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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LCMXO2-4000HC-6FTG256C~~

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LCMXO2-4000HC-6FTG256C - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LCMXO2-4000HC-6FTG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-4000HC-6FTG256C
Price: 5.56 USD
Availability: InStock
Rating: 5 (3 reviews)

Manufacturer Part Number: LCMXO2-4000HC-6FTG256C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LCMXO2-4000HC-6FTG256C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 8,465 pcs available, New & Original

Parts Description: IC FPGA 206 I/O 256FTBGA

Package: 256-FTBGA (17x17)

Data sheet: LCMXO2-4000HC-6.pdf

Datasheets
MachXO2 Family Datasheet.pdf MachXO2 Family Handbook.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Assembly/Origin
Alternate Assembly/Test Site 14/Apr/2014.pdf

PCN Design/Specification
Datasheet Chg 21/Mar/2016.pdf MachXO2 Family Datasheet 30/Sep/2013.pdf

PCN Other
I2C Read-Back Failure Feb/2015.pdf

Getting Started Guide
Product Selector Guide.pdf

RoHs Status: ROHS3 Compliant

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Specifications

LCMXO2-4000HC-6FTG256C Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-4000HC-6FTG256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-4000HC-6FTG256C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.375V ~ 3.465V
Total RAM Bits	94208
Supplier Device Package	256-FTBGA (17x17)
Series	MachXO2
Package / Case	256-LBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	4320
Number of LABs/CLBs	540
Number of I/O	206
Mounting Type	Surface Mount
Base Product Number	LCMXO2-4000

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Parts Introduction

LCMXO2-4000HC-6FTG256C (1)

Manufacturer Part Number

LCMXO2-4000HC-6FTG256C

Manufacturer

Lattice Semiconductor

Introduction

Embedded FPGA providing designers with flexible integration capabilities

Product Features and Performance

540 LABs/CLBs

4320 Logic Elements/Cells

94208 Total RAM Bits

206 Number of I/O

Voltage Range of 2.375V to 3.465V

Surface Mountable on PCBs

Operating Temperature Range 0°C to 85°C

Product Advantages

Optimized for low power consumption

Designed for easy implementation and fast reconfiguration

Key Technical Parameters

Number of LABs/CLBs: 540

Number of Logic Elements/Cells: 4320

Total RAM Bits: 94208

Number of I/O: 206

Voltage Supply Range: 2.375V ~ 3.465V

Operating Temperature Range: 0°C ~ 85°C

Package: 256-LBGA

Mounting Type: Surface Mount

Base Product Number: LCMXO2-4000

Quality and Safety Features

Robust construction for reliable operation

Compliance with industry safety and quality standards

Compatibility

Compatible with a wide range of voltage supplies and I/O interfaces

Application Areas

Industrial automation

Consumer electronics

Telecommunications

Automotive applications

Internet of Things (IoT)

Product Lifecycle

Active status with long-term availability

Not nearing discontinuation with support for upgrades and replacements

Several Key Reasons to Choose This Product

Highly customizable FPGA capabilities

Strong balance of power, performance, and cost

Large number of I/O and logic cells for complex designs

Suitable for harsh industrial environments with extended temperature range

Ease of integration with existing industry frameworks

Lattice Semiconductor’s reputation for reliable and innovative FPGA products

Frequently Asked Questions(FAQ)

How does the LCMXO2-4000HC-6FTG256C compare to other MachXO2 variants in terms of logic capacity and I/O count for mid-scale embedded applications?: The LCMXO2-4000HC-6FTG256C offers 4,320 logic elements and 206 I/Os within the MachXO2 series, positioning it between lower-density devices like the LCMXO2-7000HE (9,600 LEs) and higher-end models such as the LCMXO2-12000HE (14,400 LEs). This balance makes it suitable for applications requiring moderate reconfigurable logic with substantial connectivity, such as protocol bridging or small control systems. When compared to the non-HC version (e.g., LCMXO2-4000HE), the HC variant typically delivers lower power consumption at similar performance levels, though with slightly reduced maximum operating frequencies—making it ideal for cost-sensitive designs where thermal constraints are manageable.

What is the significance of the 256-FTBGA package on the LCMXO2-4000HC-6FTG256C, and how does it affect PCB layout and routing complexity?: The 256-pin Fine-pitch Ball Grid Array (FTBGA) package measures 17x17 mm, enabling high pin density while maintaining manageable pitch for manual assembly. However, this packaging demands careful attention during PCB design due to the fine 0.8 mm ball pitch, which increases routing congestion, especially when utilizing all 206 I/Os. Designers must allocate sufficient layer count and maintain strict impedance control for high-speed signals. Additionally, thermal management becomes critical given the dense placement; the package’s exposed die attach pad aids heat dissipation but requires proper solder joint inspection to avoid voids or delamination.

Can the LCMXO2-4000HC-6FTG256C operate reliably across industrial temperature ranges, and what design precautions are necessary for 0°C to 85°C operation?: Yes, the LCMXO2-4000HC-6FTG256C is specified for commercial temperature operation from 0°C to 85°C junction temperature. While this range supports most embedded applications, designers should ensure stable power supply regulation under cold-start conditions, as input capacitance charging can cause transient voltage dips. Decoupling capacitors near each VCCIO and core power rail are essential to maintain noise margins. Also, clock tree stability must be verified at elevated temperatures, as oscillator drift may exceed datasheet tolerances, potentially affecting timing-critical functions.

How much on-chip RAM does the LCMXO2-4000HC-6FTG256C provide, and how should it be utilized in a typical system design?: With 94,208 total RAM bits, the LCMXO2-4000HC-6FTG256C provides approximately 11.7 KB of distributed memory, configurable as block RAM or lookup tables. This is sufficient for buffering data streams up to several kilobytes or implementing lightweight FIFOs and state machines without external SRAM. For example, a UART with DMA-like buffering could store up to 1,024 bytes efficiently using this resource. However, large frame buffers or deep logging require external SDRAM or Flash, so memory allocation should be planned early in the HDL development phase to avoid inefficient LUT-based implementations.

What are the key differences between using the LCMXO2-4000HC-6FTG256C versus an ASIC or CPLD for low-power embedded signal processing?: Compared to ASICs, the LCMXO2-4000HC-6FTG256C offers faster time-to-market and reprogrammability but consumes more power and has higher unit cost. In contrast to larger CPLDs like the Lattice XP2 family, this device provides significantly greater logic capacity and dedicated routing resources, enabling more complex sequential logic and parallel processing tasks. For low-power applications such as sensor aggregation, the MachXO2’s sleep mode and dynamic current scaling make it competitive with CPLDs, while still supporting stateful algorithms that exceed typical CPLD capabilities. Trade-offs include increased configuration overhead and longer startup times versus fixed-function alternatives.

Is the LCMXO2-4000HC-6FTG256C suitable for automotive-grade applications, and what modifications would be needed?: No, the LCMXO2-4000HC-6FTG256C is rated only for industrial or commercial environments (0°C to 85°C), not automotive AEC-Q100 qualification. Attempting use in automotive systems risks premature failure due to vibration, humidity, or thermal cycling beyond its Moisture Sensitivity Level 3 (168-hour floor life). If automotive compliance is required, designers must select a qualified FPGA or consider external hardening techniques such as conformal coating, shock mounting, and redundant error detection—though these add cost and complexity without guaranteeing safety integrity.

How does the power supply sequencing requirement affect board-level integration of the LCMXO2-4000HC-6FTG256C?: The LCMXO2-4000HC-6FTG256C requires strict power-up sequencing: core voltage (VCC) must rise before I/O voltages (VCCIO) to prevent latch-up conditions. Voltages should ramp within 10 ms of each other, with no significant overshoot beyond ±5% of nominal values. Failure to comply can result in permanent damage, particularly during hot-swapping scenarios. Designers should implement soft-start regulators and monitor rails via supervisory circuits if using multiple PMICs. Additionally, decoupling networks must be placed close to package pins to suppress transient currents during configuration and switching activity.

What tools and software ecosystem support development for the LCMXO2-4000HC-6FTG256C, and how do they impact design efficiency?: The LCMXO2-4000HC-6FTG256C is supported by Lattice Diamond or Radiant IDEs, which include synthesis, place-and-route, timing analysis, and bitstream generation. These tools integrate well with industry-standard HDLs like Verilog and VHDL and offer IP cores for common interfaces such as SPI, I²C, and GPIO expanders. However, achieving optimal timing closure may require manual constraint tuning due to limited DSP blocks compared to higher-end FPGAs. Simulation is best performed using third-party tools like ModelSim or Questa, as Lattice’s built-in simulators lack full behavioral coverage. Overall, the toolchain enables rapid prototyping but demands experienced users for complex designs exceeding 3,000 logic elements.

How many logic array blocks (LABs) does the LCMXO2-4000HC-6FTG256C contain, and how are they allocated in practical designs?: The device contains 540 LABs, each composed of 8 logic cells, totaling 4,320 logic elements as advertised. In real-world usage, LAB utilization depends heavily on architecture—for instance, a finite state machine with registered outputs will consume fewer LABs than a pipelined FIR filter. Typically, 70–80% of LABs remain available after placing glue logic, allowing room for future enhancements. Designers should avoid over-constraining LAB boundaries in synthesis scripts to preserve flexibility during optimization passes.

What configuration method does the LCMXO2-4000HC-6FTG256C support, and what are the implications for system security and reliability?: The LCMXO2-4000HC-6FTG256C supports in-system programming (ISP) via JTAG or flash-based configuration from an external SPI Flash device. This allows field updates but introduces potential attack vectors if unencrypted bitstreams are used. Without AES encryption, malicious firmware injection is possible. Therefore, sensitive applications should enable built-in cryptographic verification or use secure boot mechanisms provided by newer MachXO2 revisions. Reliability-wise, repeated configuration cycles can degrade the external Flash over time, so wear leveling and backup images are recommended for mission-critical systems.

How does the LCMXO2-4000HC-6FTG256C handle clock distribution, and what limitations exist compared to higher-performance FPGAs?: The device includes internal Phase-Locked Loops (PLLs) capable of generating up to four output clocks from a single reference input, useful for DDR memory interfaces or multiple domain synchronization. However, unlike high-end FPGAs with global clock networks and dedicated delay lines, the MachXO2 relies on regional routing for clock distribution, leading to longer skew and reduced jitter performance at frequencies above 100 MHz. For precise timing requirements, designers must carefully route clocks and apply length matching, or offload high-speed serial functions to external PHYs.

What is the impact of the LCMXO2-4000HC-6FTG256C’s voltage tolerance range on mixed-voltage system design?: Operating between 2.375V and 3.465V allows compatibility with both 3.3V and lower 2.5V/2.31V logic families, facilitating coexistence with microcontrollers and sensors operating at different rails. Each of the 206 I/Os can independently support LVCMOS standards from 1.2V to 3.6V, enabling bidirectional translation without external level shifters. However, simultaneous switching noise (SSN) increases with wider voltage swings, necessitating careful return path planning and ground stitching on the PCB to maintain signal integrity across multiple voltage domains.

Why might a designer choose the LCMXO2-4000HC-6FTG256C over an MCU with programmable logic, and vice versa?: The LCMXO2-4000HC-6FTG256C excels when parallelism, custom timing control, or hardware acceleration is required—such as in real-time protocol conversion or digital filtering—where an MCU would incur software latency. Conversely, MCUs are preferable for simple control loops, ADC interfacing, or standalone task execution due to lower power and smaller footprint. The choice hinges on whether deterministic response or computational throughput dominates system requirements. In hybrid architectures, the FPGA often handles peripheral management while the MCU runs application code, leveraging each device’s strengths.

How does the Moisture Sensitivity Level 3 classification affect storage and handling of the LCMXO2-4000HC-6FTG256C prior to assembly?: As an MSL 3 component, the LCMXO2-4000HC-6FTG256C must be stored in dry ambient conditions (below 60% RH) and cannot exceed 168 hours outside controlled packaging before soldering. After opening, it must either be baked or assembled within that window to prevent moisture-induced cracking during reflow. Facilities lacking dry cabinets risk void returns or catastrophic failures. Proper labeling, FIFO rotation, and humidity monitoring are standard practices to comply with IPC/JEDEC standards and avoid reliability issues in production.

What are the typical current consumption characteristics of the LCMXO2-4000HC-6FTG256C during active, idle, and sleep modes?: At 3.3V supply and 25°C, the LCMXO2-4000HC-6FTG256C typically draws 15–30 mA in active mode depending on switching activity, drops to ~5 mA in standby, and can enter ultra-low-power sleep mode consuming less than 1 µA. Dynamic current scales quadratically with frequency and linearly with voltage squared, so lowering VCC reduces power significantly. For battery-powered edge devices, leveraging sleep states and clock gating yields substantial energy savings—critical for IoT endpoints requiring months of operation on a coin cell.

How does the ECCN classification (3A991D) influence export controls when sourcing the LCMXO2-4000HC-6FTG256C internationally?: The ECCN 3A991D indicates the LCMXO2-4000HC-6FTG256C falls under “unspecified electronics” with potential military or high-reliability applications, triggering U.S. export restrictions under EAR. Exporting to embargoed regions may require a license, even for commercial end-use. While most consumer electronics designs qualify for License Exception ENC (Encryption Commodities), verification of final application is mandatory. Importers should confirm local regulations align with U.S. definitions to avoid customs delays or legal exposure.

What role does the Base Product Number (LCMXO2-4000) play in selecting between different packages and speed grades?: The Base Product Number LCMXO2-4000 encompasses all variants of the 4,000 logic element family, including HC (high-capability), HE (high-efficiency), and others, differentiated by package type, temperature grade, and performance binning. Choosing the LCMXO2-4000HC-6FTG256C implies a 6th-speed bin part in a 256-ball TFBGA package optimized for speed and moderate power. Misinterpreting the base number could lead to ordering the wrong speed grade or incompatible footprint, so always verify complete part number suffixes against procurement lists and datasheet tables.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-4000HC-6FTG256C

Product Attribute
Part Number	LCMXO2-4000HC-6BG256C	LCMXO2-4000HC-6BG256I	LCMXO2-4000HC-6BG332C	LCMXO2-4000HC-6FG484C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Total RAM Bits	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of I/O	-	-	-	-
Series	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Supply	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-

LCMXO2-4000HC-6FTG256C Datasheet PDF

Download LCMXO2-4000HC-6FTG256C pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-4000HC-6FTG256C - Lattice Semiconductor Corporation.

Datasheets: MachXO2 Family Datasheet.pdf MachXO2 Family Handbook.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin: Alternate Assembly/Test Site 14/Apr/2014.pdf
PCN Design/Specification: Datasheet Chg 21/Mar/2016.pdf MachXO2 Family Datasheet 30/Sep/2013.pdf
PCN Other: I2C Read-Back Failure Feb/2015.pdf
Getting Started Guide: Product Selector Guide.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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