About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)LFX125EB-03F256I
LFX125EB-03F256I Image
LFX125EB-03F256I Image - 1
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

LFX125EB-03F256I - Lattice Semiconductor Corporation

Manufacturer Part Number
LFX125EB-03F256I
Manufacturer
Lattice Semiconductor
Allelco Part Number
98D-LFX125EB-03F256I
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
12,352 pcs available, New & Original
Parts Description
IC FPGA 160 I/O 256FBGA
Package
256-FPBGA (17x17)
Data sheet
LFX125EB-03F256.pdf
RoHs Status
 
Compare
Our certification
In stock: 12352

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

LFX125EB-03F256I Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-03F256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-03F256I

Product Attribute Attribute Value
Manufacturer Lattice Semiconductor
Voltage - Supply 2.3V ~ 3.6V
Total RAM Bits 94208
Supplier Device Package 256-FPBGA (17x17)
Series ispXPGA®
Package / Case 256-BGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C (TJ)
Number of Logic Elements/Cells 1936
Number of I/O 160
Number of Gates 139000
Mounting Type Surface Mount
Base Product Number LFX125

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the LFX125EB-03F256I compare to other ispXPGA® FPGAs in terms of logic density and power consumption for mid-range embedded applications?
The LFX125EB-03F256I offers 19,36 logic elements and 94,208 total RAM bits, positioning it between lower-density devices like the LFXP2-5E-5FTN256I and higher-end models. With a supply voltage range of 2.3V to 3.6V and a maximum junction temperature of 105°C, it balances moderate logic capacity with efficient power performance for industrial control and communication bridge applications where thermal constraints are moderate but power budgets must be respected.
What are the key trade-offs when selecting the LFX125EB-03F256I for a surface-mount design requiring high I/O count and moderate gate complexity?
Choosing the LFX125EB-03F256I provides 160 configurable I/O pins within a compact 256-FPBGA package (17x17), enabling dense board layouts. However, its 139,000 equivalent gates and 19,36 logic elements may limit scalability for designs approaching complex state machines or large memory controllers. Engineers must evaluate whether the available routing resources and block RAM distribution support their specific timing closure requirements without overutilizing the architecture.
Can the LFX125EB-03F256I reliably operate in harsh environments, and what design precautions should be taken given its temperature rating?
The LFX125EB-03F256I supports operation from -40°C to 105°C (TJ), making it suitable for extended automotive and industrial environments. However, achieving full reliability at the upper end requires careful PCB layout to manage thermal gradients, proper decoupling near the BGA package, and adherence to signal integrity practices due to the fine-pitch 17x17 ball grid array geometry.
How does the LFX125EB-03F256I’s Moisture Sensitivity Level (MSL) of 3 impact manufacturing and storage procedures?
As an MSL 3 component with a floor life of 168 hours, the LFX125EB-03F256I must be stored in dry conditions and baked before reflow if exposed to ambient humidity beyond this window. This aligns with standard JEDEC J-STD-033 handling guidelines and ensures solder joint reliability during wave or reflow soldering processes common in high-volume production.
Is the LFX125EB-03F256I compatible with modern development toolchains, and what limitations exist due to its non-RoHS status?
While the LFX125EB-03F256I can still be programmed using Lattice Diamond or Radiant software, its RoHS non-compliance restricts use in EU-regulated consumer electronics. Designers targeting global markets must verify regional compliance early, as substitution with newer RoHS-compliant parts like the LFXP2-5E-5FTN256I may require RTL adjustments or pin compatibility checks.
What are the typical use cases where the LFX125EB-03F256I delivers optimal value compared to ASIC or CPLD alternatives?
The LFX125EB-03F256I excels in prototyping, protocol bridging, and small-scale reconfigurable logic tasks where time-to-market outweighs ultra-low power needs. Its combination of 160 I/Os, moderate logic capacity, and BGA packaging makes it ideal for upgrading legacy systems without redesigning entire PCBs—particularly in aerospace, defense, or custom instrumentation where long-term availability matters more than cutting-edge efficiency.
How do the internal architecture features of the LFX125EB-03F256I influence timing closure in synchronous digital designs?
With 94,208 RAM bits distributed across configurable blocks and 19,36 logic elements organized in a structured fabric, the LFX125EB-03F256I allows flexible implementation of shift registers, FIFO buffers, or state machines. However, designers must account for routing delays inherent in the ispXPGA® architecture, especially in designs exceeding 50 MHz, where careful placement and pipelining become critical to meeting setup/hold margins.
What considerations apply when substituting the LFX125EB-03F256I with alternative models like the LFXP2-5E-5FTN256I in existing designs?
Although both share the same 256-ball BGA footprint and base part number family, differences in logic element count, routing topology, and I/O bank voltages may affect timing, power, and pinout compatibility. A full synthesis and place-and-route comparison is recommended before substitution, particularly if the new part targets improved power-performance metrics or enhanced ESD protection levels absent in the original selection.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-03F256I

Product Attribute LFX125EB-03FN256I LFX125EB-03FN256C LFX125EB-03F256C LFX125EB-04F256I
Part Number LFX125EB-03FN256I LFX125EB-03FN256C LFX125EB-03F256C LFX125EB-04F256I
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Logic Elements/Cells - - - -
Number of I/O - - - -
Voltage - Supply - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Total RAM Bits - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Gates - - - -
Series - - - -

LFX125EB-03F256I Datasheet PDF

Download LFX125EB-03F256I pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-03F256I - Lattice Semiconductor Corporation.

Datasheets
Cylindrical Battery Holders.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
LFX125EB-03F256I Image

LFX125EB-03F256I

Lattice Semiconductor Corporation
98D-LFX125EB-03F256I

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB