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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)LFX125EB-03F256C
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LFX125EB-03F256C - Lattice Semiconductor Corporation

Manufacturer Part Number
LFX125EB-03F256C
Manufacturer
Lattice Semiconductor
Allelco Part Number
32D-LFX125EB-03F256C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,330 pcs available, New & Original
Parts Description
IC FPGA 160 I/O 256FBGA
Package
256-FPBGA (17x17)
Data sheet
LFX125EB-03F256.pdf
RoHs Status
 
Our certification
In stock: 9330

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Specifications

LFX125EB-03F256C Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-03F256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-03F256C

Product Attribute Attribute Value
Manufacturer Lattice Semiconductor
Voltage - Supply 2.3V ~ 3.6V
Total RAM Bits 94208
Supplier Device Package 256-FPBGA (17x17)
Series ispXPGA®
Package / Case 256-BGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 1936
Number of I/O 160
Number of Gates 139000
Mounting Type Surface Mount
Base Product Number LFX125

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

LFX125EB-03F256C Image
LFX125EB-03F256C (1)

Manufacturer Part Number

LFX125EB-03F256C

Manufacturer

Lattice Semiconductor

Introduction

The LFX125EB-03F256C is an embedded FPGA from Lattice Semiconductor's ispXPGA series, designed for a variety of electronic applications.

Product Features and Performance

1936 Logic Elements/Cells

94208 Total RAM Bits

160 I/O Pins

139000 Gates

Programmable logic device

Can implement complex logic functions

Flexible I/O standards

Product Advantages

Offers a balance between high performance and low power consumption

Provides ample logic resources for intermediate complexity designs

Supports a wide range of supply voltages (2.3V to 3.6V)

Key Technical Parameters

Number of Logic Elements/Cells: 1936

Total RAM Bits: 94208

Number of I/O: 160

Number of Gates: 139000

Voltage - Supply: 2.3V ~ 3.6V

Operating Temperature Range: 0°C ~ 85°C

Quality and Safety Features

Surface mount 256-FPBGA (17x17) packaging for reliable soldering and assembly

Stringent quality control measures by Lattice Semiconductor

Compatibility

Support for multiple I/O standards allows for flexibility in interfacing with other components

Application Areas

Custom logic circuits

Consumer electronics

Industrial automation

Telecommunications

Automotive applications

Product Lifecycle

Obsolete - the product may no longer be produced or supported

Potential for limited stock availability

Replacements or upgrades should be considered from current Lattice Semiconductor offerings

Several Key Reasons to Choose This Product

Customizable for specific application requirements

Wide supply voltage range supports diverse electronic products

Ample I/O and logic resources for a variety of tasks

Surface mount package suitable for modern PCB assembly processes

Manufacturer reputation for quality and reliability in the semiconductor industry

Frequently Asked Questions(FAQ)

How does the LFX125EB-03F256C compare to other FPGAs in terms of logic density and power efficiency for mid-range embedded applications?
The LFX125EB-03F256C offers 1936 logic elements and supports a supply voltage range of 2.3V to 3.6V, which provides moderate logic density suitable for non-intensive control tasks. While its 139,000 equivalent gate count is lower than high-end FPGAs, it balances performance with power consumption better than many larger devices, making it appropriate for cost-sensitive designs where thermal management isn't critical.
What are the key limitations when selecting the LFX125EB-03F256C for industrial temperature applications requiring long-term reliability?
Although the LFX125EB-03F256C operates over an extended commercial temperature range of 0°C to 85°C, its RoHS non-compliant status raises concerns about lead content and long-term environmental stability. For mission-critical or regulated industrial systems, this may necessitate additional screening or alternative components with full compliance.
Can the LFX125EB-03F256C support high-speed I/O interfaces such as LVDS or SERDES without external transceivers?
With 160 general-purpose I/O pins available, the LFX125EB-03F256C can implement LVDS signaling through internal routing and configuration, but it lacks native SERDES blocks found in higher-performance FPGA families. This limits native high-speed serial communication rates compared to devices designed for such interfaces.
How does the memory capacity of the LFX125EB-03F256C impact state machine complexity in real-time control algorithms?
The device provides 94,208 total RAM bits, sufficient for implementing moderate-complexity finite state machines or small lookup tables. For advanced control logic requiring extensive memory buffering or large coefficient storage, designers may need to optimize algorithm structure or consider larger FPGA alternatives.
What design considerations arise from using the LFX125EB-03F256C in compact form factor PCB layouts?
The 256-pin FPBGA package measures 17x17 mm, demanding precise land pattern design and controlled impedance routing. Its fine pitch increases risk of solder bridging and requires careful assembly process control, especially in high-volume manufacturing environments.
Is the LFX125EB-03F256C suitable for battery-powered embedded systems due to its power characteristics?
While operating at 2.3V to 3.6V allows compatibility with common low-voltage systems, the lack of detailed power consumption data in public sources makes accurate estimation difficult. Without specific dynamic current figures, integration into ultra-low-power designs remains speculative without prototype validation.
How does the LFX125EB-03F256C compare to newer CPLD architectures in terms of programmability and reconfiguration flexibility?
Unlike CPLDs that offer fixed logic block structures, the LFX125EB-03F256C provides true FPGA-level reconfigurability with programmable interconnect, enabling more complex algorithmic implementation. However, its smaller scale means it cannot match the deterministic timing of optimized CPLD solutions for simple glue logic tasks.
What verification challenges might engineers face when integrating the LFX125EB-03F256C into safety-certified systems?
Due to limited documentation transparency and absence of formal safety certifications, validating functional behavior under fault conditions requires extensive test coverage. The device's age and discontinued RoHS status further complicate qualification for ISO 26262 or IEC 61508 applications without third-party assessment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-03F256C

Product Attribute LFX125EB-03FN256C LFX125EB-04F256C LFX125EB-05F256C LFX125EB-03FN256I
Part Number LFX125EB-03FN256C LFX125EB-04F256C LFX125EB-05F256C LFX125EB-03FN256I
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Gates - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Total RAM Bits - - - -
Number of Logic Elements/Cells - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Supply - - - -

LFX125EB-03F256C Datasheet PDF

Download LFX125EB-03F256C pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-03F256C - Lattice Semiconductor Corporation.

Datasheets
LFX-ispXPGA Family.pdf
PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Manufacturer Information
Product Transfer 10/Mar/2016.pdf
PCN Obsolescence/ EOL
Tin/Lead Devices 23/Jun/2015.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Brazil 7
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United Kingdom 4
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New Zealand 5
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DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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LFX125EB-03F256C Image

LFX125EB-03F256C

Lattice Semiconductor Corporation
32D-LFX125EB-03F256C

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