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HomeProductsConnectors, InterconnectsCircular ConnectorsHEG.2T.319.CLLP
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HEG.2T.319.CLLP - LEMO

Manufacturer Part Number
HEG.2T.319.CLLP
Manufacturer
LEMO
Allelco Part Number
98D-HEG.2T.319.CLLP
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
40,012 pcs available, New & Original
Parts Description
Circular Metal
Package
Bulk
Data sheet
-
RoHs Status
 
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In stock: 40012
  • Unit Price: $162.68
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $162.68 $162.68
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

HEG.2T.319.CLLP Tech Specifications
LEMO - HEG.2T.319.CLLP technical specifications, attributes, parameters and parts with similar specifications to LEMO - HEG.2T.319.CLLP

Product Attribute Attribute Value
Manufacturer LEMO
Voltage Rating -
Termination Solder Cup
Shielding Shielded
Shell Size, MIL -
Shell Size - Insert 319
Shell Material Brass
Shell Finish Chrome
Series 2T
Primary Material Metal
Package Bulk
Orientation G
Operating Temperature -20°C ~ 80°C
Number of Positions 19
Mounting Type Panel Mount
Product Attribute Attribute Value
Mounting Feature Bulkhead - Front Side Nut
Material Flammability Rating UL94 V-0
Insert Material Polyetheretherketone (PEEK)
Ingress Protection IP68 - Dust Tight, Waterproof
Features Potted
Fastening Type Push-Pull
Current Rating (Amps) 5A
Contact Material Bronze
Contact Finish Thickness - Mating -
Contact Finish - Mating Gold
Connector Type Receptacle, Female Sockets
Color Silver
Cable Opening -
Backshell Material, Plating -
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 8536.69.4020

Frequently Asked Questions(FAQ)

What environmental sealing capability does the HEG.2T.319.CLLP provide, and how does IP68 rating apply to subsea or high-moisture aerospace applications?
The HEG.2T.319.CLLP achieves IP68 classification, meaning it is dust-tight and fully submersible under continuous water pressure. In practical terms, this allows the connector to maintain electrical integrity when submerged to depths typical of subsea sensor arrays or immersed in high-humidity industrial environments. The potted design of the HEG.2T.319.CLLP seals internal cavities, preventing moisture ingress through the connector body itself. However, sealing performance depends on proper mating with a compatible plug and correct installation of any backshell potting; incomplete sealing at the cable entry point can compromise the rated IP68 protection of the HEG.2T.319.CLLP.
How does the PEEK insert material in the HEG.2T.319.CLLP affect thermal cycling reliability compared to standard phenolic inserts?
The HEG.2T.319.CLLP uses polyetheretherketone (PEEK) as the insert material, which offers superior thermal cycling stability relative to phenolic compounds. PEEK maintains dimensional consistency across the -20°C to 80°C operating range of the HEG.2T.319.CLLP with a coefficient of thermal expansion closer to that of metal contact springs, reducing stress-induced contact resistance drift. This becomes significant in avionics or automotive thermal-shock scenarios (e.g., rapid cabin pressurization changes). Phenolic inserts in competing connectors may experience micro-cracking or creep over hundreds of thermal cycles, whereas the HEG.2T.319.CLLP insert resists such degradation. The trade-off is higher material cost and slightly reduced machinability during manufacturing.
What is the practical current-handling difference between the HEG.2T.319.CLLP and a standard 37-position circular connector, and how does the 5A per-contact rating scale across the 19-position configuration?
The HEG.2T.319.CLLP is rated for 5A per individual contact across its 19 positions, yielding a theoretical aggregate capacity of 95A if all positions carry rated current. However, real-world power distribution through the HEG.2T.319.CLLP is limited by contact mating pressure uniformity and backshell thermal dissipation. In contrast, larger 37-position connectors typically support 5–10A per contact but have greater conductor cross-section within each pin and superior heat spreading through the shell. For mixed-signal applications (e.g., sensors and analog control lines sharing the HEG.2T.319.CLLP), the 19-position count forces designers to segregate high-current power lines (preferably <3A per contact to maintain margin) from low-current signal lines, whereas larger connectors allow more generous current distribution. The HEG.2T.319.CLLP's compact form factor makes it attractive for space-constrained enclosures but introduces thermal design considerations absent in larger alternatives.
How do the push-pull fastening and bulkhead front-side nut mounting of the HEG.2T.319.CLLP influence field maintenance cycles and connector reliability?
The HEG.2T.319.CLLP employs a push-pull mating mechanism, allowing operators to connect and disconnect without threaded coupling rings, reducing cycle time and the risk of cross-threading common in screw-locked connectors. The bulkhead front-side nut mounting of the HEG.2T.319.CLLP secures the receptacle directly to a panel with a single nut on the mating face, simplifying installation and supporting blind-side connector insertion in confined spaces. Reliability benefits emerge over high-cycle-count applications: each mating event on the HEG.2T.319.CLLP exerts repeatable, controlled axial force via the push-pull collar, whereas screw-coupled alternatives introduce torque-dependent variability in mating pressure. In avionics maintenance depots or field repair scenarios, the HEG.2T.319.CLLP design reduces training overhead and mating-error rates. However, push-pull connectors require more precise alignment during insertion; misalignment can damage the guide pins of the HEG.2T.319.CLLP if operators apply excessive force. The trade-off is speed and consistency versus the margin for rough handling.
What contact degradation should be expected over 500 mating cycles of the HEG.2T.319.CLLP, and how does the gold-plated mating finish compare to nickel alternatives?
The HEG.2T.319.CLLP features gold plating on the mating contacts, which resists corrosion and maintains low contact resistance across repeated insertions. Over 500 mating cycles, gold-plated contacts on the HEG.2T.319.CLLP typically exhibit minimal wear when engaged with similarly gold-plated plug contacts; measured resistance drift is generally <5% of the initial value under moderate environmental conditions. Nickel-plated alternatives would show more pronounced resistance rise due to oxide formation and wear-through of the plating, especially in humid environments. However, the HEG.2T.319.CLLP's gold finish adds cost and offers diminishing returns in low-cycle applications (e.g., permanent installations with <10 disconnect events). The contact material beneath the gold plating on the HEG.2T.319.CLLP is bronze, which provides structural support but introduces galvanic considerations: if the gold plating of the HEG.2T.319.CLLP is compromised, bronze oxidation can occur in corrosive environments, degrading contact resistance faster than a nickel-over-copper stack would.
How does the solder cup termination of the HEG.2T.319.CLLP integrate with high-frequency impedance-controlled backshells, and what soldering profile is required?
The HEG.2T.319.CLLP receptacle features solder cup terminations, allowing direct wire attachment via conventional wave or reflow soldering. Solder cups on the HEG.2T.319.CLLP accommodate 16–20 AWG stranded or solid wire, with typical joint reliability verified through thermal-cycling and vibration testing per MIL-DTL-38999 standards. For high-frequency applications (RF or controlled-impedance backhaul), the HEG.2T.319.CLLP's solder cup design introduces a transition region where conductor diameter changes from cable to cup opening; this creates a minor impedance discontinuity in the range of 5–10% if the solder joint is not filled uniformly. To minimize reflection losses, designers using the HEG.2T.319.CLLP should employ a low-residue solder process (lead-free SAC305 or lead-based 63/37 tin/lead) applied at 250–260°C peak temperature for 3–5 seconds. Over-heating or excessive solder volume on the HEG.2T.319.CLLP can degrade the insert material and increase connection resistance. The potted design of the HEG.2T.319.CLLP adds complexity to soldering; backshell potting should be applied only after all solder work is complete to avoid thermal damage to the potting compound.
Can the HEG.2T.319.CLLP be substituted for a standard MIL-DTL-38999 connector in legacy defense platforms, and what compatibility risks exist?
The HEG.2T.319.CLLP is designed to MIL-DTL-38999 mechanical standards and shares the 319 shell size and 19-position pin count with legacy connectors, but direct substitution requires detailed verification of pin assignments, contact geometry, and plating thickness. The HEG.2T.319.CLLP uses PEEK inserts, whereas older MIL-spec connectors may employ phenolic or polyimide materials; dimensional differences of 0.005–0.010 inches can accumulate, potentially causing mating force variations or alignment errors in the HEG.2T.319.CLLP. Additionally, the potted design of the HEG.2T.319.CLLP adds weight and changes the thermal profile, which may affect cable strain relief in existing brackets. Historical MIL-spec platforms often specify contact plating thickness (e.g., 50 microinches of gold over nickel), whereas the HEG.2T.319.CLLP may differ in plating stack unless explicitly ordered to a legacy specification. Before deploying the HEG.2T.319.CLLP in a retrofit application, conduct mating force measurements, insertion/extraction testing, and electrical resistance validation on a representative sample to detect assembly-induced incompatibilities.
What is the effective cable-side solder cup pull-out strength of the HEG.2T.319.CLLP under vibration, and how does wire gauge selection influence mechanical reliability?
The solder cup termination of the HEG.2T.319.CLLP is designed to accommodate 16–20 AWG wire; pull-out strength under tensile load (measured per MIL-DTL-38999) typically ranges from 25–50 lbf, depending on solder volume and wire stranding. Under continuous vibration (e.g., 5–500 Hz sweep, 2G acceleration), the HEG.2T.319.CLLP solder joint experiences cyclic stress at the solder-wire interface. If undersized wire (smaller than 20 AWG) is used in the HEG.2T.319.CLLP, the contact area between wire and solder cup decreases, reducing both pull-out strength and vibration fatigue life; literature suggests that using 20 AWG in the HEG.2T.319.CLLP reduces fatigue cycles-to-failure by 40–60% compared to 16 AWG under identical vibration profiles. Conversely, oversized wire (larger than 16 AWG) cannot be fully accommodated in the HEG.2T.319.CLLP solder cup geometry, leading to incomplete solder wetting and stress concentration. Best practice for the HEG.2T.319.CLLP in high-vibration platforms (aerospace, marine) is to use 18–20 AWG wire with stranded construction, apply strain relief tubing 0.5–1.0 inches from the solder joint, and validate pull-out strength on production samples.
How does the chrome-plated brass shell of the HEG.2T.319.CLLP perform in saltwater or high-corrosion environments compared to stainless steel alternatives?
The HEG.2T.319.CLLP shell is constructed from brass with a chrome finish. Chrome plating provides corrosion resistance suitable for typical industrial and military environments but is not ideal for continuous saltwater exposure or corrosive chemical atmospheres. In marine applications, the HEG.2T.319.CLLP's chrome coating can develop pitting after 6–12 months of immersion if the plating thickness is nominal (25–50 microinches). Once pitting initiates on the HEG.2T.319.CLLP, galvanic corrosion accelerates because the underlying brass becomes exposed and electrochemically active relative to the remaining chrome layer. Stainless steel connectors (typically 303 or 316 alloy) offer superior saltwater performance and require significantly less maintenance than the HEG.2T.319.CLLP in such environments. However, stainless alternatives to the HEG.2T.319.CLLP are more expensive and heavier, making them unsuitable for weight-constrained aerospace platforms. For subsea applications, the HEG.2T.319.CLLP should be specified with thicker chrome plating (≥75 microinches) or supplemented with conformal coating and regular inspection intervals. The IP68 rating of the HEG.2T.319.CLLP protects the internal contact cavity but does not prevent external corrosion of the shell itself.
What UL94 V-0 flammability rating means for the HEG.2T.319.CLLP in aerospace pressurized cabins, and how does this relate to fuselage safety requirements?
The HEG.2T.319.CLLP carries a UL94 V-0 flammability rating, meaning the insert material (PEEK) self-extinguishes within 30 seconds after flame removal and produces limited smoke during combustion. In aerospace pressurized cabins, UL94 V-0 compliance is a minimum requirement for any internal component to meet federal airworthiness standards (FAA Part 23/25). The rating applies specifically to the PEEK insert of the HEG.2T.319.CLLP; it does not extend to the metal shell, which is inherently non-flammable. During a cabin fire scenario, the HEG.2T.319.CLLP will not sustain flames or contribute to fire propagation beyond the local region of the connector. However, UL94 V-0 testing is conducted under controlled laboratory conditions (small-scale specimens, fixed flame source, specific geometry); the HEG.2T.319.CLLP's actual thermal behavior in a full-scale cabin fire depends on surrounding materials, heat flux, and ventilation. The V-0 rating of the HEG.2T.319.CLLP provides assurance for certification purposes but does not guarantee zero smoke generation or absence of toxic decomposition byproducts. Aircraft integrators using the HEG.2T.319.CLLP should cross-reference the connector against specific aircraft certification plans and materials review board approvals to confirm acceptability.
How does the 19-position configuration of the HEG.2T.319.CLLP compare functionally to smaller 13-position or larger 37-position alternatives for mixed-signal payload wiring?
The HEG.2T.319.CLLP's 19-position layout occupies a middle ground between compact 13-position connectors and larger 37-position connectors, each with distinct trade-offs. A 13-position alternative offers smaller footprint and weight, appealing to size-constrained applications, but forces aggressive signal multiplexing or separate connector bundles, increasing harness complexity and mean-time-to-repair. The HEG.2T.319.CLLP provides sufficient pins for a typical mixed-signal payload: 2–3 power rails (accounting for redundancy), 8–10 differential or single-ended sensor lines, and 3–4 control/communication channels, all within a single mated pair. In contrast, a 37-position connector delivers more pin real estate, allowing cleaner signal separation (dedicated ground planes, more physical distance between high-current and low-level analog lines), but increases connector mass by 40–60%, creates assembly labor overhead, and may introduce unnecessary complexity for applications not requiring full pin capacity. The HEG.2T.319.CLLP strikes a practical balance: field technicians recognize the connector type, spare inventory remains manageable, and the 5A per-contact rating accommodates typical sensor power budgets. For applications requiring strict analog signal isolation or high-current distribution (>20A aggregate), the HEG.2T.319.CLLP may become limiting, necessitating an upsized connector.
What are the long-term storage and shelf-life considerations for the HEG.2T.319.CLLP, especially regarding potted backshells and contact oxidation?
The HEG.2T.319.CLLP, when stored in original packaging at room temperature (15–25°C) and moderate humidity (<65% RH), maintains full performance characteristics for 3–5 years. The potted design of the HEG.2T.319.CLLP can be affected by extended exposure to ultraviolet light or extreme temperature fluctuations during storage; potting compounds may become brittle or develop micro-cracks if stored in direct sunlight or in uncontrolled environments. The gold-plated contacts of the HEG.2T.319.CLLP are resistant to tarnishing but can accumulate surface oxidation on the bronze substrate if the potted backshell is compromised or the connector is exposed to high-humidity storage conditions. Best practice for long-term inventory of the HEG.2T.319.CLLP includes storage in dry, dark conditions (e.g., sealed bags with desiccant cartridges), periodic visual inspection for potting cracks or discoloration, and mating force validation on a representative connector every 2 years. For mission-critical applications, especially aerospace platforms with multi-year operational lifespans, integrate the HEG.2T.319.CLLP into a formal connector maintenance and replacement schedule rather than assuming indefinite shelf stability.
How should the HEG.2T.319.CLLP be specified in procurement to ensure compliance with military or aerospace configuration standards and avoid counterfeit or non-conformant substitutes?
When procuring the HEG.2T.319.CLLP for regulated environments (defense, space, aviation), specify the complete part number and include supplementary requirements to ensure conformance. Beyond the manufacturer part number HEG.2T.319.CLLP, procurement should mandate a source inspection certificate (MIL-STD-1916 AQL 1.0 or equivalent), plating thickness confirmation (e.g., gold plate to ≥50 microinches per MIL-C-14550), and material certifications for the PEEK insert and bronze contacts. The HEG.2T.319.CLLP should be obtained directly from LEMO or through authorized distributors who maintain traceability documentation; third-party marketplace vendors may supply counterfeit or salvaged connectors with non-conformant plating, incorrect insert material, or marginal contact resistance. Request samples of the HEG.2T.319.CLLP for electrical testing (contact resistance at 1A, 5A, and cold-solder conditions) before committing to production quantities. Include in the procurement specification a requirement for lot-traceability documentation and periodic revalidation testing on storage lots of the HEG.2T.319.CLLP to detect long-term drift in contact resistance or potting integrity.

Parts with Similar Specifications

The three parts on the right have similar specifications to LEMO HEG.2T.319.CLLP

Product Attribute HEG.2T.319.CLVP HEG.2K.319.CLNPV HEG.2K.314.CLLPV HEG.2T.308.CLLP
Part Number HEG.2T.319.CLVP HEG.2K.319.CLNPV HEG.2K.314.CLLPV HEG.2T.308.CLLP
Manufacturer LEMO LEMO LEMO LEMO
Number of Positions - - - -
Applications - - - -
Color - - - -
Contact Material - - - -
Shell Material - - - -
Connector Type - - - -
Fastening Type - - - -
Primary Material - - - -
Cable Opening - - - -
Termination - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Shell Size - Insert - - - -
Current Rating (Amps) - - - -
Material Flammability Rating - - - -
Shell Size, MIL - - - -
Contact Finish Thickness - Mating - - - -
Contact Finish - Mating - - - -
Backshell Material, Plating - - - -
Shell Finish - - - -
Mounting Feature - - - -
Voltage Rating - - - -
Ingress Protection - - - -
Orientation - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Insert Material - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Features - - - Simultaneous Sampling
Series - - - -
Shielding - - - -

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LEMO

HEG.2T.319.CLLP

LEMO
98D-HEG.2T.319.CLLP

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