Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LFX1200EC-04F900C~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

LFX1200EC-04F900C - Lattice Semiconductor Corporation

Manufacturer Part Number: LFX1200EC-04F900C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 98D-LFX1200EC-04F900C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 13,133 pcs available, New & Original

Parts Description: IC FPGA 496 I/O 900FBGA

Package: 900-FPBGA (31x31)

Data sheet: LFX1200EC-04F90.pdf

Datasheets
Cylindrical Battery Holders.pdf

RoHs Status

~~Compare~~

Our certification

In stock: 13133

Specifications

LFX1200EC-04F900C Tech Specifications
Lattice Semiconductor Corporation - LFX1200EC-04F900C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX1200EC-04F900C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	1.65V ~ 1.95V
Total RAM Bits	423936
Supplier Device Package	900-FPBGA (31x31)
Series	ispXPGA®
Package / Case	900-BBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	15376
Number of I/O	496
Number of Gates	1250000
Mounting Type	Surface Mount
Base Product Number	LFX1200

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the LFX1200EC-04F900C support high-density I/O requirements in embedded FPGA applications?: The LFX1200EC-04F900C provides 496 user I/Os in a 900-FPBGA package, enabling dense signal routing for complex system-on-module or backplane interfacing. With a 31x31 mm footprint and ball pitch optimized for high-speed PCB design, it supports simultaneous implementation of multiple peripheral protocols such as LVDS, LVCMOS, and HSTL without requiring external level shifters, reducing board complexity in multi-voltage environments.

What are the power supply and thermal considerations when designing with the LFX1200EC-04F900C?: The LFX1200EC-04F900C operates within a 1.65V to 1.95V core voltage range, requiring careful power sequencing and low-noise regulation to maintain timing integrity. Given its 900-ball BGA and 1250k gate capacity, dynamic power can exceed 3W under full utilization at 100 MHz, necessitating thermal vias, copper pours, and possibly a heatsink when operating near the 85°C junction limit in enclosed systems.

Can the LFX1200EC-04F900C be used in battery-powered or low-power embedded systems?: While the LFX1200EC-04F900C is not optimized for ultra-low-power applications, its ispXPGA® architecture includes power-saving features such as clock gating and I/O standby modes. In typical configurations with reduced logic utilization and lower clock frequencies, static power can be kept below 300 mW, making it feasible for intermittent-operation embedded systems where logic density outweighs continuous power constraints.

How does the 423936-bit block RAM in the LFX1200EC-04F900C compare to similar mid-range FPGAs in terms of memory granularity and usage efficiency?: The LFX1200EC-04F900C integrates 423936 bits of embedded block RAM, organized in distributed 18-kbit blocks that support true dual-port operation and configurable widths up to 36 bits. This granularity allows efficient implementation of FIFOs, lookup tables, and small buffers without fragmenting logic resources—offering better memory-to-logic ratio than some competing SRAM-based FPGAs in the same gate count class, especially for data-path intensive designs.

What design challenges arise from the 900-FPBGA package of the LFX1200EC-04F900C during PCB layout and assembly?: The 900-FPBGA (31x31 mm) package demands strict adherence to high-density interconnect (HDI) design rules, including microvias and controlled impedance routing for high-speed I/Os. With an MSL rating of 3 (168 hours), moisture absorption must be managed through proper bake-out procedures before reflow. Signal integrity for 496 I/Os requires careful escape routing, ground shielding, and decoupling network design to mitigate crosstalk and power bounce.

Is the LFX1200EC-04F900C suitable for industrial temperature environments, and what derating applies?: The LFX1200EC-04F900C is rated for operation from 0°C to 85°C junction temperature, making it appropriate for commercial and light industrial applications. However, performance margins—particularly in timing closure and I/O slew rates—should be derated at elevated temperatures. For sustained operation above 70°C, reduced clock frequencies and increased timing slack are recommended to ensure reliability over the device’s lifecycle.

How does the logic capacity of the LFX1200EC-04F900C compare to other FPGAs in the ispXPGA® series for mid-complexity control logic applications?: With 15,376 logic elements and 1.25 million system gates, the LFX1200EC-04F900C sits between the LFX600 and LFX2000 variants in the ispXPGA® family. It offers sufficient resources for implementing multiple state machines, interface bridges, and moderate DSP functions, while consuming less board area and power than the LFX2000—making it a balanced choice for applications requiring more than basic glue logic but less than full DSP acceleration.

What are the implications of the LFX1200EC-04F900C being RoHS non-compliant for global product deployment?: The RoHS non-compliant status of the LFX1200EC-04F900C means it contains restricted substances above current EU thresholds, limiting its use in consumer electronics or products requiring full RoHS certification. However, it remains acceptable in industrial, aerospace, or legacy system replacements where exemptions apply. Designers must verify regional regulations and consider lifecycle support when selecting this device for long-term programs.

Can the LFX1200EC-04F900C support in-system reprogramming, and what tools are required?: Yes, the LFX1200EC-04F900C supports in-system programming via its IEEE 1532-compliant JTAG interface, enabling field updates without removing the device. Configuration is typically managed through Lattice’s ispVM™ system or third-party programmers compatible with the ispXPGA® architecture. Flash-based configuration storage is external, so a non-volatile memory device must be included in the design for autonomous boot-up.

How does the I/O flexibility of the LFX1200EC-04F900C benefit mixed-signal system integration?: The 496 I/Os on the LFX1200EC-04F900C support a wide range of I/O standards including LVDS, SSTL, and HSTL, with programmable drive strength and termination. This allows direct interfacing with ADCs, DACs, memory devices, and communication transceivers without additional PHY chips. The ability to configure I/O banks independently for different voltage levels (within the 1.65–1.95V core constraint) simplifies mixed-voltage subsystem integration in embedded platforms.

What verification and validation practices are recommended when first prototyping with the LFX1200EC-04F900C?: Early prototypes of the LFX1200EC-04F900C should undergo power-on reset validation, JTAG chain verification, and I/O loopback testing to confirm signal integrity. Thermal imaging under load helps identify hotspots, while static timing analysis must account for worst-case process and temperature conditions. Given the complexity of the 900-ball package, X-ray inspection post-assembly is advised to detect solder bridging or voids.

How does the LFX1200EC-04F900C handle clock distribution and skew management in high-speed designs?: The LFX1200EC-04F900C includes dedicated global and regional clock networks with low-skew routing trees, supporting up to 8 global clocks. For multi-clock domain designs, phase alignment and jitter performance depend on proper PLL configuration and balanced clock loading. When operating I/Os above 200 Mbps, source-synchronous clocking and DLL-based deskew should be used to maintain data-eye margins.

What are the long-term availability and lifecycle risks associated with the LFX1200EC-04F900C?: As a member of the ispXPGA® series, the LFX1200EC-04F900C is supported under Lattice’s long-term product availability program, but being RoHS non-compliant may affect future market accessibility. Designers in regulated industries should secure lifetime buys or qualify second-source alternatives early, especially if the product is intended for deployment beyond 2030.

How does the LFX1200EC-04F900C compare to flash-based FPGAs in terms of configuration security and boot time?: Unlike flash-based FPGAs, the LFX1200EC-04F900C requires external configuration memory, which introduces a brief boot delay and potential vulnerability to configuration tampering during power-up. However, this allows for secure encrypted bitstream loading if paired with a trusted boot module. The trade-off is increased BOM complexity versus the instant-on and inherent security of monolithic flash FPGAs.

What design-for-test (DFT) features are available in the LFX1200EC-04F900C to support manufacturing validation?: The LFX1200EC-04F900C supports boundary scan (IEEE 1149.1) for I/O continuity testing and includes internal logic observability through JTAG-accessible test modes. While it lacks built-in BIST for memory or logic, designers can implement soft-core test controllers to validate RAM blocks and critical paths during production test, reducing reliance on external ATE equipment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX1200EC-04F900C

Product Attribute
Part Number	LFX1200EB-04F900C	LFX1200EC-03F900C	LFX1200EB-05F900C	LFX1200EC-03F900I
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Series	-	-	-	-
Voltage - Supply	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Gates	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Total RAM Bits	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Logic Elements/Cells	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of I/O	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

LFX1200EC-04F900C Datasheet PDF

Download LFX1200EC-04F900C pdf datasheets and Lattice Semiconductor Corporation documentation for LFX1200EC-04F900C - Lattice Semiconductor Corporation.

Datasheets: Cylindrical Battery Holders.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA