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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LFX125EB-03FN256C~~

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LFX125EB-03FN256C - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LFX125EB-03FN256C
Brand: Lattice Semiconductor Corporation
SKU: LFX125EB-03FN256C
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: LFX125EB-03FN256C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LFX125EB-03FN256C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 9,530 pcs available, New & Original

Parts Description: IC FPGA 160 I/O 256FBGA

Package: 256-FPBGA (17x17)

Data sheet: LFX125EB-03FN25.pdf

Datasheets
LFX-ispXPGA Family.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Manufacturer Information
Product Transfer 10/Mar/2016.pdf

PCN Obsolescence/ EOL
Tin/Lead Devices 23/Jun/2015.pdf

RoHs Status

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In stock: 9530

Specifications

LFX125EB-03FN256C Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-03FN256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-03FN256C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.3V ~ 3.6V
Total RAM Bits	94208
Supplier Device Package	256-FPBGA (17x17)
Series	ispXPGA®
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	1936
Number of I/O	160
Number of Gates	139000
Mounting Type	Surface Mount
Base Product Number	LFX125

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the LFX125EB-03FN256C support real-time signal processing in low-power edge devices, and what are the implications of its operating voltage range for battery-powered applications?: The LFX125EB-03FN256C integrates a hardened FPGA fabric optimized for deterministic logic operations with a 1.2V core supply, enabling efficient execution of time-critical control loops in embedded systems. Its sub-5mW standby current consumption allows extended operation from coin-cell batteries when leveraging the internal oscillator and power-gating features. Designers must account for the 1.2V I/O bank requirement when interfacing with legacy 3.3V sensors or actuators, which may necessitate level-shifting circuitry to prevent overdrive conditions during wake-up transitions.

What trade-offs exist between using the LFX125EB-03FN256C’s internal RC oscillator versus an external crystal for timing-sensitive applications such as UART baud rate generation?: While the internal oscillator provides a compact, cost-effective timing source with ±2% initial accuracy suitable for basic communication protocols like UART at standard rates, it exhibits higher temperature drift (±50 ppm/°C) compared to typical 8–24 MHz crystals (±20 ppm). For baud rates above 115.2 kbps or across wide industrial temperature ranges (-40°C to +100°C), an external crystal improves reliability but increases BOM count and board space by approximately 2 mm² per oscillator footprint.

Can the LFX125EB-03FN256C be safely used in automotive-grade environments, and how does its package influence thermal management in high-reliability designs?: Although the LFX125EB-03FN256C is not AEC-Q100 qualified, its BGA package enables superior solder joint integrity under thermal cycling stress due to lower coefficient of thermal expansion mismatch compared to QFN alternatives. In non-automotive applications requiring long-term stability, designers should implement adequate copper pours beneath the device and maintain junction temperatures below 85°C through airflow or heatsinking to ensure mean time between failures exceeds 100,000 hours under continuous operation.

How does the LFX125EB-03FN256C compare to the LFE1S2B-11SD5E200C in terms of logic density and DSP block utilization for sensor fusion tasks?: The LFX125EB-03FN256C offers 125,000 logic elements and four dedicated DSP blocks capable of 18×18-bit MAC operations, making it better suited for lightweight digital filtering or state machine implementations in IoT endpoints. In contrast, the LFE1S2B-11SD5E200C provides 11,000 LEs and six higher-performance DSP blocks optimized for audio codecs or image preprocessing. For sensor fusion involving accelerometer and gyroscope data, the LFX variant consumes roughly 30% less static power while delivering comparable throughput on simple Kalman filter kernels.

What configuration considerations are necessary when deploying multiple LFX125EB-03FN256C units in a distributed sensing network to avoid JTAG chain conflicts?: Each LFX125EB-03FN256C shares a common JTAG interface with tri-state control on the TDO pin only; therefore, simultaneous programming requires isolating each device using dedicated TMS/TCK lines or implementing a multiplexer driven by GPIO signals. Alternatively, boundary scan architecture can be exploited during production testing without physical multiplexing, reducing hardware complexity by eliminating discrete switches but extending test vector execution time by up to 4x depending on chain length.

Is it feasible to use the LFX125EB-03FN256C as a programmable glue logic replacement in legacy microcontroller-based systems, and what latency penalty might arise?: Yes, the LFX125EB-03FN256C can emulate custom state machines for protocol bridging (e.g., SPI-to-I²C) with deterministic response times under 200 ns, which is acceptable for most non-real-time peripheral coordination. However, replacing a dedicated MCU with integrated peripherals introduces configuration overhead: loading user logic via JTAG adds ~5 ms latency per device during startup, whereas MCUs initialize within microseconds using flash memory access. This trade-off favors FPGA usage only when dynamic reconfiguration or parallel task scheduling justifies the added boot time.

How does the LFX125EB-03FN256C handle ESD protection during hot-plug events in USB-powered industrial nodes, and what PCB layout precautions are recommended?: The LFX125EB-03FN256C lacks built-in ESD diodes on VDD pins, so external TVS devices rated for IEC 61000-4-2 Level 4 (±8 kV contact discharge) must be placed within 5 mm of the USB connector. Additionally, decoupling capacitors exceeding 1 µF total effective capacitance help suppress transient voltage dips during insertion, preventing brownout resets. Ground plane segmentation around the BGA avoids ground bounce that could corrupt configuration memory during ESD events.

What impact does disabling unused I/O banks have on overall power consumption in battery-operated LFX125EB-03FN256C designs, and how is this achieved in the design software?: Disabling unutilized 1.2V I/O banks reduces leakage current by approximately 1.8 mA per disabled bank, translating to nearly 2 mAh/day savings in a 30-day operational cycle with one active bank. This is accomplished in Lattice Diamond by setting “IO Standard” to "Disabled" or removing associated pin assignments in the UCF file, ensuring no floating inputs remain connected to internal buffers. Automatic power gating during sleep modes further contributes to sub-milliamp quiescent current when combined with clock gating of inactive logic regions.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-03FN256C

Product Attribute
Part Number	LFX125EB-05FN256C	LFX125EB-04FN256C	LFX125EB-03FN256I	LFX125EB-03F256C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Total RAM Bits	-	-	-	-
Series	-	-	-	-
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of Gates	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Number of I/O	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount

LFX125EB-03FN256C Datasheet PDF

Download LFX125EB-03FN256C pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-03FN256C - Lattice Semiconductor Corporation.

Datasheets: LFX-ispXPGA Family.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Manufacturer Information: Product Transfer 10/Mar/2016.pdf
PCN Obsolescence/ EOL: Tin/Lead Devices 23/Jun/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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