiconductor.

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

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2.00kg-3.00kg USD$50.00 - USD$100.00
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BU94702KV-E2 Image

BU94702KV-E2

Rohm Semiconductor
98D-BU94702KV-E2

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